Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG969C: High-Performance Spartan-II FPGA for Industrial Applications

Product Details

Overview of XC2S200-6FGG969C Xilinx FPGA

The XC2S200-6FGG969C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance for embedded systems, industrial automation, and communication applications. This programmable logic device combines 200,000 system gates with 5,292 logic cells, offering designers the flexibility and processing power needed for complex digital designs.

As part of the industry-leading Spartan-II series, the XC2S200-6FGG969C represents a cost-effective alternative to application-specific integrated circuits (ASICs), eliminating lengthy development cycles and upfront NRE costs while maintaining superior performance characteristics.

Key Technical Specifications

XC2S200-6FGG969C Core Features

Specification Value
Logic Cells 5,292
System Gates 200,000
CLB Array Configuration 28 x 42 (1,176 total CLBs)
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Maximum User I/O 284 pins
Speed Grade -6 (highest performance)
Operating Voltage 2.5V
Process Technology 0.18μm CMOS
Temperature Range Commercial (0°C to +85°C)
Package Type FGG969 Fine-Pitch BGA

Performance Characteristics

The XC2S200-6FGG969C delivers robust performance metrics that make it ideal for time-critical applications:

  • System Performance: Up to 200 MHz operation
  • Configuration Time: Fast reconfiguration capability
  • Power Efficiency: Optimized 2.5V core voltage for reduced power consumption
  • Signal Integrity: Advanced I/O standards support including LVTTL, LVCMOS, PCI

Architecture and Design Features

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG969C incorporates 1,176 CLBs arranged in a 28×42 array, providing extensive logic resources for implementing complex digital functions. Each CLB contains:

  • Four-input look-up tables (LUTs)
  • Dedicated flip-flops for sequential logic
  • Fast carry logic for arithmetic operations
  • Distributed RAM capability

Memory Resources Table

Memory Type Capacity Application
Distributed RAM 75,264 bits Small buffers, FIFOs, lookup tables
Block RAM 56 Kbits Large data storage, packet buffers
Total RAM 131,328 bits Combined storage capacity

Input/Output Architecture

The FGG969 package variant provides extensive I/O capabilities with 284 maximum user I/O pins, supporting various interface standards and voltage levels for seamless system integration.

Applications and Use Cases

Industrial Automation and Control

The XC2S200-6FGG969C excels in industrial environments requiring:

  • Real-time process control
  • Motor control and motion systems
  • Sensor interface and data acquisition
  • PLC (Programmable Logic Controller) implementations

Communications and Networking

Leverage the FPGA’s high-speed processing for:

  • Protocol conversion and bridging
  • Network packet processing
  • Data encryption/decryption
  • Signal conditioning and filtering

Digital Signal Processing (DSP)

The abundant logic resources enable:

  • Audio/video processing pipelines
  • Image filtering and enhancement
  • Software-defined radio (SDR) implementations
  • Real-time data analysis

Embedded Systems Development

Perfect for embedded applications including:

  • Custom peripheral controllers
  • Rapid prototyping platforms
  • Hardware acceleration
  • System-on-chip (SoC) integration

Competitive Advantages

FPGA vs ASIC Comparison

Feature XC2S200-6FGG969C FPGA Traditional ASIC
Development Cost Low (no NRE fees) High (significant NRE)
Time to Market Days to weeks Months to years
Design Flexibility Fully reconfigurable Fixed after fabrication
Field Updates Yes, unlimited No
Prototype Costs Minimal Very high
Risk Level Low High

Why Choose the XC2S200-6FGG969C

  1. Proven Reliability: Spartan-II architecture with extensive field deployment history
  2. Cost-Effective: Superior price-performance ratio for mid-range applications
  3. Design Security: Bitstream encryption capabilities protect intellectual property
  4. Tool Support: Compatible with Xilinx ISE Design Suite for streamlined development
  5. Supply Availability: Established product with reliable sourcing channels

Design Resources and Development Tools

Software Support

The XC2S200-6FGG969C is fully supported by:

  • Xilinx ISE Design Suite: Complete development environment
  • ChipScope Pro: Integrated logic analyzer
  • CORE Generator: IP core library access
  • Timing Analyzer: Static timing analysis tools

Programming and Configuration

Multiple configuration modes available:

  • Master Serial mode
  • Slave Serial mode
  • Master SelectMAP mode
  • Slave SelectMAP mode
  • Boundary Scan (JTAG)

Package and Physical Specifications

FGG969 Package Details

Parameter Specification
Package Type Fine-Pitch Ball Grid Array (FBGA)
Pin Count 969 balls
Lead-Free Option Available (RoHS compliant)
Thermal Performance Enhanced heat dissipation
Mounting Type Surface mount

Environmental and Quality Standards

  • RoHS Compliance: Lead-free packaging options available
  • Moisture Sensitivity Level: MSL 3
  • Quality Grade: Industrial standard
  • MTBF: High reliability for mission-critical applications

Power Management and Thermal Considerations

Power Supply Requirements

Supply Rail Voltage Function
VCCINT 2.5V ±5% Internal logic core
VCCO 1.2V to 3.3V I/O banks (configurable)

Power Consumption Guidelines

The XC2S200-6FGG969C features low static power consumption with dynamic power scaling based on:

  • Clock frequency utilization
  • Toggle rates of logic resources
  • I/O switching activity
  • Number of active features

Design Migration Path

Compatible Device Family

Engineers can easily migrate designs across the Spartan-II family:

  • Smaller devices: XC2S15, XC2S30, XC2S50, XC2S100, XC2S150
  • Larger device: XC2S200 (current)
  • Pin-compatible options: Verify package variants for drop-in replacement

Upgrade Path to Modern FPGAs

For new designs requiring enhanced features, consider migration to:

  • Spartan-6 family for lower power
  • Spartan-7 family for increased performance
  • Artix-7 family for advanced DSP capabilities

Quality Assurance and Testing

Production Testing

Every XC2S200-6FGG969C undergoes rigorous:

  • Full functional testing
  • Speed grade verification
  • Burn-in testing (extended temperature)
  • Package integrity inspection

Reliability Standards

Manufactured to meet or exceed:

  • JEDEC standards for electronic components
  • AEC-Q100 automotive qualification (specific grades)
  • MIL-STD-883 military specifications (qualified versions)

Sourcing and Procurement

Authorized Distribution Channels

Purchase authentic XC2S200-6FGG969C devices through:

  • Authorized AMD Xilinx distributors
  • Certified electronic component suppliers
  • Franchised semiconductor dealers

Quality Verification

When sourcing XC2S200-6FGG969C components:

  • Verify date codes and lot traceability
  • Request certificates of conformance
  • Validate package markings against datasheets
  • Source from reputable suppliers to avoid counterfeit parts

Technical Support and Documentation

Available Resources

Access comprehensive technical documentation:

  • Complete device datasheet (DS001)
  • Package pinout files
  • PCB layout guidelines
  • Power distribution recommendations
  • Thermal management guides

Community and Forums

Join the Xilinx FPGA community for:

  • Design examples and reference implementations
  • Troubleshooting assistance
  • Best practices sharing
  • Application notes

Summary

The XC2S200-6FGG969C represents an excellent choice for engineers seeking a proven, reliable FPGA solution with 200,000 system gates and 5,292 logic cells. Its balance of performance, cost-effectiveness, and flexibility makes it ideal for industrial automation, embedded systems, communications infrastructure, and digital signal processing applications.

With comprehensive development tool support, extensive I/O capabilities, and flexible configuration options, the XC2S200-6FGG969C enables rapid development cycles while maintaining the ability to update and optimize designs in the field. Whether you’re prototyping new concepts or deploying production systems, this Spartan-II FPGA delivers the resources and reliability your project demands.

For detailed specifications, procurement information, and technical support for the XC2S200-6FGG969C and other Spartan-II family members, consult the official AMD Xilinx documentation and authorized distribution partners.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.