The XC2S200-6FGG965C is a powerful field-programmable gate array from Xilinx’s acclaimed Spartan-II family, engineered to deliver exceptional performance for demanding embedded systems and digital logic applications. This high-speed FPGA combines 200,000 system gates with advanced programmable architecture, making it an ideal solution for telecommunications, industrial automation, and complex digital design projects.
Key Features and Specifications
The XC2S200-6FGG965C stands out in the Xilinx FPGA product line with its robust feature set and commercial-grade reliability. Below are the core specifications that make this device exceptional:
| Feature |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Speed Grade |
-6 (Fastest available) |
| Package Type |
FGG965 (Fine-pitch BGA) |
| Total Pins |
965 |
| Temperature Range |
Commercial (0°C to +85°C) |
| Core Voltage |
2.5V |
Technical Specifications Overview
Logic and Memory Resources
The XC2S200-6FGG965C provides substantial programmable resources for complex digital designs:
| Resource Type |
Capacity |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Configurable Logic Blocks |
1,176 CLBs |
| Logic Cells |
5,292 cells |
| Maximum Clock Frequency |
Up to 200 MHz |
Speed Grade and Performance
The -6 speed grade designation indicates this is the fastest variant in the XC2S200 series, offering:
- Maximum system performance up to 200 MHz
- Optimized signal propagation delays
- Enhanced timing margins for critical path designs
- Superior performance for high-speed digital applications
- Exclusive availability in commercial temperature range
Package Information: FGG965
Fine-Pitch Ball Grid Array Advantages
The FGG965 package offers significant benefits for advanced PCB designs:
| Package Feature |
Description |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Total Balls |
965 pins |
| Pitch |
Fine-pitch configuration |
| Thermal Performance |
Enhanced heat dissipation |
| PCB Compatibility |
Optimized for high-density boards |
| Signal Integrity |
Reduced inductance and improved electrical characteristics |
The fine-pitch BGA configuration enables high I/O density while maintaining excellent electrical performance and thermal management capabilities.
Core Architecture and Design Features
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG965C features 1,176 CLBs arranged in a 28 x 42 array, providing:
- Flexible logic implementation
- Efficient resource utilization
- Support for complex combinatorial and sequential logic
- Integrated look-up tables (LUTs)
- Fast carry logic for arithmetic operations
Input/Output Blocks (IOBs)
With 284 maximum available user I/O pins, this FPGA supports:
- Multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+)
- Programmable drive strength
- Slew rate control
- Individual pin configuration
- On-chip termination options
Memory Architecture
Dual memory system for optimal performance:
- Distributed RAM: 75,264 bits for small, fast memory structures
- Block RAM: 56K bits for larger memory requirements
- Flexible memory configuration options
- Dual-port RAM capability
Applications and Use Cases
The XC2S200-6FGG965C excels in various industrial and commercial applications:
Industrial Automation
- Programmable logic controllers (PLCs)
- Motor control systems
- Factory automation equipment
- Sensor interface processing
- Real-time control systems
Telecommunications
- Digital signal processing
- Protocol conversion
- Network switching equipment
- Wireless base stations
- Communication interfaces
Embedded Systems
- Custom computing solutions
- Data acquisition systems
- High-speed data processing
- Interface bridging
- System control logic
Consumer Electronics
- Digital video processing
- Audio equipment
- Gaming peripherals
- Smart home devices
- IoT edge computing
Development and Programming Support
Design Tools Compatibility
The XC2S200-6FGG965C is supported by Xilinx’s comprehensive development ecosystem:
- ISE Design Suite: Legacy development environment
- Vivado Design Suite: Modern synthesis and implementation
- ChipScope Pro: Integrated logic analyzer
- Impact: Configuration and debugging tool
Configuration Methods
Multiple configuration options provide flexibility:
| Configuration Mode |
Description |
| JTAG |
Industry-standard boundary scan |
| Master Serial |
Direct PROM programming |
| Slave Serial |
External processor configuration |
| Boundary Scan |
Testing and programming |
Why Choose the XC2S200-6FGG965C?
Superior Performance Benefits
- Cost-Effective Alternative to ASICs: Eliminates high NRE costs and lengthy development cycles
- Field Upgradeable: Update designs without hardware replacement
- Proven Architecture: Based on reliable Spartan-II technology
- High-Speed Operation: -6 speed grade ensures maximum performance
- Comprehensive I/O: 284 user I/O pins for complex interfacing
Reliability and Quality
- Manufactured using advanced 0.18μm CMOS technology
- Rigorous quality control and testing
- Wide commercial temperature range operation
- Long product lifecycle support
- Extensive documentation and application notes
Competitive Advantages
The XC2S200-6FGG965C offers distinct advantages over competing FPGAs:
- Maximum Speed Grade: The -6 variant delivers the fastest performance in the family
- Large Pin Count: 965-pin package accommodates high I/O designs
- Balanced Resources: Optimal ratio of logic, memory, and I/O
- Proven Reliability: Deployed in thousands of commercial applications
- Strong Ecosystem: Extensive third-party IP and development board support
Power Consumption Characteristics
Efficient power management for modern designs:
- 2.5V core voltage operation
- Multiple power-saving modes
- Optimized for low standby power
- Configurable I/O standards for power optimization
- Thermal management features
Technical Support and Documentation
Comprehensive resources available for XC2S200-6FGG965C implementation:
- Complete datasheet with electrical specifications
- User guides and reference manuals
- Application notes for common design patterns
- PCB layout guidelines
- Power supply design recommendations
- Thermal analysis documentation
Conclusion
The XC2S200-6FGG965C represents an excellent choice for engineers requiring high-performance programmable logic with extensive I/O capabilities. Combining 200,000 system gates, 5,292 logic cells, and the fastest -6 speed grade, this Spartan-II FPGA delivers the performance, flexibility, and reliability needed for demanding applications. Whether you’re designing telecommunications equipment, industrial control systems, or embedded computing solutions, the XC2S200-6FGG965C provides the resources and performance to bring your vision to reality.
