Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG984C: High-Performance Spartan-II FPGA for Advanced Digital Applications

Product Details

Overview of XC2S200-6FGG984C Field Programmable Gate Array

The XC2S200-6FGG984C is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance for complex digital processing applications. This high-density programmable logic device features 200,000 system gates in a 984-pin Fine-pitch Ball Grid Array (FBGA) package, making it an ideal solution for telecommunications, industrial automation, medical imaging, and embedded systems.

Key Technical Specifications

Core Architecture Features

Specification Value
System Gates 200,000
Logic Cells 5,292
Embedded Block RAM 57,344 bits (56 Kbit)
User I/O Pins 284 (maximum)
Speed Grade -6 (High Performance)
Core Voltage 2.5V
Package Type 984-Pin FBGA (Fine-pitch Ball Grid Array)
Technology Node 0.18μm CMOS
Operating Frequency Up to 263 MHz

Package Dimensions and Thermal Specifications

Parameter Specification
Package FGG984 (Fine-pitch BGA)
Total Pins 984
Package Form Square Ball Grid Array
Pin Pitch Fine-pitch (0.8mm or 1.0mm typical)
Temperature Range Commercial: 0°C to +85°C
RoHS Compliance Lead-free (G-suffix indicates Pb-free)

XC2S200-6FGG984C Performance Advantages

High-Density Logic Resources

The XC2S200-6FGG984C FPGA provides substantial logic capacity with 200,000 system gates and 5,292 configurable logic cells. This extensive resource availability enables implementation of sophisticated digital designs, complex state machines, and multi-function processing cores within a single device.

Enhanced I/O Capabilities

With up to 284 user I/O pins available in the FGG984 package, this Spartan-II FPGA offers maximum interface flexibility. The abundant pin count supports:

  • Multiple high-speed communication protocols
  • Parallel data bus interfaces (8-bit, 16-bit, 32-bit, 64-bit)
  • Simultaneous connection to multiple peripheral devices
  • Mixed-voltage I/O standards within the same device

Embedded Memory Architecture

The integrated 57,344-bit block RAM provides high-speed on-chip memory for:

  • Data buffering and FIFO implementations
  • Look-up table (LUT) storage
  • Small packet memory in networking applications
  • Coefficient storage for DSP functions

Application Areas for XC2S200-6FGG984C

Telecommunications Infrastructure

The XC2S200-6FGG984C excels in telecommunications equipment where high-speed data processing and protocol handling are essential:

  • Base station controllers
  • Network routers and switches
  • Protocol converters (Ethernet, USB, serial)
  • Digital signal processing for voice/data
  • Software-defined radio (SDR) platforms

Industrial Automation and Control

Manufacturing and process control systems benefit from the FPGA’s deterministic performance:

  • Programmable logic controllers (PLCs)
  • Motor control and drive systems
  • Machine vision processing
  • Real-time data acquisition systems
  • Factory automation networks

Medical Equipment Design

Medical device manufacturers leverage the XC2S200-6FGG984C for:

  • Diagnostic imaging equipment
  • Patient monitoring systems
  • Laboratory analysis instruments
  • Portable medical devices
  • Ultrasound signal processing

Embedded Computing Systems

The device serves as a co-processor or main controller in:

  • High-performance embedded systems
  • Single-board computers (SBCs)
  • Data logging and recording systems
  • Automotive electronics (infotainment, telematics)
  • Aerospace and defense applications

XC2S200-6FGG984C vs Other Spartan-II Package Options

Package Comparison Table

Package Type Pin Count Typical Use Case PCB Complexity
FG256 256 Compact designs, moderate I/O Low-Medium
FG456 456 Balanced size and I/O count Medium
FGG984 984 Maximum I/O, high-density applications Medium-High
PQ208 208 Legacy designs, easy routing Low

The FGG984 package variant offers the highest pin count in the XC2S200 series, providing maximum flexibility for I/O-intensive applications while maintaining compatibility with the Spartan-II architecture.

Design Resources and Development Tools

FPGA Development Software

Engineers working with the XC2S200-6FGG984C can utilize:

  • Xilinx ISE Design Suite – Legacy tool for Spartan-II synthesis and implementation
  • Vivado Design Suite – Modern alternative with backward compatibility
  • IP Core libraries – Pre-verified functional blocks
  • Simulation tools – ModelSim, ISIM for verification

Programming and Configuration

The Spartan-II XC2S200-6FGG984C supports multiple configuration modes:

  • JTAG boundary scan programming
  • Master Serial configuration
  • Slave Serial mode
  • Master Parallel configuration
  • SelectMAP interface

Power Consumption and Thermal Management

Power Supply Requirements

Supply Rail Voltage Purpose
VCCINT 2.5V Internal core logic
VCCO 1.8V – 3.3V I/O banks (configurable)
VCCAUX 2.5V Auxiliary circuits, DLLs

Thermal Considerations for FGG984 Package

The 984-pin FBGA package offers excellent thermal performance due to:

  • Large thermal pad for heat dissipation
  • Multiple ground pins for heat spreading
  • Compatibility with standard heatsinks
  • Suitable for forced-air or passive cooling

Competitive Advantages of XC2S200-6FGG984C

Cost-Effective ASIC Alternative

Compared to Application-Specific Integrated Circuits (ASICs), the XC2S200-6FGG984C provides:

  • No NRE costs – Eliminate mask and tooling expenses
  • Faster time-to-market – Prototype to production in weeks
  • Field upgradability – Update logic via reconfiguration
  • Lower risk – Test and validate before committing to silicon

Flexibility and Reconfigurability

Unlike fixed-function chips, this Xilinx FPGA allows:

  • In-system programming and updates
  • Dynamic partial reconfiguration (in supported modes)
  • Design iteration without hardware changes
  • Multi-function capability through configuration switching

Quality and Reliability

Manufacturing Standards

AMD Xilinx manufactures the XC2S200-6FGG984C under strict quality control:

  • ISO 9001 certified production facilities
  • Automotive-grade quality options available
  • Extended temperature range variants
  • Comprehensive testing and screening

Long-Term Availability

As part of the established Spartan-II family, the XC2S200 series maintains:

  • Multi-year product lifecycle support
  • Replacement part availability
  • Migration paths to newer families
  • Comprehensive documentation library

PCB Design Considerations for FGG984 Package

Board Layout Guidelines

Successful implementation of the 984-pin FBGA requires:

  • Minimum 6-layer PCB recommended for optimal signal integrity
  • Controlled impedance routing for high-speed signals
  • Power plane partitioning for clean voltage distribution
  • Adequate decoupling – Multiple ceramic capacitors per power rail
  • Via-in-pad or via-near-pad techniques for dense routing

Signal Integrity Best Practices

  • Maintain consistent trace impedance (typically 50Ω single-ended)
  • Use differential pairs for high-speed interfaces
  • Implement proper termination for clock signals
  • Separate analog and digital ground planes where applicable

Procurement and Supply Chain

Availability and Lead Times

The XC2S200-6FGG984C is available through:

  • Authorized AMD Xilinx distributors
  • Electronic component marketplaces
  • Specialized FPGA suppliers
  • Direct from manufacturer for volume orders

Quality Assurance

When sourcing the XC2S200-6FGG984C, verify:

  • Authentic AMD Xilinx part marking
  • Date code and lot traceability
  • Anti-counterfeit measures (holographic labels, QR codes)
  • Warranty and return policies

Migration and Upgrade Path

Future-Proofing Your Design

While the XC2S200-6FGG984C remains a capable device, consider these upgrade paths:

  • Spartan-3 family – Pin-compatible options with enhanced features
  • Spartan-6 series – Significant performance improvements
  • Artix-7 FPGAs – Modern architecture with lower power consumption

Legacy Design Support

For maintaining existing XC2S200-6FGG984C designs:

  • Stockpile critical components for long-term production
  • Document configuration and design files thoroughly
  • Maintain relationships with specialized distributors
  • Plan eventual migration to supported product lines

Technical Support and Documentation

Official Resources

Engineers can access comprehensive documentation:

  • Complete datasheet with electrical specifications
  • Application notes for specific use cases
  • Reference designs and example projects
  • Community forums and knowledge bases

Getting Started with XC2S200-6FGG984C

  1. Obtain development tools – Download Xilinx ISE or Vivado
  2. Review datasheet – Understand electrical and timing specifications
  3. Plan PCB layout – Account for 984-pin package requirements
  4. Design logic – Use HDL (Verilog/VHDL) or schematic entry
  5. Simulate and verify – Test functionality before hardware
  6. Program and test – Load configuration and validate operation

Conclusion: Why Choose XC2S200-6FGG984C?

The XC2S200-6FGG984C Spartan-II FPGA represents an excellent balance of logic density, I/O capability, and cost-effectiveness. With 200,000 system gates, 5,292 logic cells, and up to 284 user I/O pins in the high-density FGG984 package, this device serves demanding applications across telecommunications, industrial control, medical equipment, and embedded systems.

While newer FPGA families offer advanced features, the XC2S200-6FGG984C continues to provide reliable, proven performance for both legacy system maintenance and cost-sensitive new designs. Its reconfigurability, extensive I/O options, and mature development ecosystem make it a smart choice for engineers seeking a dependable programmable logic solution.

Whether you’re upgrading an existing design, developing a new product, or maintaining critical infrastructure, the XC2S200-6FGG984C delivers the performance, flexibility, and reliability required for professional FPGA applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.