The XC2S200-6FGG980C is a premium field-programmable gate array (FPGA) from AMD Xilinx’s acclaimed Spartan-II family, designed to deliver exceptional performance for complex digital designs. With 200,000 system gates, 5,292 logic cells, and 980-pin fine-pitch ball grid array packaging, this FPGA represents the pinnacle of flexibility and processing power for engineers and designers working on cutting-edge electronic systems.
Overview of XC2S200-6FGG980C FPGA Technology
The XC2S200-6FGG980C stands out as a superior alternative to traditional mask-programmed ASICs, offering programmable logic resources that eliminate lengthy development cycles and high initial costs. This Spartan-II FPGA enables field upgrades without hardware replacement, providing unmatched flexibility for evolving design requirements across telecommunications, industrial automation, aerospace, and medical electronics sectors.
Key Features of XC2S200-6FGG980C
This advanced Xilinx FPGA delivers robust performance characteristics that make it ideal for demanding applications:
- 200,000 System Gates: Extensive gate capacity for implementing complex digital architectures
- 5,292 Logic Cells: Flexible logic resources supporting intricate computational functions
- Speed Grade -6: Optimized for high-speed digital signal processing applications
- 980-Pin FGG Package: Fine-pitch ball grid array ensuring maximum I/O connectivity
- Commercial Temperature Range: Reliable operation in standard environmental conditions
- 2.5V Core Voltage: Energy-efficient power consumption for modern designs
- 0.18μm CMOS Technology: Advanced semiconductor fabrication process
Technical Specifications Table
| Specification |
Value |
| Part Number |
XC2S200-6FGG980C |
| Family |
Spartan-II FPGA |
| Manufacturer |
AMD Xilinx |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Maximum User I/O |
284 pins |
| Speed Grade |
-6 (highest performance) |
| Package Type |
FGG980 (980-ball Fine-Pitch BGA) |
| Operating Voltage |
2.5V (VCCINT/VCCO) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Technology Node |
0.18μm CMOS |
| Operating Frequency |
Up to 263 MHz |
XC2S200-6FGG980C Architecture and Design
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG980C features a comprehensive array of 1,176 configurable logic blocks arranged in a 28 x 42 matrix. Each CLB contains multiple look-up tables (LUTs), flip-flops, and multiplexers, enabling designers to implement custom digital circuits with maximum efficiency. This architecture supports both combinational and sequential logic functions, making the FPGA suitable for diverse application requirements.
Memory Resources
This Spartan-II FPGA provides dual memory architecture for optimal data handling:
Distributed RAM: 75,264 bits of distributed memory integrated within CLBs for fast, localized data storage
Block RAM: 56 Kbits of dedicated block memory modules positioned strategically across the die for high-throughput data buffering and processing
Input/Output Capabilities
The 980-pin FGG package delivers exceptional I/O density with 284 maximum user I/O pins, enabling complex interfacing requirements. The I/O blocks support various signaling standards and voltage levels, facilitating seamless integration with diverse system components and peripherals.
Performance Comparison Table
| Device Model |
System Gates |
Logic Cells |
Block RAM |
Max User I/O |
Package Options |
| XC2S150 |
150,000 |
3,888 |
48K |
260 |
FG456, PQ208 |
| XC2S200 |
200,000 |
5,292 |
56K |
284 |
FGG980, FG456 |
| XC2S300 |
300,000 |
7,680 |
64K |
410 |
FG456, FG676 |
Application Areas for XC2S200-6FGG980C
Telecommunications and Networking
The XC2S200-6FGG980C excels in communication infrastructure applications, supporting protocol implementation, digital signal processing, channel coding, and network routing functions. Its high-speed performance and extensive I/O resources make it ideal for data transmission systems requiring reliable, real-time processing.
Industrial Automation and Control
Manufacturing environments benefit from this FPGA’s precise control capabilities for motor control systems, process automation, PLC (Programmable Logic Controller) implementations, and robotic control interfaces. The programmable architecture enables rapid prototyping and system modifications without hardware changes.
Medical Electronics
Healthcare technology applications leverage the XC2S200-6FGG980C for medical imaging equipment, diagnostic instrumentation, patient monitoring systems, and laboratory analyzers. The device’s reliability and reconfigurability support the stringent requirements of medical electronics.
Aerospace and Defense
Mission-critical aerospace systems utilize this FPGA for flight control computers, radar signal processing, satellite communication equipment, and avionics systems where performance, reliability, and field programmability are essential.
Consumer Electronics
Product developers implement the XC2S200-6FGG980C in digital video processing, audio equipment, gaming systems, and high-definition displays where flexible logic resources enable feature-rich functionality.
Development and Programming
Design Tools and Software
Engineers can develop designs for the XC2S200-6FGG980C using AMD Xilinx’s comprehensive design suite:
- Vivado Design Suite: Modern, integrated development environment for synthesis, implementation, and timing analysis
- ISE Design Tools: Legacy support for Spartan-II family devices
- IP Core Libraries: Pre-verified intellectual property blocks for common functions
- Simulation Tools: ModelSim, ISIM, and third-party simulators for verification
Configuration Options
The FPGA supports multiple configuration modes including JTAG, Master Serial, Slave Serial, and Boundary Scan for flexible programming in development and production environments.
Package Specifications – FGG980
| Package Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Pins |
980 balls |
| Ball Pitch |
Fine pitch (typical BGA spacing) |
| Package Material |
Standard BGA substrate |
| Thermal Characteristics |
Optimized for commercial applications |
| Mounting Type |
Surface mount technology (SMT) |
Advantages of XC2S200-6FGG980C
Superior to Traditional ASICs
Unlike mask-programmed ASICs, the XC2S200-6FGG980C eliminates:
- High non-recurring engineering (NRE) costs
- Extended development timelines (months to years)
- Inherent risk of design errors in fixed silicon
- Inability to modify hardware post-production
Field Programmability Benefits
- Design Iterations: Rapid prototyping and testing without new hardware
- Feature Upgrades: Add functionality through reprogramming
- Bug Fixes: Correct design issues in deployed systems
- Customization: Adapt single hardware platform for multiple applications
Cost-Effective Solution
For medium-volume productions and applications requiring design flexibility, the XC2S200-6FGG980C provides superior total cost of ownership compared to ASIC development while offering comparable performance for many applications.
Power Consumption and Thermal Management
The XC2S200-6FGG980C operates efficiently at 2.5V core voltage, with power consumption varying based on design complexity, clock frequency, and I/O activity. Proper thermal management through heat sinks, thermal vias, and adequate airflow ensures reliable operation within the commercial temperature range.
Quality and Reliability
AMD Xilinx manufactures the XC2S200-6FGG980C using advanced 0.18μm CMOS technology in certified fabrication facilities, ensuring consistent quality and reliability. The device meets rigorous industry standards for:
- Electrostatic discharge (ESD) protection
- Electromagnetic compatibility (EMC)
- Long-term reliability testing
- Environmental compliance (RoHS where applicable)
Design Considerations for XC2S200-6FGG980C
PCB Layout Guidelines
Successful implementation requires attention to:
- Power Distribution: Robust power planes with adequate decoupling capacitors
- Signal Integrity: Controlled impedance traces for high-speed signals
- Thermal Management: Thermal relief and heat dissipation pathways
- BGA Routing: Via-in-pad or micro-via technology for dense 980-ball package
Clock Management
The Spartan-II architecture includes four Delay-Locked Loops (DLLs) positioned at die corners, providing precise clock distribution, phase shifting, and frequency multiplication/division for optimal timing performance across complex designs.
Procurement and Availability
The XC2S200-6FGG980C is available through authorized AMD Xilinx distributors and electronic component suppliers worldwide. When sourcing this FPGA, verify:
- Authentic AMD Xilinx part with proper date codes
- Appropriate moisture sensitivity level (MSL) handling
- Anti-static packaging and storage requirements
- Warranty and return policies
Related Products and Alternatives
Compatible Spartan-II Devices
- XC2S200-5FGG980C: Industrial temperature range variant
- XC2S200-6FG456C: Smaller 456-pin package option
- XC2S150-6FGG980C: Lower gate count alternative
- XC2S300-6FGG980C: Higher capacity upgrade path
Migration to Modern FPGA Families
For new designs, consider evaluating current-generation alternatives:
- Spartan-7 series (cost-optimized)
- Artix-7 series (performance-optimized)
- Latest Spartan families with advanced features
Conclusion: Why Choose XC2S200-6FGG980C
The XC2S200-6FGG980C represents a powerful, proven FPGA solution combining 200,000 system gates, extensive I/O capabilities, and field programmability in a high-density 980-pin package. Whether developing telecommunications equipment, industrial control systems, medical devices, or aerospace applications, this Spartan-II FPGA delivers the performance, flexibility, and reliability required for professional electronic design.
Its superior alternative to ASICs, combined with comprehensive development tool support and cost-effective implementation, makes the XC2S200-6FGG980C an excellent choice for engineers seeking programmable logic solutions without compromising on performance or features.
