The XC2S200-6FGG966C is a powerful field-programmable gate array (FPGA) from Xilinx’s acclaimed Spartan-II family, delivering 200,000 system gates in a compact, cost-effective package. This commercial-grade FPGA combines exceptional performance with proven reliability, making it an ideal choice for embedded systems, digital signal processing, and rapid prototyping applications.

Overview of XC2S200-6FGG966C FPGA

The XC2S200-6FGG966C represents a superior alternative to traditional mask-programmed ASICs, offering design flexibility without the high initial costs and lengthy development cycles. Built on advanced 0.18μm process technology, this Xilinx FPGA delivers robust functionality with 5,292 logic cells and operates at commercial temperature ranges with -6 speed grade performance.

Key Technical Specifications

Core Architecture Features

Memory Resources

XC2S200 Spartan-II FPGA Architecture

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG966C features a comprehensive array of Configurable Logic Blocks arranged in a 28×42 matrix, providing 1,176 CLBs for implementing complex digital logic. Each CLB contains four logic slices with lookup tables (LUTs), multiplexers, and dedicated carry logic for arithmetic operations.

Input/Output Capabilities

With 284 maximum user I/O pins, the XC2S200-6FGG966C FPGA provides exceptional connectivity for interfacing with external devices. The 456-ball Fine-Pitch BGA package ensures reliable signal integrity while maintaining a compact footprint suitable for space-constrained designs.

Delay-Locked Loops (DLLs)

Four strategically positioned Delay-Locked Loops, located at each corner of the die, enable precise clock management and distribution. These DLLs support clock multiplication, division, and phase shifting for advanced timing control.

Performance Specifications

Operating Parameters

Applications and Use Cases

Industrial Automation

The XC2S200-6FGG966C Spartan-II FPGA excels in industrial control systems, providing reliable logic implementation for:

• Motor control and drive systems
• Programmable logic controllers (PLCs)
• Industrial communication protocols
• Real-time monitoring systems

Digital Signal Processing

With ample distributed RAM and dedicated block RAM, this FPGA handles DSP applications including:

• Digital filtering and signal conditioning
• Audio/video processing
• Data acquisition systems
• Telecommunications infrastructure

Embedded System Development

Engineers leverage the XC2S200-6FGG966C for:

• Rapid prototyping and proof-of-concept designs
• Custom peripheral interfaces
• System-on-chip (SoC) implementations
• Hardware acceleration

Package and Pin Configuration

Design Resources and Development Support

Compatible Development Tools

The XC2S200-6FGG966C integrates seamlessly with Xilinx ISE Design Suite, providing:

• HDL synthesis (VHDL, Verilog)
• Timing analysis and constraint management
• Implementation and place-and-route tools
• Configuration and programming utilities

Programming Options

Multiple configuration methods support diverse application requirements:

• JTAG boundary-scan programming
• Master/Slave serial configuration
• SelectMAP parallel configuration
• SPI flash memory boot

Comparison with Spartan-II Family Members

Advantages Over Traditional ASICs

Cost-Effective Solution

The XC2S200-6FGG966C eliminates substantial NRE (Non-Recurring Engineering) costs associated with ASIC development. With no mask fees or minimum order quantities, this FPGA provides immediate cost savings for low-to-medium volume production.

Design Flexibility

In-field reprogrammability enables:

• Feature upgrades without hardware changes
• Bug fixes and design iterations
• Product customization for different markets
• Extended product lifecycle management

Reduced Time-to-Market

Compared to ASIC development cycles of 6-12 months, FPGA-based designs can be completed in weeks, accelerating product launches and competitive advantage.

Reliability and Quality

Manufacturing Standards

Xilinx Spartan-II FPGAs undergo rigorous testing and quality control:

• 100% production testing
• Extended temperature burn-in available
• Automotive-grade options (contact manufacturer)
• ISO 9001 certified manufacturing

Long-Term Availability

The Spartan-II family maintains strong market presence with extended product lifecycle support, ensuring component availability for mission-critical applications.

Ordering Information and Variants

The XC2S200 is available in multiple speed grades and package options:

Speed Grade Options

• -5: Standard performance
• -6: Enhanced speed (commercial temperature only)

Package Alternatives

• FG256/FGG256: 256-pin Fine-Pitch BGA
• PQ208/PQG208: 208-pin Plastic Quad Flat Pack
• FG456/FGG456: 456-pin Fine-Pitch BGA (this variant)

Temperature Grades

• C: Commercial (0°C to +85°C)
• I: Industrial (-40°C to +100°C)

Technical Support and Documentation

Comprehensive technical resources available for XC2S200-6FGG966C include:

• Complete datasheet with electrical specifications
• Application notes and design guides
• Reference designs and example code
• PCB layout guidelines for FGG456 package
• Thermal management recommendations

Conclusion

The XC2S200-6FGG966C Spartan-II FPGA delivers exceptional value for designers requiring 200K gates of programmable logic in a proven, reliable platform. Whether developing industrial controllers, communications equipment, or digital signal processing systems, this FPGA provides the performance, flexibility, and cost-effectiveness needed for successful product deployment.

With its robust architecture, comprehensive I/O capabilities, and extensive development tool support, the XC2S200-6FGG966C continues to serve as a versatile solution for embedded system designers worldwide.