Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG979C: High-Performance Spartan-II FPGA for Advanced Digital Design

Product Details

Overview of XC2S200-6FGG979C FPGA

The XC2S200-6FGG979C represents a powerful field-programmable gate array (FPGA) solution from the renowned Spartan-II family by Xilinx (now AMD). This versatile FPGA device delivers exceptional performance with 200,000 system gates, making it an ideal choice for telecommunications, industrial automation, embedded systems, and signal processing applications. Engineers and designers seeking a cost-effective yet robust FPGA solution will find the XC2S200-6FGG979C perfectly suited for complex digital logic implementations.

Note: Standard XC2S200 packaging options include FG456, FGG456, FG256, FGG256, PQ208, and PQG208. Please verify the specific package designation with your supplier.

Key Features and Specifications

Core FPGA Capabilities

The XC2S200-6FGG979C FPGA boasts impressive technical specifications that enable sophisticated digital circuit designs:

Feature Specification
System Gates 200,000 gates
Logic Cells 5,292 cells
CLB Array 28 x 42 (1,176 total CLBs)
Maximum User I/O 284 pins
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Speed Grade -6 (high performance)
Core Voltage 2.5V
Technology Node 0.18μm CMOS
Maximum Frequency 263 MHz

Advanced FPGA Architecture

The XC2S200-6FGG979C features Xilinx’s proven Spartan-II architecture, incorporating:

  • Configurable Logic Blocks (CLBs): 1,176 CLBs arranged in a 28×42 array for flexible logic implementation
  • Delay-Locked Loops (DLLs): Four DLLs positioned at chip corners for precise clock management
  • Block SelectRAM: Dedicated memory blocks for high-speed data buffering and storage
  • Input/Output Blocks (IOBs): Versatile I/O supporting multiple signaling standards
  • Programmable Routing: Extensive interconnect resources for efficient signal routing

Technical Specifications Table

Electrical Characteristics

Parameter Value Notes
Core Supply Voltage (VCCINT) 2.5V ± 5% Internal logic
I/O Supply Voltage (VCCO) 1.5V to 3.3V Bank dependent
Operating Temperature Range 0°C to +85°C Commercial (-6 grade)
Power Consumption Varies by design Dependent on utilization
Configuration Memory 2,126,880 bits SRAM-based

Performance Specifications

Metric XC2S200-6
Maximum System Frequency 263 MHz
Logic Delay Low (speed grade -6)
Clock-to-Out Delay Optimized for high-speed operation
Setup/Hold Times Industry-leading performance

XC2S200 FPGA Applications

Telecommunications and Networking

The XC2S200-6FGG979C excels in telecommunications infrastructure, enabling:

  • Protocol conversion and packet processing
  • Network interface controllers
  • Data encryption and security modules
  • Signal multiplexing and demultiplexing
  • Base station signal processing

Industrial Automation and Control

Industrial engineers leverage this FPGA for:

  • Motor control systems with precise PWM generation
  • PLC (Programmable Logic Controller) implementations
  • Process control and monitoring systems
  • Machine vision preprocessing
  • Real-time sensor data acquisition

Medical Equipment Design

The XC2S200-6FGG979C supports critical medical applications:

  • Medical imaging systems (ultrasound, CT preprocessing)
  • Patient monitoring equipment
  • Diagnostic instrument control
  • Biosensor signal processing
  • Laboratory automation systems

Consumer Electronics

This Spartan-II FPGA enables innovative consumer products:

  • Digital video/audio processing
  • Display controllers and graphics acceleration
  • Smart home device controllers
  • Gaming console components
  • Portable instrumentation

Design Advantages of Spartan-II FPGAs

Cost-Effective ASIC Alternative

The XC2S200-6FGG979C provides significant advantages over traditional ASICs:

  • No NRE Costs: Eliminate expensive mask sets and fabrication charges
  • Faster Time-to-Market: Implement designs in days versus months for ASICs
  • Design Flexibility: Modify logic after deployment through reconfiguration
  • Risk Mitigation: Test and validate designs before committing to production
  • Field Upgrades: Update functionality without hardware replacement

Comprehensive Development Ecosystem

Xilinx provides robust tools for XC2S200 development:

  • ISE Design Suite: Complete FPGA design flow from synthesis to bitstream generation
  • IP Core Library: Pre-verified IP blocks for common functions
  • Simulation Tools: Comprehensive verification and timing analysis
  • Programming Solutions: Multiple configuration options (JTAG, SelectMAP, Serial)

Package and Pinout Information

Fine-Pitch Ball Grid Array Package

The XC2S200 is available in several package options optimized for different applications:

Package Type Ball Count Dimensions User I/O
FG456/FGG456 456 pins 23mm x 23mm 284 max
FG256/FGG256 256 pins 17mm x 17mm 176 max
PQ208/PQG208 208 pins 28mm x 28mm 140 max

Note: The “FGG” designation indicates lead-free (Pb-free) packaging compliant with RoHS directives.

Pin Configuration Features

  • Dedicated global clock inputs with low-skew distribution
  • Multiple I/O standards support (LVTTL, LVCMOS, SSTL, HSTL)
  • Programmable pull-up/pull-down resistors
  • Individually configurable I/O banks
  • Hot-swappable I/O capability

Memory Architecture

Distributed RAM Resources

The XC2S200-6FGG979C incorporates 75,264 bits of distributed RAM within CLBs:

  • Flexible Implementation: RAM16, RAM32, or shift register modes
  • Dual-Port Access: Simultaneous read/write operations
  • Logic Integration: RAM elements closely coupled with logic resources

Block SelectRAM

Dedicated 56 Kbit block RAM provides:

  • True Dual-Port Operation: Independent A and B ports with separate clocks
  • Configurable Width: 1-bit to 18-bit data widths
  • High-Speed Access: Single-cycle read/write operations
  • FIFO Support: Built-in modes for buffering applications

Clock Management System

Delay-Locked Loop Technology

Four DLLs provide sophisticated clock management:

  • Clock De-skew: Eliminate distribution delays across the chip
  • Frequency Synthesis: Generate multiple clock domains from single source
  • Phase Shifting: Precise phase relationships between clock signals
  • Clock Doubling: Create higher-frequency internal clocks

Programming and Configuration

Multiple Configuration Modes

The XC2S200-6FGG979C supports flexible configuration methods:

Mode Description Use Case
Master Serial FPGA controls PROM Stand-alone systems
Slave Serial External processor controls Embedded systems
JTAG IEEE 1149.1 boundary scan Development/debugging
SelectMAP 8-bit parallel interface Fast reconfiguration

Configuration Memory

  • Volatile SRAM-based configuration
  • Requires external non-volatile storage (PROM, Flash)
  • Fast configuration times (typically <100ms)
  • Supports partial reconfiguration in advanced applications

Quality and Reliability

Manufacturing Standards

Xilinx Spartan-II FPGAs undergo rigorous quality control:

  • Automotive Grade Options: AEC-Q100 qualified variants available
  • Extended Temperature Range: Industrial grade (-40°C to +100°C) options
  • Qualification Testing: JEDEC standards compliance
  • RoHS Compliance: Lead-free packaging options (FGG designation)

Reliability Metrics

  • MTBF: High mean time between failures for mission-critical applications
  • Radiation Tolerance: Suitable for most terrestrial applications
  • ESD Protection: Robust I/O structures with multi-level protection

Development Resources

Getting Started with XC2S200

Engineers can accelerate development using:

  1. Development Boards: Various third-party platforms available
  2. Reference Designs: Sample projects and application notes
  3. Technical Documentation: Comprehensive datasheets and user guides
  4. Online Community: Active forums and knowledge bases
  5. Training Resources: Webinars, tutorials, and certification programs

Design Tools and Software

Essential tools for XC2S200 development:

  • ISE WebPACK: Free edition for Spartan-II devices
  • ModelSim: HDL simulation and verification
  • ChipScope: On-chip logic analyzer for debugging
  • Constraint Editors: Timing and placement optimization tools

Comparison with Other Spartan-II Devices

XC2S200 Position in Product Family

Device Logic Cells System Gates CLBs Block RAM Max I/O
XC2S50 1,728 50,000 384 32K 176
XC2S100 2,700 100,000 600 40K 176
XC2S200 5,292 200,000 1,176 56K 284
XC2S150 3,888 150,000 864 48K 260

The XC2S200 offers the highest gate count and I/O capability in the Spartan-II family, making it ideal for large-scale designs.

Ordering Information and Part Number Decoding

Understanding the Part Number

The part number XC2S200-6FGG979C breaks down as:

  • XC: Xilinx FPGA product line
  • 2S200: Spartan-II family, 200K gates
  • 6: Speed grade (-6 indicates highest performance commercial grade)
  • FGG: Fine-pitch BGA, lead-free (RoHS compliant)
  • 979: Ball count (note: verify package availability)
  • C: Commercial temperature range (0°C to +85°C)

Alternative Temperature Grades

  • C Grade: Commercial (0°C to +85°C)
  • I Grade: Industrial (-40°C to +100°C)

Why Choose XC2S200-6FGG979C for Your Next Project?

Proven Technology Platform

The Spartan-II architecture has powered millions of successful designs across diverse industries. The XC2S200 specifically offers:

  • Balanced Resources: Optimal mix of logic, memory, and I/O for general-purpose applications
  • Performance Headroom: -6 speed grade ensures timing closure even in challenging designs
  • Mature Ecosystem: Extensive documentation, IP cores, and community support
  • Competitive Pricing: Excellent price-per-gate ratio compared to alternatives

Long-Term Availability

Despite being a mature product, Spartan-II FPGAs remain available through:

  • Authorized distributors with existing inventory
  • Secondary market suppliers
  • Direct engagement with AMD/Xilinx for volume requirements

Where to Buy XC2S200 FPGAs

For authentic Xilinx FPGA components including the XC2S200 series, work with authorized distributors to ensure:

  • Genuine AMD/Xilinx products
  • Proper handling and storage
  • Warranty and technical support
  • Traceability documentation
  • RoHS compliance certificates

Technical Support and Resources

Documentation Access

Essential documents for XC2S200 development:

  • Datasheet (DS001): Complete electrical and timing specifications
  • User Guide: Detailed architecture description
  • Application Notes: Design best practices and solutions
  • PCB Layout Guidelines: Package-specific recommendations

Community and Support

Connect with the FPGA design community:

  • Xilinx Community Forums
  • Stack Overflow FPGA tags
  • LinkedIn professional groups
  • University research collaborations

Conclusion

The XC2S200-6FGG979C represents a mature, reliable FPGA solution for engineers requiring 200,000 system gates of programmable logic. With its robust architecture, comprehensive development tools, and proven track record across telecommunications, industrial, medical, and consumer applications, this Spartan-II device continues to deliver value for both new designs and legacy system support.

Whether you’re developing communication protocols, implementing control systems, or creating custom digital signal processing solutions, the XC2S200-6FGG979C provides the performance, flexibility, and cost-effectiveness needed for successful project completion.

Next Steps

  1. Verify Specifications: Confirm package and speed grade requirements for your application
  2. Evaluate Development Tools: Download ISE WebPACK to begin design work
  3. Review Reference Designs: Study existing XC2S200 implementations similar to your project
  4. Source Components: Contact authorized distributors for quotations and availability
  5. Plan Development Timeline: Account for design, verification, and production phases

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.