Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG987C: High-Performance Spartan-II FPGA for Advanced Digital Design

Product Details

Overview of XC2S200-6FGG987C FPGA Technology

The XC2S200-6FGG987C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s proven Spartan-II family, delivering exceptional performance for embedded systems, telecommunications, and industrial automation applications. This commercial-grade FPGA combines 200,000 system gates with advanced programmable logic capabilities, making it an ideal choice for engineers seeking cost-effective, high-density solutions.

As part of the renowned Xilinx FPGA portfolio, the XC2S200-6FGG987C represents a superior alternative to traditional mask-programmed ASICs, offering field-upgradeable functionality without hardware replacement requirements.

Key Specifications and Technical Features

Core Architecture Specifications

Specification Value
System Gates 200,000 gates
Logic Cells 5,292 cells
CLB Array Configuration 28 x 42 (1,176 total CLBs)
Maximum User I/O 284 pins
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Operating Voltage 2.5V
Speed Grade -6 (highest performance)
Process Technology 0.18μm CMOS
Operating Frequency Up to 263 MHz

Package and Environmental Details

Parameter Specification
Package Type Fine-pitch Ball Grid Array (FBGA)
Total Pins 987 balls
Temperature Range Commercial (0°C to +85°C)
RoHS Compliance Lead-free available (G suffix)
Pb-free Option Yes

Advanced FPGA Capabilities

Programmable Logic Resources

The XC2S200-6FGG987C delivers remarkable flexibility through its comprehensive logic resources:

  • 5,292 logic cells enable complex digital circuit implementation
  • 1,176 Configurable Logic Blocks (CLBs) arranged in optimized 28×42 array
  • Four Delay-Locked Loops (DLLs) for precise clock management
  • 284 user I/O pins supporting multiple interface standards
  • Dual-column Block RAM architecture for high-speed data buffering

Memory Architecture

Memory Type Capacity Application
Distributed RAM 75,264 bits Fast look-up tables, small buffers
Block RAM 56 Kbits Data buffering, FIFO, packet processing
Total On-Chip Memory 131,264 bits Combined storage resources

Applications and Use Cases

Telecommunications Equipment

The XC2S200 FPGA excels in communication systems requiring high-speed data processing, protocol implementation, and signal manipulation capabilities for network routers and transmission devices.

Industrial Automation and Control

Ideal for motor control systems, process automation, and machinery control applications where precise digital logic and real-time processing are critical requirements.

Digital Signal Processing

With 200,000 system gates and dedicated block RAM, this FPGA handles complex DSP algorithms for audio processing, image processing, and data acquisition systems.

Embedded Vision Systems

The combination of high logic density and embedded memory enables efficient image processing algorithms for robotics, surveillance, and medical imaging applications.

Design and Development Tools

Software Support

  • Vivado Design Suite – Modern development environment
  • ISE Design Tools – Legacy support for Spartan-II devices
  • IP Core Integration – Pre-verified intellectual property blocks
  • Simulation Tools – ModelSim, ISIM compatibility

Development Resources

Engineers working with the XC2S200-6FGG987C benefit from comprehensive development board options including ZedBoard, Basys 3, Nexys4-DDR, and Digilent Arty S7 platforms for rapid prototyping and validation.

Advantages Over Traditional ASICs

Cost-Effective Development

The XC2S200-6FGG987C eliminates expensive NRE (non-recurring engineering) costs associated with ASIC development, while avoiding lengthy fabrication cycles and inherent manufacturing risks.

Field Programmability

Unlike fixed ASICs, this FPGA supports in-field design upgrades and modifications without physical hardware replacement, reducing lifecycle costs and extending product longevity.

Rapid Time-to-Market

Programmable logic enables iterative design refinement and faster product deployment compared to traditional ASIC workflows.

Performance and Reliability Features

High-Speed Operation

The -6 speed grade designation ensures optimal performance under demanding operational conditions, supporting applications requiring maximum clock frequencies up to 263 MHz.

Robust I/O Capabilities

With 284 maximum user I/O pins, the XC2S200 provides extensive interfacing options for sensors, actuators, communication protocols, and peripheral devices.

Power Efficiency

The 2.5V core voltage and 0.18μm process technology deliver balanced performance-per-watt characteristics suitable for power-conscious embedded applications.

Ordering and Availability Information

Part Number Breakdown

XC2S200-6FGG987C decoding:

  • XC2S200 – Spartan-II family, 200K gates
  • 6 – Speed grade (highest performance)
  • FGG – Fine-pitch BGA, lead-free packaging
  • 987 – Pin count
  • C – Commercial temperature range

Package Options Comparison

Package Pin Count Dimensions I/O Available
FGG987 987 balls TBD 284 maximum
FGG456 456 balls 27x27mm 284 maximum
FG256 256 balls 17x17mm 176 maximum
PQG208 208 pins QFP 140 maximum

Technical Support and Documentation

Available Resources

Engineers can access comprehensive technical documentation including:

  • Complete datasheet specifications (DS001)
  • Application notes and design guides
  • Reference designs and IP cores
  • Pinout diagrams and PCB layout guidelines
  • Timing analysis and constraint files

Community and Support

The Spartan-II XC2S200 benefits from extensive community support through FPGA forums, developer networks, and official AMD Xilinx technical support channels.

Competitive Alternatives and Cross-References

Family Comparisons

Device System Gates Logic Cells Block RAM Max I/O
XC2S150 150,000 3,888 48K 260
XC2S200 200,000 5,292 56K 284
XC2S300E 300,000 6,912 72K 329

Upgrade Path

For designs requiring additional resources, consider the Spartan-IIE (XC2S300E) or Spartan-3 families offering enhanced capabilities while maintaining development tool compatibility.

Conclusion

The XC2S200-6FGG987C Spartan-II FPGA delivers an exceptional balance of logic density, I/O capability, and cost-effectiveness for modern digital design challenges. With 200,000 system gates, 5,292 logic cells, and comprehensive development tool support, this FPGA enables engineers to create sophisticated embedded systems, communication platforms, and industrial control solutions.

Whether developing high-speed data acquisition systems, wireless baseband processors, or automated control equipment, the XC2S200 provides the programmable logic resources and performance characteristics required for success in demanding applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.