Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG975C: High-Performance Spartan-II FPGA for Advanced Digital Design Applications

Product Details

Overview of XC2S200-6FGG975C FPGA

The XC2S200-6FGG975C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family, manufactured by AMD Xilinx. This high-performance programmable logic device offers exceptional flexibility, making it an ideal choice for engineers and designers working on complex digital systems. With 200,000 system gates, 5,292 logic cells, and advanced memory capabilities, this FPGA delivers robust performance for demanding applications across telecommunications, industrial automation, medical devices, and consumer electronics.

Key Specifications and Technical Features

Core Architecture Specifications

Specification Value
Logic Cells 5,292
System Gates 200,000
CLB Array Configuration 28 x 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM Bits 75,264
Block RAM 56K bits
Speed Grade -6 (High Performance)
Core Voltage 2.5V
Technology Node 0.18μm
Operating Frequency Up to 263 MHz

Package and Physical Characteristics

Parameter Specification
Package Type Fine-Pitch Ball Grid Array (FBGA)
Total Pins 975 (Based on FGG975 designation)
Package Marking FGG975
Temperature Range Commercial (0°C to +85°C)
RoHS Compliance Available in Pb-free options

Why Choose the XC2S200-6FGG975C Spartan-II FPGA?

Superior Performance Capabilities

The XC2S200-6FGG975C stands out in the Xilinx FPGA portfolio with its exceptional balance of logic density, memory resources, and I/O capabilities. The -6 speed grade designation indicates this device is optimized for high-performance applications requiring maximum operating frequencies and minimal propagation delays.

Programmable Logic Advantages

Unlike traditional ASICs (Application-Specific Integrated Circuits), this Spartan-II FPGA offers several critical advantages:

  • Field Reprogrammability: Update designs without hardware replacement
  • Reduced Development Time: Eliminate lengthy ASIC fabrication cycles
  • Lower Initial Costs: No expensive NRE (Non-Recurring Engineering) fees
  • Design Flexibility: Implement changes and improvements post-deployment
  • Faster Time-to-Market: Accelerate product development cycles

Detailed Feature Analysis

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG975C incorporates 1,176 configurable logic blocks arranged in a 28×42 array, providing extensive resources for implementing complex digital logic functions. Each CLB contains:

  • Look-Up Tables (LUTs) for combinational logic
  • Flip-flops for sequential logic implementation
  • Multiplexers for data routing
  • Carry logic for arithmetic operations

Memory Architecture

Memory Type Capacity Application
Distributed RAM 75,264 bits Small, fast data storage
Block RAM 56K bits Larger data buffers and FIFOs
Total Available Memory 131,264 bits Combined storage resources

Input/Output Capabilities

With up to 284 user I/O pins, the XC2S200-6FGG975C provides extensive connectivity options for interfacing with external devices, sensors, actuators, and communication protocols. The I/O blocks support:

  • Multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL)
  • Programmable drive strength
  • Internal pull-up/pull-down resistors
  • Differential signaling support
  • High-speed serial interfaces

Target Applications and Use Cases

Communications and Networking Equipment

The XC2S200-6FGG975C excels in telecommunications applications including:

  • Protocol converters and bridges
  • Data packet processing engines
  • Network routers and switches
  • Wireless base station controllers
  • Signal processing modules

Industrial Control Systems

Industrial automation benefits from FPGA flexibility:

  • Motor control algorithms
  • Process control systems
  • Programmable logic controllers (PLCs)
  • Machine vision processing
  • Real-time monitoring systems

Medical Device Implementation

Healthcare technology applications include:

  • Medical imaging equipment
  • Patient monitoring systems
  • Diagnostic instrument control
  • Ultrasound signal processing
  • Laboratory automation equipment

Consumer Electronics

Consumer applications leverage FPGA versatility:

  • Digital video processing
  • Audio signal processing
  • Gaming console accelerators
  • Display controllers
  • Camera image processing

Performance Comparison Table

Feature XC2S200 XC2S150 XC2S100
Logic Cells 5,292 3,888 2,700
System Gates 200,000 150,000 100,000
CLBs 1,176 864 600
Max User I/O 284 260 176
Block RAM 56K 48K 40K
Distributed RAM 75,264 bits 55,296 bits 38,400 bits

Development Tools and Support

Design Software Compatibility

The XC2S200-6FGG975C is fully supported by AMD Xilinx development tools:

  • ISE Design Suite: Legacy development environment
  • Vivado Design Suite: Modern design platform (for newer workflows)
  • ChipScope Pro: Integrated logic analyzer
  • EDK (Embedded Development Kit): Embedded system design

Programming and Configuration

Multiple configuration options are available:

  • JTAG boundary-scan programming
  • SelectMAP parallel configuration
  • Serial configuration modes
  • Microprocessor-based configuration
  • Platform Flash PROM support

Technical Advantages Over Competing Solutions

Cost-Effectiveness

The Spartan-II family, including the XC2S200-6FGG975C, offers an optimal price-performance ratio for medium-density applications. Compared to higher-end Virtex series FPGAs, the Spartan-II provides sufficient resources at a more accessible price point.

Power Efficiency

Operating at 2.5V core voltage with 0.18μm technology, this FPGA achieves a balance between performance and power consumption suitable for battery-operated and thermally-constrained applications.

Proven Reliability

The Spartan-II architecture has been deployed in millions of production units worldwide, demonstrating:

  • Long-term availability
  • Proven manufacturing processes
  • Extensive application notes and reference designs
  • Strong community support and documentation

Design Considerations and Best Practices

Thermal Management

Operating Condition Consideration
Junction Temperature Monitor during high-utilization operation
Airflow Requirements Ensure adequate cooling for continuous operation
Power Dissipation Calculate based on resource utilization
Heat Sink Selection Size according to thermal resistance requirements

Signal Integrity Guidelines

For optimal performance with the XC2S200-6FGG975C:

  • Follow PCB layout guidelines for high-speed signals
  • Implement proper termination for transmission lines
  • Use dedicated power planes for core and I/O supplies
  • Consider impedance-controlled routing for critical signals
  • Implement decoupling capacitors near power pins

Ordering Information and Package Options

Part Number Breakdown

XC2S200-6FGG975C

  • XC2S200: Device family and gate count
  • 6: Speed grade (-6 = fastest commercial grade)
  • FGG975: Package type (Fine-pitch BGA, 975 pins)
  • C: Commercial temperature range (0°C to +85°C)

Alternative Package Configurations

While the FGG975 package offers maximum I/O density, other packages available for XC2S200 include:

  • FG456: 456-pin Fine-pitch BGA
  • FG256: 256-pin Fine-pitch BGA
  • PQ208: 208-pin Plastic Quad Flat Pack

Frequently Asked Questions

What makes the -6 speed grade significant?

The -6 speed grade represents the highest performance option for commercial temperature range Spartan-II devices, offering minimum propagation delays and maximum operating frequencies.

Can this FPGA be reprogrammed multiple times?

Yes, the XC2S200-6FGG975C is based on SRAM configuration technology, allowing unlimited reprogramming cycles during development and field deployment.

What development tools are required?

AMD Xilinx ISE Design Suite provides complete support for design entry, synthesis, implementation, and programming of the XC2S200-6FGG975C.

Is this device suitable for new designs?

While the Spartan-II family is a mature product line, it remains suitable for cost-sensitive applications where proven technology and long-term availability are priorities. For cutting-edge performance, consider newer AMD Xilinx FPGA families.

What is the typical power consumption?

Power consumption varies based on design utilization, clock frequencies, and I/O activity. Xilinx provides the XPower tool for accurate power estimation based on specific design parameters.

Migration and Alternative Options

Upgrade Paths

Designers may consider these alternatives for enhanced performance:

  • Spartan-3 Series: Lower voltage (1.2V), higher density
  • Spartan-6 Series: Modern architecture, improved power efficiency
  • Artix-7 Series: Current-generation low-cost FPGA family

Pin-Compatible Alternatives

Within the Spartan-II family, consider:

  • XC2S150-6FGG975C: Lower gate count, same package
  • XC2S200-5FGG975C: Slower speed grade, reduced cost

Conclusion: Maximizing Value with XC2S200-6FGG975C

The XC2S200-6FGG975C represents a mature, reliable FPGA solution for applications requiring 200K system gates, extensive I/O resources, and high-performance operation. Its proven architecture, comprehensive development tool support, and cost-effective pricing make it an excellent choice for production designs in telecommunications, industrial control, medical devices, and consumer electronics.

Whether you’re implementing protocol conversion, signal processing algorithms, control systems, or custom digital logic, the XC2S200-6FGG975C provides the resources and flexibility needed for successful product development. Combined with AMD Xilinx’s comprehensive technical support and extensive application documentation, this FPGA enables rapid development and reliable deployment of sophisticated digital systems.

For engineers seeking a balance of performance, cost, and proven reliability, the XC2S200-6FGG975C Spartan-II FPGA continues to deliver exceptional value in today’s programmable logic landscape.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.