Overview of XC2S200-6FGG963C FPGA

The XC2S200-6FGG963C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance for demanding digital processing applications. This FPGA combines 200,000 system gates with 5,292 logic cells in a high-density 963-ball Fine-Pitch Ball Grid Array (FBGA) package, making it an ideal solution for communications, industrial automation, medical devices, and embedded systems.

As part of the Spartan-II series, the XC2S200-6FGG963C offers a cost-effective alternative to traditional mask-programmed ASICs while providing the flexibility of field-upgradable programmability. Engineers and designers seeking reliable, high-performance Xilinx FPGA solutions will find this device particularly suited for complex digital designs requiring extensive I/O capabilities and robust processing power.

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Key Technical Specifications

Core Performance Features

Memory Architecture Details

Package and Pin Configuration

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XC2S200-6FGG963C Architecture and Design

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG963C features a 28 x 42 array of Configurable Logic Blocks, providing 1,176 CLBs for implementing complex digital circuits. Each CLB contains:

• Look-Up Tables (LUTs): 4-input function generators for combinational logic
• Flip-Flops: Synchronous storage elements with clock enable and reset
• Multiplexers: Flexible routing within each CLB
• Distributed RAM: Configurable as 16-bit shift registers or small RAM blocks

This architecture enables designers to implement sophisticated algorithms, state machines, arithmetic functions, and custom processing pipelines efficiently.

Input/Output Capabilities

With up to 284 user I/O pins, the XC2S200-6FGG963C provides exceptional connectivity options:

• Multiple I/O standards support (LVTTL, LVCMOS, PCI, etc.)
• Programmable slew rate control
• Tri-state capability on all I/O pins
• Input and output registers for high-speed synchronous interfaces
• Four dedicated global clock inputs with low-skew distribution

Delay-Locked Loops (DLLs)

Four integrated Delay-Locked Loops positioned at each corner of the die provide:

• Precision clock de-skewing and multiplication
• Duty cycle correction
• Programmable phase shifting
• Low-jitter clock distribution for high-speed designs

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Performance Specifications

Speed Grade -6 Characteristics

The -6 speed grade represents the fastest performance tier available in the Spartan-II XC2S200 family:

Power Consumption

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Target Applications for XC2S200-6FGG963C

Digital Communications Systems

The XC2S200-6FGG963C excels in telecommunications applications:

• Protocol Implementation: Custom protocol engines for proprietary communications
• Signal Processing: Digital filters, modulators, and demodulators
• Network Infrastructure: Packet processing and routing logic
• Interface Bridging: Protocol conversion between different standards

Industrial Automation and Control

Manufacturing and process control benefit from the FPGA’s reliability:

• Motor Control: Precise PWM generation and feedback processing
• Sensor Integration: Multi-sensor data acquisition and fusion
• PLC Functions: Programmable logic controller implementation
• Real-Time Control: Deterministic control loops with microsecond precision

Medical Electronics

Healthcare devices leverage the XC2S200-6FGG963C’s processing capabilities:

• Imaging Systems: Real-time image processing and enhancement
• Patient Monitoring: Multi-parameter vital sign processing
• Diagnostic Equipment: Signal analysis and pattern recognition
• Laboratory Instruments: Automated testing and measurement systems

Embedded Computing

Embedded systems designers utilize this FPGA for:

• Co-Processing: Hardware acceleration alongside microprocessors
• Custom Peripherals: Application-specific interface controllers
• Data Acquisition: High-speed ADC/DAC interfacing
• System Integration: Bridging multiple subsystem interfaces

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Design Tools and Development Support

Xilinx ISE Design Suite

The XC2S200-6FGG963C is supported by Xilinx ISE (Integrated Software Environment):

• Synthesis Tools: XST (Xilinx Synthesis Technology) for HDL compilation
• Implementation: Place-and-route optimization for timing closure
• Simulation: Integrated ModelSim for functional and timing verification
• Constraints: UCF (User Constraints File) for pin assignments and timing

Programming and Configuration

Multiple configuration options provide flexibility:

• JTAG: Boundary-scan programming and debugging
• Master Serial Mode: Direct SPI Flash boot
• Slave Serial Mode: External controller-based configuration
• SelectMAP: High-speed parallel configuration interface

Hardware Development Resources

Designers can access:

• Comprehensive datasheets and application notes
• Reference designs and IP cores
• Third-party development boards supporting Spartan-II
• Community forums and technical support channels

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Advantages of XC2S200-6FGG963C Over ASICs

Development Cost Savings

Flexibility and Upgradability

Unlike ASICs, the XC2S200-6FGG963C enables:

• In-Field Updates: Design modifications without hardware changes
• Feature Enhancement: Adding functionality post-deployment
• Bug Fixes: Correcting errors through firmware updates
• Product Differentiation: Single hardware with software-defined features

Risk Mitigation

Programmable logic reduces project risks:

• No commitment to fixed silicon
• Prototype validation before production
• Specification changes accommodation
• Market demand adaptation

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Comparison with Other Spartan-II Family Members

XC2S200 Position in Product Line

The XC2S200 represents the flagship device in the Spartan-II family, offering maximum resources for complex applications.

Speed Grade Options

The -6 speed grade is exclusively available for commercial temperature range, providing the highest performance for non-industrial applications.

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Package Information: FGG963 FBGA

Fine-Pitch Ball Grid Array Benefits

The FGG963 package provides several advantages:

• High I/O Density: Maximum pin count in compact footprint
• Thermal Performance: Efficient heat dissipation through bottom side
• Signal Integrity: Short bond wire lengths minimize inductance
• PCB Design: Compatible with standard BGA assembly processes
• Reliability: Robust solder ball connections for shock/vibration resistance

PCB Design Considerations

When designing with the XC2S200-6FGG963C:

• Layer Stack-Up: Minimum 6-layer PCB recommended
• Via Technology: Blind/buried vias for routing dense ball grid
• Power Distribution: Dedicated power planes for VCCINT and VCCO
• Decoupling: Multiple ceramic capacitors near power balls
• Thermal Management: Consider heatsink or thermal vias for high-power designs

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Quality and Reliability

Manufacturing Standards

The XC2S200-6FGG963C is manufactured to rigorous quality standards:

• Process Technology: 0.18μm CMOS for consistent performance
• Testing: 100% functional and parametric testing
• Quality Certification: ISO 9001 compliant manufacturing
• Traceability: Full lot code and date code tracking

Environmental Compliance

Modern variants meet environmental requirements:

• RoHS Compliant: Lead-free packaging options (FGG963C designation)
• REACH Compliance: Restricted substance monitoring
• Conflict Minerals: Responsible sourcing practices

Reliability Metrics

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Getting Started with XC2S200-6FGG963C

Development Flow Overview

1. Specification: Define system requirements and architecture
2. Design Entry: Create HDL code (Verilog/VHDL) or schematic capture
3. Simulation: Verify functionality with testbenches
4. Synthesis: Convert HDL to gate-level netlist
5. Implementation: Place and route with timing constraints
6. Verification: Timing analysis and post-implementation simulation
7. Programming: Generate bitstream and configure device
8. Testing: Validate hardware operation

Essential Design Resources

• Datasheet: Complete electrical and timing specifications
• Packaging Information: Mechanical drawings and pinout details
• Application Notes: Design guidelines and best practices
• Reference Designs: Example implementations for common functions
• IP Cores: Pre-verified building blocks (FIFO, memory controllers, etc.)

Recommended Learning Path

For engineers new to Spartan-II FPGAs:

1. Review Xilinx ISE Design Suite tutorials
2. Study Spartan-II architecture documentation
3. Implement simple designs (counters, state machines)
4. Progress to interface implementations (UART, SPI, I2C)
5. Develop application-specific designs with IP integration

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Ordering Information and Part Number Breakdown

XC2S200-6FGG963C Designation

Understanding the part number structure:

• XC2S200: Device family and gate count (Spartan-II, 200K gates)
• -6: Speed grade (fastest commercial grade)
• FGG963: Package type (963-ball Fine-Pitch BGA with “G” for lead-free)
• C: Commercial temperature range (0°C to +85°C)

Alternative Suffixes

Availability Notes

• Commercial quantities available through authorized distributors
• Lead times vary based on demand and inventory
• Contact suppliers for volume pricing and delivery schedules
• Engineering samples may be available for qualification

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Frequently Asked Questions (FAQ)

What makes the XC2S200-6FGG963C suitable for my application?

The XC2S200-6FGG963C offers 200,000 system gates and 284 I/O pins, making it ideal for applications requiring substantial processing power and extensive external connectivity. The -6 speed grade ensures maximum performance for time-critical designs.

How does the XC2S200-6FGG963C compare to newer FPGA families?

While newer families like Spartan-3, Spartan-6, or 7-Series offer improved density and features, the Spartan-II XC2S200 remains a cost-effective solution for legacy designs and applications not requiring cutting-edge performance. It provides proven reliability and extensive design resources.

What development tools do I need?

Xilinx ISE Design Suite is the primary development environment for Spartan-II devices. For newer operating systems, consider running ISE in a virtual machine or using compatible synthesis tools with ISE for implementation.

Can I migrate designs from other FPGAs?

Design migration depends on HDL coding practices. Well-structured, portable HDL code can typically be retargeted to the XC2S200-6FGG963C with pin assignment and timing constraint updates. Device-specific IP cores may require modification.

What is the expected product lifetime?

The Spartan-II family is mature but not yet obsolete. AMD Xilinx provides product change notifications (PCNs) and last-time-buy notices well in advance of discontinuation. For new designs with long product lifecycles, consider newer families with guaranteed availability.

How do I handle thermal management?

Calculate power dissipation using Xilinx XPower tools based on your design’s switching activity. For typical applications at 2.5V core voltage, passive cooling with copper PCB planes may suffice. High-utilization designs may require heatsinks or forced airflow.

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Conclusion: Why Choose XC2S200-6FGG963C

The XC2S200-6FGG963C represents a proven, high-performance FPGA solution for engineers seeking reliable programmable logic with extensive I/O capabilities. With 200,000 system gates, 5,292 logic cells, and 284 user I/O pins in a compact 963-ball FBGA package, this device addresses demanding applications across communications, industrial, medical, and embedded systems markets.

Key advantages include:

• Maximum Spartan-II Resources: Largest device in the family for complex designs
• Speed Grade -6 Performance: Fastest commercial-grade option available
• Extensive I/O Capability: 284 pins for high-connectivity applications
• Cost-Effective Alternative: Avoids ASIC NRE costs and development risks
• Field Programmability: Enables updates and modifications post-deployment
• Proven Architecture: Mature platform with extensive design resources

Whether you’re designing next-generation communications equipment, upgrading industrial control systems, developing medical instrumentation, or creating custom embedded solutions, the XC2S200-6FGG963C delivers the performance, flexibility, and reliability your project demands.

For more information about implementing Xilinx FPGAs in your designs, explore our comprehensive Xilinx FPGA resource center.