Overview of XC2S200-6FGG986C FPGA
The XC2S200-6FGG986C is a premium field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family, delivering exceptional performance and versatility for modern digital applications. This powerful FPGA combines 5,292 logic cells with 200,000 system gates in a compact 986-ball fine-pitch BGA package, making it an ideal solution for cost-sensitive, high-volume applications requiring substantial processing capability.
Key Product Specifications
| Specification |
Value |
| Part Number |
XC2S200-6FGG986C |
| Manufacturer |
Xilinx (now AMD) |
| Product Family |
Spartan-II FPGA |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| Speed Grade |
-6 (Commercial) |
| Package Type |
FGG986 (986-ball Fine-pitch BGA) |
| Operating Voltage |
2.5V |
| Technology Node |
0.18μm |
| Temperature Range |
Commercial (0°C to +85°C) |
Technical Architecture and Features
Core Logic Resources
The XC2S200-6FGG986C features a robust configurable logic block (CLB) architecture that provides maximum design flexibility:
| Resource Type |
Quantity |
Description |
| CLB Array Configuration |
28 x 42 |
Rows × Columns arrangement |
| Total CLBs |
1,176 |
Configurable Logic Blocks |
| Maximum User I/O |
284 pins |
Not including global clock inputs |
| Distributed RAM |
75,264 bits |
On-chip memory distributed across CLBs |
| Block RAM |
56K bits |
Dedicated block memory resources |
| Delay-Locked Loops (DLLs) |
4 |
One at each corner for clock management |
Performance Characteristics
The -6 speed grade designation indicates this FPGA variant is optimized for high-speed operation, supporting system performance up to 200 MHz. This makes the XC2S200-6FGG986C suitable for demanding applications requiring rapid signal processing and data throughput.
Package Configuration: FGG986
What Makes FGG986 Special?
The FGG986 package (986-ball Fine-pitch Ball Grid Array) offers several advantages for professional PCB design:
- High I/O Density: 986 total balls provide extensive connectivity options
- Superior Thermal Performance: Enhanced heat dissipation for reliable operation
- Advanced Signal Integrity: Reduced inductance and improved power distribution
- Compact Footprint: Maximum functionality in minimal board space
- Industrial-Grade Reliability: Robust mechanical structure for demanding environments
Package Comparison
| Package Type |
Total Pins/Balls |
Available User I/O |
Board Space |
| PQG208 |
208 |
176 |
Medium |
| FGG256 |
256 |
176 |
Medium |
| FGG456 |
456 |
260 |
Large |
| FGG986 |
986 |
284 |
Extra Large |
Applications and Use Cases
Industrial Applications
The XC2S200-6FGG986C excels in various industrial and commercial applications:
- Digital Signal Processing (DSP): High-speed filtering, modulation, and signal analysis
- Communication Systems: Protocol handling, data routing, and interface bridging
- Motor Control: Advanced PWM generation and encoder processing
- Test and Measurement: High-speed data acquisition and real-time processing
- Embedded Systems: Custom peripheral controllers and co-processors
Advantages Over ASIC Solutions
| Criteria |
XC2S200-6FGG986C FPGA |
Traditional ASIC |
| Initial Cost |
Low (no NRE) |
High (significant NRE) |
| Development Time |
Weeks to months |
6-12 months minimum |
| Design Flexibility |
Reprogrammable in-field |
Fixed after fabrication |
| Risk |
Low (proven silicon) |
High (first silicon failure) |
| Time-to-Market |
Fast |
Slow |
| Volume Economics |
Cost-effective for medium volumes |
Only economical at very high volumes |
Design Resources and Development Support
Compatible Development Tools
The XC2S200-6FGG986C is fully supported by industry-standard FPGA development tools:
- Xilinx ISE Design Suite: Complete design environment
- Xilinx Vivado (legacy support): For migration and analysis
- Third-party synthesis tools: Synplify Pro, Precision RTL
- Simulation tools: ModelSim, Active-HDL, VCS
Memory Architecture
| Memory Type |
Capacity |
Application |
| Distributed RAM |
75,264 bits |
Small buffers, FIFOs, shift registers |
| Block RAM |
56K bits (7 KB) |
Larger data storage, lookup tables |
| Total On-chip Memory |
~82 Kbits |
Combined resources |
Power and Thermal Considerations
Operating Specifications
The XC2S200-6FGG986C operates at 2.5V core voltage with the following characteristics:
- Core Voltage (VCCINT): 2.5V ±5%
- I/O Voltage (VCCO): Multiple standards supported (1.5V to 3.3V)
- Power Consumption: Varies with design utilization and clock frequency
- Junction Temperature: 0°C to +85°C (Commercial grade)
Thermal Management Tips
For optimal performance and reliability:
- Ensure adequate PCB copper planes for heat spreading
- Consider heat sinks for high-utilization designs
- Monitor junction temperature in critical applications
- Implement proper power distribution network design
Why Choose XC2S200-6FGG986C?
Competitive Advantages
Proven Reliability: The Spartan-II family has established itself as a dependable platform for millions of deployed units worldwide.
Cost-Effective Performance: Delivers substantial processing power at a competitive price point, making it ideal for cost-sensitive applications.
Rich I/O Options: With 284 maximum user I/O pins, this device supports complex interfacing requirements across multiple protocols.
Comprehensive Support: Backed by extensive documentation, reference designs, and a large community of experienced developers.
Ordering Information and Nomenclature
Understanding the Part Number
XC2S200-6FGG986C breakdown:
- XC2S200: Device family and gate count (Spartan-II, 200K gates)
- -6: Speed grade (highest commercial speed)
- FGG986: Package type (986-ball Fine-pitch BGA)
- C: Commercial temperature range (0°C to +85°C)
Related Part Numbers
| Part Number |
Speed Grade |
Temp Range |
Package |
| XC2S200-5FGG986C |
-5 |
Commercial |
FGG986 |
| XC2S200-6FGG986C |
-6 |
Commercial |
FGG986 |
| XC2S200-6FGG986I |
-6 |
Industrial |
FGG986 |
Integration and Design Guidelines
PCB Design Recommendations
When integrating the XC2S200-6FGG986C into your design:
- Power Distribution: Use multiple decoupling capacitors (0.01µF and 0.1µF) close to power pins
- Ground Planes: Implement solid ground planes for signal integrity
- Impedance Control: Maintain 50-ohm controlled impedance for high-speed signals
- Via Design: Use appropriate via sizes and spacing for BGA escape routing
- Thermal Vias: Include thermal vias under the package for heat dissipation
Configuration and Programming
The XC2S200-6FGG986C supports multiple configuration modes:
| Configuration Mode |
Description |
Use Case |
| Master Serial |
FPGA controls configuration |
Stand-alone systems |
| Slave Serial |
External controller manages config |
Multi-FPGA systems |
| JTAG |
IEEE 1149.1 boundary scan |
Development and debug |
| SelectMAP |
Parallel configuration |
Fast configuration requirements |
For genuine XC2S200-6FGG986C devices and comprehensive Xilinx FPGA solutions, authorized distributors provide:
- Guaranteed authentic components
- Full manufacturer warranty coverage
- Technical support and design resources
- Competitive pricing for various order quantities
- Stock availability and lead time information
Conclusion: Optimal Choice for Demanding Applications
The XC2S200-6FGG986C represents an excellent balance of performance, flexibility, and cost-effectiveness for modern digital design projects. With its 5,292 logic cells, 200,000 system gates, and extensive I/O capabilities in the 986-ball BGA package, this Spartan-II FPGA delivers professional-grade functionality suitable for industrial, commercial, and embedded applications.
Whether you’re developing communication systems, industrial controllers, signal processing platforms, or custom embedded solutions, the XC2S200-6FGG986C provides the resources and reliability needed for successful product deployment.
