Overview of XC2S200-6FGG962C FPGA
The XC2S200-6FGG962C is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This versatile programmable logic device delivers exceptional processing capabilities with 200,000 system gates and 5,292 logic cells, making it an ideal solution for complex digital applications across telecommunications, industrial automation, medical devices, and embedded systems.
As a cost-effective alternative to traditional ASICs, the XC2S200-6FGG962C eliminates lengthy development cycles and high initial tooling costs while providing the flexibility to upgrade designs in the field without hardware replacement.
Key Technical Specifications
Core Performance Features
| Specification |
Value |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum Clock Frequency |
263 MHz |
| Process Technology |
0.18 µm CMOS |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (high performance) |
| Operating Temperature |
Commercial (0°C to +85°C) |
Memory Architecture
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (56,000 bits) |
| Total On-Chip Memory |
131,264 bits |
Package and I/O Characteristics
| Feature |
Specification |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Pin Count |
962-pin configuration |
| Maximum User I/O |
284 I/O pins |
| Global Clock Inputs |
4 dedicated pins |
| RoHS Compliance |
Lead-free available (G suffix) |
Advanced Architecture and Design Flexibility
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG962C features a robust array of Configurable Logic Blocks arranged in a 28 x 42 matrix, providing 1,176 CLBs for implementing complex digital logic. Each CLB contains:
- Look-Up Tables (LUTs) for flexible logic implementation
- Dedicated flip-flops for sequential logic
- Fast carry logic for arithmetic operations
- Internal multiplexers for efficient routing
Memory Resources
This Xilinx FPGA integrates dual memory architectures to meet diverse application requirements:
Block RAM: The 56 Kbits of block RAM provides high-speed data buffering and storage, perfect for applications requiring fast memory access, such as digital signal processing, image processing, and communication protocol handling.
Distributed RAM: With 75,264 bits of distributed RAM embedded within the logic fabric, designers can implement small memory arrays, FIFOs, and lookup tables directly within the CLB structure for optimal performance.
Input/Output Architecture
The comprehensive I/O architecture supports multiple standards and features:
- Up to 284 user-programmable I/O pins
- Support for various I/O standards (LVTTL, LVCMOS, PCI, GTL+)
- Programmable drive strength and slew rate control
- Individual I/O flip-flops for improved timing performance
- Hot-swappable capability for live system insertion
Clock Management System
Four Delay-Locked Loops (DLLs) positioned at each corner of the die provide advanced clock management:
- Clock deskewing and phase shifting
- Frequency multiplication and division
- Low-jitter clock distribution
- Multiple clock domains support
Application Areas and Use Cases
Telecommunications and Networking
The XC2S200-6FGG962C excels in communication systems requiring:
- Protocol implementation (Ethernet, USB, PCIe)
- Data encoding and decoding
- Channel coding and error correction
- Network packet processing
- Software-defined radio components
Industrial Automation and Control
Perfect for industrial applications demanding:
- Motor control systems
- PLC (Programmable Logic Controller) implementations
- Process control and monitoring
- Real-time data acquisition
- Sensor interface and signal conditioning
Medical Equipment
Ideal for medical device applications including:
- Medical imaging systems
- Patient monitoring equipment
- Diagnostic instrumentation
- Ultrasound signal processing
- Laboratory analysis systems
Consumer Electronics
Suitable for various consumer applications:
- Digital video processing
- Audio DSP applications
- Display controllers
- Camera interface systems
- Gaming and entertainment devices
Automotive Systems
Deployed in automotive electronics for:
- Advanced driver assistance systems (ADAS)
- Infotainment control
- Sensor fusion applications
- Vehicle communication networks
- Engine control systems
Performance Advantages
Speed Grade -6 Benefits
The -6 speed grade designation indicates this FPGA operates at the highest performance tier within the Spartan-II family:
- Maximum operating frequency of 263 MHz
- Optimized for high-speed data path applications
- Reduced propagation delays through logic elements
- Enhanced setup and hold time characteristics
Power Efficiency
Operating at 2.5V core voltage, the XC2S200-6FGG962C delivers:
- Lower power consumption compared to older FPGA generations
- Reduced thermal management requirements
- Extended battery life in portable applications
- Cost-effective power supply design
Development and Design Tools
Xilinx ISE Design Suite
Primary development environment supporting:
- HDL synthesis (VHDL and Verilog)
- Place and route optimization
- Timing analysis and constraint management
- Simulation and verification
- BitGen configuration file generation
Alternative Development Options
Modern designers can also utilize:
- Vivado Design Suite (for newer workflows)
- Third-party synthesis tools
- IP core integration
- Embedded processor support (MicroBlaze)
Comparison Table: XC2S200 vs. Other Spartan-II Devices
| Feature |
XC2S150 |
XC2S200 |
XC2S300 |
| Logic Cells |
3,888 |
5,292 |
7,776 |
| System Gates |
150K |
200K |
300K |
| CLB Array |
24 x 36 |
28 x 42 |
32 x 48 |
| Total CLBs |
864 |
1,176 |
1,536 |
| Block RAM |
48 Kbits |
56 Kbits |
64 Kbits |
| Max User I/O |
260 |
284 |
329 |
| Distributed RAM |
55,296 bits |
75,264 bits |
98,304 bits |
Why Choose XC2S200-6FGG962C?
Cost-Effective ASIC Alternative
Unlike traditional ASICs, the XC2S200-6FGG962C offers:
- No NRE costs: Eliminate expensive mask sets and fabrication setup
- Rapid prototyping: Test and validate designs within days, not months
- Reduced risk: Modify designs after production without hardware changes
- Lower minimum order quantities: Suitable for low to medium volume production
Design Flexibility
Programmable architecture enables:
- In-field upgrades and bug fixes
- Feature additions without hardware redesign
- Algorithm optimization post-deployment
- Multi-generational product support
Time-to-Market Advantage
Accelerate product development through:
- Immediate design iteration
- Parallel hardware/software development
- Reduced qualification cycles
- Faster response to market changes
Pin Configuration and Package Details
FBGA Package Characteristics
The Fine-pitch Ball Grid Array package provides:
- Compact footprint: Space-efficient design for dense PCB layouts
- Excellent thermal performance: Efficient heat dissipation
- High pin density: 962 balls for maximum I/O utilization
- Reliable connections: Reduced susceptibility to mechanical stress
- Manufacturing friendly: Compatible with standard SMT assembly processes
Ball Grid Array Benefits
- Low inductance and capacitance for high-speed signaling
- Shorter signal paths reducing EMI
- Better power distribution network
- Improved signal integrity
- Enhanced electrical performance
Quality and Reliability
Manufacturing Standards
AMD Xilinx FPGAs undergo rigorous quality control:
- ISO 9001 certified manufacturing
- Automotive-grade options available (AEC-Q100)
- Extended temperature range variants
- Military and aerospace grade versions
Reliability Features
Built-in reliability mechanisms include:
- JTAG boundary scan for testing
- Configuration memory error detection
- Bitstream encryption capabilities
- Hot-swap support for live insertion
Procurement and Availability
Ordering Information
When ordering the XC2S200-6FGG962C, the part number breakdown is:
- XC2S200: Device family and gate count
- -6: Speed grade (highest performance)
- FGG: Fine-pitch Ball Grid Array with lead-free option
- 962: Pin count
- C: Commercial temperature range (0°C to +85°C)
Stock and Lead Times
The XC2S200 series is available through:
- Authorized AMD Xilinx distributors
- Electronic component suppliers
- Contract manufacturers
- Direct from manufacturer for large volumes
Technical Support and Resources
Documentation Available
Comprehensive technical resources include:
- Complete datasheet with electrical specifications
- User guide and reference manual
- Application notes and design examples
- PCB layout guidelines
- Thermal management guides
Design Resources
Access valuable design materials:
- IP cores and reference designs
- Development board schematics
- Example HDL code
- Timing models and simulation files
- IBIS models for signal integrity analysis
Environmental and Compliance
RoHS Compliance
The “G” variant (XC2S200-6FGG962C with G suffix) meets:
- European Union RoHS directives
- REACH compliance
- Halogen-free options available
- WEEE directive compliance
Export Control
Standard commercial grade devices comply with:
- US export control regulations
- ECCN classification for international shipping
- Country-specific import requirements
Legacy and Future-Proofing
Market Position
While the Spartan-II family is considered mature technology, the XC2S200 remains relevant for:
- Legacy system maintenance and upgrades
- Cost-sensitive applications
- Proven, reliable designs
- Long-term availability requirements
- Applications requiring established qualification
Migration Path
For new designs requiring enhanced performance, consider:
- Spartan-6 family: Improved performance and lower power
- Spartan-7 family: Latest generation with advanced features
- Artix-7 series: Higher capacity and modern architecture
Conclusion
The XC2S200-6FGG962C FPGA represents a proven, reliable solution for digital design challenges requiring 200,000 system gates and high-performance processing. Its combination of flexible architecture, comprehensive I/O capabilities, and robust memory resources makes it suitable for diverse applications across multiple industries.
Whether you’re developing communication systems, industrial control equipment, medical devices, or consumer electronics, the XC2S200-6FGG962C delivers the performance, flexibility, and reliability needed for successful product deployment. With extensive development tool support, comprehensive documentation, and worldwide availability, this Xilinx FPGA continues to serve engineers seeking a cost-effective programmable logic solution.
For detailed technical specifications, pricing information, and availability, consult authorized AMD Xilinx distributors or contact the manufacturer directly. The XC2S200-6FGG962C remains an excellent choice for both legacy design support and new projects where proven technology and cost-effectiveness are paramount considerations.
