Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG967C: High-Performance Spartan-II FPGA for Advanced Digital Design

Product Details

The XC2S200-6FGG967C is a professional-grade Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, manufactured by Xilinx (now AMD). This versatile programmable logic device delivers exceptional performance with 200,000 system gates, making it an ideal solution for telecommunications, industrial automation, automotive electronics, and embedded system applications. The XC2S200-6FGG967C combines high-speed operation, flexible architecture, and cost-effective programmability in a fine-pitch ball grid array package.

Overview of XC2S200-6FGG967C Spartan-II FPGA

The XC2S200-6FGG967C represents the pinnacle of second-generation Spartan FPGA technology, offering designers a powerful alternative to traditional ASIC solutions. With its -6 speed grade designation, this FPGA provides maximum performance for timing-critical applications while maintaining the flexibility and reprogrammability that makes FPGAs indispensable in modern electronic design.

Key Features of XC2S200-6FGG967C

  • 200,000 System Gates for complex logic implementation
  • 5,292 Logic Cells with advanced CLB architecture
  • Speed Grade -6 for highest performance operation (263 MHz+)
  • 75,264 Distributed RAM Bits for embedded memory
  • 56K Block RAM for efficient data storage
  • FGG967 Package – Fine-pitch Ball Grid Array with 967 pins
  • 2.5V Core Voltage for low power consumption
  • 0.18-micron CMOS Technology ensuring reliability
  • Commercial Temperature Range (-6 grade exclusive)

Technical Specifications

XC2S200-6FGG967C Core Architecture

Specification Value
Device Family Spartan-II
Part Number XC2S200-6FGG967C
Logic Cells 5,292
System Gates 200,000
CLB Array 28 × 42 (1,176 total CLBs)
Speed Grade -6 (Fastest)
Process Technology 0.18μm CMOS
Core Voltage 2.5V
Maximum Frequency 263 MHz+

Memory Resources Table

Memory Type Capacity Configuration
Distributed RAM 75,264 bits 16 bits per LUT
Block RAM 56K bits Configurable 4K blocks
Total RAM Bits 131,264 bits Combined resources
SelectRAM™ Hierarchical Flexible allocation

Package and I/O Specifications

Parameter Specification
Package Type FGG967 (Fine-pitch BGA)
Total Pins 967
Maximum User I/O 284+ (package dependent)
Package Material Lead-free compatible
Ball Pitch Fine-pitch configuration
Thermal Performance Enhanced heat dissipation

XC2S200-6FGG967C Performance Characteristics

Speed and Timing Performance

The XC2S200-6FGG967C with -6 speed grade delivers industry-leading performance for Spartan-II FPGAs:

  • Internal Clock Speed: Up to 263 MHz
  • System Performance: Supports up to 200 MHz system operation
  • Propagation Delay: Optimized for high-speed applications
  • Setup/Hold Times: Minimum timing requirements for reliable operation

Power Consumption Profile

Operating Mode Typical Power Maximum Power
Active (Full Load) TBD by design Design dependent
Standby Mode Ultra-low CMOS leakage only
Dynamic Power Varies with utilization Clock and logic dependent

Applications and Use Cases

Primary Application Areas

The XC2S200-6FGG967C excels in numerous demanding applications:

Telecommunications Equipment

  • Digital signal processing
  • Protocol converters
  • Communication interfaces
  • Network switching systems

Industrial Control Systems

  • Motor control applications
  • Process automation
  • Sensor interfacing
  • PLC functionality

Automotive Electronics

  • Engine management systems
  • Dashboard controllers
  • ADAS components
  • Infotainment systems

Consumer Electronics

  • Video processing
  • Audio equipment
  • Gaming systems
  • Display controllers

Medical Devices

  • Diagnostic equipment
  • Patient monitoring
  • Imaging systems
  • Laboratory instruments

Design Features and Capabilities

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG967C features 1,176 CLBs arranged in a 28×42 array, each containing:

  • 4-input Look-Up Tables (LUTs)
  • Fast carry logic chains
  • Distributed RAM capability
  • Shift register implementation
  • Dedicated multiplexers

I/O Architecture

I/O Feature Capability
I/O Standards LVTTL, LVCMOS, PCI, GTL+
Voltage Support 1.8V to 3.3V
Programmable Drive 2mA to 24mA
Slew Rate Control Fast and slow options
Input Thresholds Programmable VREF

Embedded Memory System

The SelectRAM™ hierarchical memory architecture provides:

  • Distributed RAM: 75,264 bits using LUT resources
  • Block RAM: 56K bits in dedicated memory blocks
  • Dual-port capability for simultaneous access
  • Configurable data widths from 1 to 16 bits

Programming and Configuration

Configuration Options

Configuration Method Description
Master Serial FPGA controls configuration PROM
Slave Serial External processor controls configuration
Master Parallel 8-bit parallel configuration
Slave Parallel SelectMAP interface
JTAG Boundary Scan IEEE 1149.1 compliant

Development Tools Support

  • Vivado Design Suite compatibility
  • ISE Design Suite legacy support
  • Third-party synthesis tools integration
  • Simulation tool compatibility (ModelSim, VCS, etc.)

Advantages Over ASIC Solutions

Why Choose XC2S200-6FGG967C Over ASICs?

Advantage Benefit
No NRE Costs Eliminate mask and tooling expenses
Rapid Prototyping Hours to deployment vs. months
Field Upgrades Update firmware without hardware changes
Design Flexibility Modify and iterate quickly
Lower Risk No minimum order quantities
Faster Time-to-Market Immediate availability

Ordering and Availability

Part Number Breakdown

XC2S200-6FGG967C decoding:

  • XC2S200: Device family and gate count (200K gates)
  • -6: Speed grade (fastest commercial grade)
  • FGG967: Package type (967-pin Fine-pitch BGA)
  • C: Commercial temperature range (0°C to +85°C)

Quality and Reliability

  • RoHS Compliant: Lead-free packaging available
  • Automotive Grade: AEC-Q100 qualified versions available
  • Extended Temperature: Industrial variants (-40°C to +100°C)
  • Long-term Support: Established production lineage

Xilinx FPGA Design Resources

When implementing the XC2S200-6FGG967C in your designs, access comprehensive resources including:

  • Complete datasheets and technical documentation
  • Application notes and reference designs
  • PCB layout guidelines
  • Thermal management recommendations
  • Power supply design guides

Comparison with Other Spartan-II Devices

XC2S200 vs. Other Spartan-II Family Members

Device Logic Cells System Gates CLBs Max I/O Block RAM
XC2S15 432 15,000 96 86 16K
XC2S30 972 30,000 216 92 24K
XC2S50 1,728 50,000 384 176 32K
XC2S100 2,700 100,000 600 176 40K
XC2S150 3,888 150,000 864 260 48K
XC2S200 5,292 200,000 1,176 284 56K

Design Considerations

PCB Layout Guidelines

For optimal XC2S200-6FGG967C performance:

Power Supply Design

  • Multiple decoupling capacitors per power plane
  • Dedicated 2.5V core voltage regulator
  • Separate I/O bank power supplies
  • Low-impedance power distribution

Signal Integrity

  • Controlled impedance traces for high-speed signals
  • Proper termination for clock networks
  • Ground plane continuity
  • Via minimization on critical paths

Thermal Management

  • Adequate airflow across package
  • Thermal vias under BGA
  • Heat sink consideration for high utilization
  • Temperature monitoring circuits

Technical Support and Documentation

Available Resources

Resource Type Description
Datasheet Complete electrical specifications
User Guide Implementation guidelines
Application Notes Design best practices
Reference Designs Proven implementation examples
PCB Footprints CAD library components
Simulation Models IBIS and timing models

Frequently Asked Questions

What is the difference between XC2S200-6 and XC2S200-5?

The -6 speed grade offers faster performance than -5, with lower propagation delays and higher maximum frequency operation. The -6 grade is exclusively available in commercial temperature range.

Can the XC2S200-6FGG967C be reprogrammed?

Yes, the XC2S200-6FGG967C features unlimited reprogrammability, allowing design updates and modifications without hardware replacement.

What development tools are required?

Xilinx ISE Design Suite or Vivado (with compatibility mode) are recommended. The device supports industry-standard synthesis, simulation, and implementation tools.

Is the XC2S200-6FGG967C suitable for new designs?

While the Spartan-II family is mature technology, it remains suitable for cost-sensitive applications. For new high-performance designs, consider newer FPGA families with advanced features.

What is the typical lead time for XC2S200-6FGG967C?

Availability varies by distributor and current inventory. Contact authorized distributors for current stock levels and delivery schedules.

Competitive Advantages

Why XC2S200-6FGG967C Stands Out

The XC2S200-6FGG967C delivers compelling advantages:

  • Proven Technology: Mature, reliable platform with extensive design history
  • Cost-Effective: Exceptional price-to-performance ratio
  • Rich Ecosystem: Abundant reference designs and community support
  • Broad Availability: Multiple distribution channels worldwide
  • Design Security: Bitstream encryption and protection features

Environmental and Compliance

Standards Compliance

Standard Status
RoHS Compliant (lead-free options)
REACH Compliant
Conflict Minerals Compliant reporting
ISO 9001 Manufacturing certified

Summary

The XC2S200-6FGG967C Spartan-II FPGA represents an excellent choice for designers requiring high-performance programmable logic in a cost-effective package. With 200,000 system gates, 5,292 logic cells, and the fastest -6 speed grade, this device handles complex digital designs across telecommunications, industrial, automotive, and consumer applications.

The fine-pitch BGA package with 967 pins provides extensive I/O capabilities while maintaining compact board footprint. Combined with flexible configuration options, unlimited reprogrammability, and robust development tool support, the XC2S200-6FGG967C delivers the versatility and performance modern embedded systems demand.

Whether you’re designing communication infrastructure, industrial controllers, or advanced embedded systems, the XC2S200-6FGG967C offers the resources, performance, and reliability to bring your vision to reality. Its proven architecture, comprehensive documentation, and worldwide support make it a dependable foundation for critical applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.