Overview of XC2S200-6FGG974C FPGA
The XC2S200-6FGG974C is a premium field-programmable gate array from AMD Xilinx’s renowned Spartan-II family, delivering exceptional performance for complex digital applications. This FPGA combines 200,000 system gates with advanced programmability, making it an ideal choice for engineers seeking cost-effective solutions without compromising on functionality. The device features a robust 974-pin Fine-pitch Ball Grid Array (FBGA) package, providing extensive I/O capabilities for demanding industrial and commercial applications.
As part of the Xilinx FPGA product line, the XC2S200-6FGG974C represents a significant advancement over traditional ASIC solutions, offering field-upgradeable designs and eliminating lengthy development cycles.
Key Technical Specifications
Core Performance Features
| Specification |
Value |
| Logic Cells |
5,292 cells |
| System Gates |
200,000 gates |
| CLB Array Configuration |
28 × 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Speed Grade |
-6 (fastest available) |
| Operating Voltage |
2.5V core voltage |
| Technology Node |
0.18μm CMOS process |
| Package Type |
FGG974 (974-ball FBGA) |
| Temperature Range |
Commercial (0°C to +85°C) |
Memory Architecture
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (56,576 bits) |
| Total Embedded Memory |
131,840 bits |
Advanced Features Table
| Feature |
Description |
| Delay-Locked Loops (DLLs) |
4 DLLs for precise clock management |
| Maximum Operating Frequency |
263 MHz internal performance |
| Configurable Logic Blocks |
1,176 CLBs with flexible routing |
| I/O Standards Support |
LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL |
| Programming Options |
JTAG, Master/Slave Serial, SelectMAP |
XC2S200-6FGG974C Architecture and Design
Programmable Logic Structure
The XC2S200-6FGG974C employs a sophisticated architecture featuring configurable logic blocks arranged in a 28 × 42 array. Each CLB contains four logic slices, with each slice incorporating two 4-input lookup tables (LUTs), two flip-flops, and dedicated arithmetic logic. This configuration enables efficient implementation of complex Boolean functions, arithmetic operations, and sequential logic circuits.
Input/Output Block Capabilities
With 284 maximum user I/O pins available in the FGG974 package, this FPGA provides exceptional connectivity options for interfacing with external components. The I/O blocks support multiple voltage standards and can be configured for single-ended or differential signaling, making the device versatile across various system architectures.
Memory Resources
The dual-column block RAM architecture provides high-speed embedded memory ideal for buffering, data processing, and FIFO implementations. Combined with the distributed RAM capability within CLBs, designers have flexible options for memory allocation throughout their designs.
Applications and Use Cases
Industrial Automation and Control
The XC2S200-6FGG974C excels in industrial control systems where reliable, programmable logic is essential. Applications include:
- Motor control systems with PWM generation
- Process monitoring and automation
- PLC (Programmable Logic Controller) implementations
- Industrial protocol converters (Modbus, Profibus, EtherCAT)
Communication Systems
This Spartan-II FPGA handles high-speed data processing for telecommunications:
- Network protocol implementation
- Data packet routing and switching
- Signal processing for baseband applications
- Communication interface bridging
Medical Device Electronics
Medical equipment manufacturers benefit from the XC2S200-6FGG974C’s reliability:
- Patient monitoring systems
- Diagnostic imaging equipment interfaces
- Medical sensor data acquisition
- Real-time signal processing for vital signs
Automotive Electronics
The device supports automotive applications requiring robust digital processing:
- Engine control unit (ECU) prototyping
- Advanced driver assistance systems (ADAS)
- In-vehicle networking interfaces
- Infotainment system controllers
Technical Advantages and Benefits
Superior Alternative to ASICs
The XC2S200-6FGG974C eliminates traditional ASIC drawbacks:
| ASIC Challenges |
FPGA Solutions |
| High NRE costs ($100K-$1M+) |
Zero upfront tooling costs |
| 6-12 month development cycles |
Immediate implementation and testing |
| Fixed functionality |
Field-upgradeable designs |
| High financial risk |
Low-risk iterative development |
| No post-production changes |
Unlimited design modifications |
Performance Specifications
Speed Grade -6 Advantages
The -6 speed grade designation indicates the fastest performance variant in the XC2S200 family, offering:
- Minimum propagation delays
- Maximum clock frequencies up to 263 MHz
- Optimized timing for critical path performance
- Enhanced setup and hold time margins
Power Efficiency
Operating at 2.5V core voltage, the XC2S200-6FGG974C maintains excellent power efficiency:
- Low static power consumption
- Programmable I/O drive strength for power optimization
- Power-down modes for inactive logic blocks
- Efficient 0.18μm process technology
Package Information: FGG974
Physical Characteristics
| Parameter |
Specification |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Total Balls |
974 |
| Ball Pitch |
Fine pitch for high-density routing |
| RoHS Compliance |
Pb-free “G” designation available |
| Thermal Performance |
Optimized for thermal dissipation |
PCB Design Considerations
The 974-ball FBGA package requires careful PCB layout:
- High-density interconnect (HDI) PCB recommended
- Controlled impedance routing for high-speed signals
- Adequate thermal vias for heat dissipation
- Multi-layer stackup (minimum 6-8 layers)
- BGA escape routing strategy planning
Development and Programming
Design Tools and Software
Engineers can develop designs for the XC2S200-6FGG974C using Xilinx ISE Design Suite:
- Synthesis and implementation tools
- Timing analysis and constraint management
- Simulation integration (ModelSim, ISIM)
- ChipScope Pro for in-system debugging
- IP core library access
Configuration Methods
| Method |
Interface |
Use Case |
| JTAG Boundary Scan |
IEEE 1149.1 |
Development, testing, debug |
| Master Serial |
SPI-compatible |
Autonomous boot from Flash |
| Slave Serial |
External controller |
System-controlled configuration |
| SelectMAP |
Parallel 8-bit |
High-speed configuration |
Ordering and Availability
Part Number Breakdown
XC2S200-6FGG974C
- XC2S200: Device family and gate count
- 6: Speed grade (-6 = fastest)
- FGG974: Package type (974-ball FBGA, Pb-free)
- C: Commercial temperature range (0°C to +85°C)
Alternative Package Options
While the FGG974 package offers maximum I/O, consider these alternatives for different requirements:
| Package |
Pin Count |
Recommended For |
| FG256/FGG256 |
256 |
Compact designs (176 I/O) |
| FG456/FGG456 |
456 |
Balanced I/O (284 I/O) |
| PQ208/PQG208 |
208 |
Cost-sensitive applications (140 I/O) |
Quality and Reliability
Manufacturing Standards
The XC2S200-6FGG974C is manufactured to rigorous quality standards:
- ISO 9001 certified production facilities
- Full qualification testing per JEDEC standards
- 100% functional testing before shipment
- Comprehensive device characterization
- Long-term reliability testing completed
Operating Conditions
| Parameter |
Minimum |
Typical |
Maximum |
| Core Voltage (VCCINT) |
2.375V |
2.5V |
2.625V |
| I/O Voltage (VCCO) |
Varies by standard |
– |
3.6V |
| Operating Temperature |
0°C |
25°C |
+85°C |
| Junction Temperature |
– |
– |
+100°C |
Competitive Advantages
Why Choose XC2S200-6FGG974C?
- Proven Technology: Mature Spartan-II architecture with extensive deployment history
- Cost-Effectiveness: Optimal price-performance ratio for 200K gate applications
- Extensive Support: Comprehensive documentation, reference designs, and community resources
- Supply Chain Stability: Established production and distribution channels
- Design Portability: Easy migration path to newer Xilinx families when needed
Comparison with Competing Solutions
| Feature |
XC2S200-6FGG974C |
Competitive FPGAs |
| System Gates |
200,000 |
150K-250K range |
| Speed Grade Options |
-5, -6 variants |
Limited options |
| Memory Flexibility |
Distributed + Block |
Often limited |
| Package Variety |
5+ options |
Fewer choices |
| Tool Maturity |
Industry-leading ISE |
Variable support |
Technical Support and Resources
Documentation Available
- Complete datasheet with AC/DC specifications
- User guide for Spartan-II architecture
- PCB design guidelines for FBGA packages
- Application notes for common implementations
- IBIS models for signal integrity analysis
- Timing models and constraint templates
Design Resources
Access comprehensive support materials:
- Reference designs for common applications
- IP core library integration examples
- Power estimation spreadsheets
- Thermal management guidelines
- Programming file generation tutorials
Environmental and Compliance
RoHS Compliance
The “G” designation in FGG974 indicates lead-free (Pb-free) package construction, meeting RoHS requirements for European and global markets.
Additional Certifications
- REACH compliant
- Conflict mineral reporting available
- Moisture sensitivity level (MSL) rating provided
- Full traceability documentation
Frequently Asked Questions
What is the difference between XC2S200-5FGG974C and XC2S200-6FGG974C?
The primary difference is speed grade: -6 offers faster performance (lower propagation delays) than -5, suitable for timing-critical applications requiring maximum clock frequencies.
Can I use this FPGA for new designs in 2026?
While Spartan-II is a mature product line, it remains suitable for cost-sensitive applications. For new high-volume designs, consider evaluating newer Spartan-7 or Artix-7 families for enhanced features and longer lifecycle.
What programming hardware is required?
Standard Xilinx programming cables (Platform Cable USB, Digilent JTAG-HS2) work with XC2S200-6FGG974C. Third-party JTAG programmers supporting IEEE 1149.1 are also compatible.
Is this device automotive-qualified?
The “C” grade indicates commercial temperature range. For automotive applications, consider industrial (-40°C to +100°C) or extended temperature variants if available.
Conclusion
The XC2S200-6FGG974C represents a powerful, cost-effective FPGA solution for applications requiring 200,000 system gates and extensive I/O capabilities. Its combination of proven Spartan-II architecture, fast -6 speed grade performance, and comprehensive 974-ball package makes it ideal for industrial control, communications, medical devices, and automotive electronics.
Engineers benefit from mature development tools, extensive documentation, and a reliable supply chain. Whether prototyping new concepts or deploying proven designs, the XC2S200-6FGG974C delivers the programmability and performance needed for demanding digital applications.
For procurement, technical support, or additional information about integrating the XC2S200-6FGG974C into your designs, consult with authorized Xilinx distributors or visit the official AMD Xilinx product portal.
