Overview of XC2S200-6FGG952C FPGA
The XC2S200-6FGG952C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This advanced programmable logic device delivers exceptional performance with 200,000 system gates, making it an ideal solution for complex digital designs, embedded systems, and high-speed signal processing applications. Engineered with cutting-edge 0.18μm CMOS technology, this FPGA represents the perfect balance between performance, flexibility, and cost-effectiveness.
As part of the Spartan-II series, the XC2S200-6FGG952C offers designers a superior alternative to traditional mask-programmed ASICs, eliminating lengthy development cycles and high initial costs while providing field-programmable capabilities that enable design upgrades without hardware replacement.
Technical Specifications of XC2S200-6FGG952C
Core Performance Features
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum Operating Frequency |
263 MHz |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (56,320 bits) |
| Process Technology |
0.18μm CMOS |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
2.5V / 3.3V compatible |
Package and Pin Configuration
| Parameter |
Specification |
| Package Type |
FGG952 (Fine-Pitch BGA) |
| Total Pins |
952 pins |
| User I/O Pins |
284 (maximum available) |
| Speed Grade |
-6 (Commercial temperature range) |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Package Dimensions |
Fine-pitch ball grid array optimized for high-density designs |
Key Features and Advantages
Advanced Architecture Benefits
The XC2S200-6FGG952C incorporates a flexible, programmable architecture built around configurable logic blocks (CLBs) surrounded by programmable input/output blocks (IOBs). This design provides:
- High Logic Density: With 5,292 logic cells organized in a 28×42 CLB array, designers can implement complex digital functions efficiently
- Flexible Memory Options: Combines 75,264 bits of distributed RAM with 56 Kbits of block RAM for versatile data storage solutions
- Enhanced I/O Capabilities: 284 user I/O pins enable extensive interfacing options for system integration
- Speed-Optimized Design: -6 speed grade ensures reliable high-frequency operation up to 263 MHz
- 4 Delay-Locked Loops (DLLs): Positioned at each corner of the die for advanced clock management and signal timing control
Performance Characteristics
| Performance Metric |
Details |
| Logic Elements |
5,292 configurable logic cells |
| CLB Resources |
1,176 total configurable logic blocks |
| Memory Architecture |
Dual-tier (distributed + block RAM) |
| Clock Management |
4 DLL circuits for precision timing |
| I/O Standards Support |
Multiple voltage levels (2.5V/3.3V) |
| Configuration Options |
JTAG, Master/Slave Serial, SelectMAP |
Applications and Use Cases
Industrial Automation and Control
The XC2S200-6FGG952C excels in industrial environments where reliable, high-performance programmable logic is essential:
- Motor control systems with precise PWM generation
- Process automation and monitoring equipment
- Industrial communication protocol implementation
- Sensor interface and data acquisition systems
- Machine vision and inspection systems
Communication Systems
Perfect for telecommunications and networking applications:
- Protocol converter and bridge implementations
- Network router and switch fabric designs
- Data encryption and security processing
- High-speed serial communication interfaces
- Software-defined radio (SDR) baseband processing
Digital Signal Processing (DSP)
Ideal for real-time signal processing applications:
- Audio/video processing and compression
- Image enhancement and filtering algorithms
- Adaptive filtering and equalization
- Fast Fourier Transform (FFT) implementations
- Digital filtering and modulation/demodulation
Embedded Systems Development
Versatile platform for embedded applications:
- Custom peripheral controllers
- Hardware acceleration modules
- System-on-chip (SoC) prototyping
- ASIC verification and emulation
- Educational FPGA development platforms
Comparison: XC2S200 Package Options
| Package Type |
Total Pins |
User I/O |
Typical Applications |
| PQ208 |
208 |
140 |
Compact designs, prototyping |
| FG256 |
256 |
176 |
Medium-density applications |
| FG456 |
456 |
284 |
High I/O count requirements |
| FGG952 |
952 |
284 |
Maximum routing flexibility, complex PCB designs |
The FGG952 package offers the highest pin count in the XC2S200 family, providing exceptional PCB routing flexibility and superior thermal performance for demanding applications.
Design Resources and Development Tools
Software Support
Designers working with the XC2S200-6FGG952C can leverage AMD Xilinx’s comprehensive development ecosystem:
- Vivado Design Suite: Modern FPGA design environment with advanced synthesis and implementation
- ISE Design Tools: Legacy support for Spartan-II family devices
- IP Core Library: Pre-verified intellectual property blocks for rapid development
- ChipScope Pro: Integrated logic analyzer for real-time debugging
Programming and Configuration
| Configuration Mode |
Interface |
Features |
| JTAG |
IEEE 1149.1 |
Standard boundary-scan configuration |
| Master Serial |
SPI-like |
FPGA controls external PROM |
| Slave Serial |
Synchronous |
External controller driven |
| SelectMAP |
Parallel 8-bit |
High-speed configuration |
Quality and Reliability Standards
Manufacturing Excellence
- Process Technology: Advanced 0.18μm CMOS fabrication
- Quality Assurance: Comprehensive testing and validation procedures
- RoHS Compliance: Available in lead-free packaging variants (with “G” designation)
- Automotive Grade Options: Extended temperature range versions available for specific applications
Reliability Features
| Feature |
Benefit |
| SEU Immunity |
Configuration memory protected against single-event upsets |
| Voltage Monitoring |
Built-in power-on reset and voltage supervision |
| ESD Protection |
Human body model (HBM) and charged device model (CDM) certified |
| MTBF Rating |
Designed for long-term industrial operation |
Integration and Implementation
PCB Design Considerations
When incorporating the XC2S200-6FGG952C into your design:
- Power Supply Design: Provide clean 2.5V core voltage with appropriate decoupling capacitors
- Ball Grid Layout: Follow AMD Xilinx recommended PCB stackup for FGG952 package
- Thermal Management: Consider heatsink or thermal vias for applications exceeding 1W power dissipation
- Signal Integrity: Implement controlled impedance routing for high-speed signals
- Configuration Interface: Dedicate JTAG header for programming and debugging access
Power Consumption Profile
| Operating Mode |
Typical Power |
Maximum Power |
| Static (configured) |
50-100 mW |
150 mW |
| Dynamic (50% toggle) |
500-800 mW |
1.2 W |
| Peak Operation |
1.0-1.5 W |
2.0 W |
Note: Actual power consumption varies based on design utilization, operating frequency, and I/O activity
Why Choose XC2S200-6FGG952C?
Cost-Effective ASIC Alternative
The XC2S200-6FGG952C eliminates the substantial non-recurring engineering (NRE) costs associated with ASIC development. Design iterations can be implemented through simple FPGA reconfiguration, dramatically reducing time-to-market and development risk.
Design Flexibility and Future-Proofing
Field-programmable capability allows for:
- On-site firmware updates without hardware changes
- Bug fixes and feature enhancements post-deployment
- Design reuse across multiple product generations
- Rapid prototyping and iterative development cycles
Proven Technology Platform
As part of the widely-adopted Spartan-II family, the XC2S200 series benefits from:
- Extensive documentation and application notes
- Large community of experienced developers
- Mature design tools and IP ecosystem
- Long product lifecycle and availability
Technical Support and Resources
For comprehensive technical documentation, application notes, and design examples, engineers can access AMD Xilinx’s extensive support portal. The XC2S200-6FGG952C datasheet provides detailed electrical specifications, timing parameters, and package drawings essential for successful implementation.
Getting Started Resources
- Reference Designs: Sample projects demonstrating core functionality
- Application Notes: Best practices for common design challenges
- Technical Forums: Community support and knowledge sharing
- Training Materials: Webinars and tutorials for skill development
Ordering Information and Availability
Part Number Breakdown
XC2S200-6FGG952C
- XC2S200: Device family and logic density (200K gates)
- 6: Speed grade (commercial temperature)
- FGG952: Package type (952-ball fine-pitch BGA)
- C: Commercial temperature range (0°C to +85°C)
Lead-Free Options
For RoHS-compliant applications, specify the “G” variant: XC2S200-6FGG952CG
Maximize Your Design Potential with Xilinx FPGA
Whether you’re developing next-generation industrial controllers, implementing complex communication protocols, or creating custom signal processing solutions, the XC2S200-6FGG952C delivers the performance, flexibility, and reliability your project demands.
The combination of 200,000 system gates, 5,292 logic cells, comprehensive memory resources, and 284 user I/O pins in the high-density FGG952 package makes this FPGA an exceptional choice for engineers requiring maximum routing flexibility and expandability.
Conclusion
The XC2S200-6FGG952C represents a mature, proven FPGA platform that continues to serve critical roles in industrial, communications, and embedded applications worldwide. Its robust architecture, extensive I/O capabilities, and field-programmable nature make it an intelligent investment for projects requiring reliable, high-performance programmable logic.
By selecting the XC2S200-6FGG952C, design teams gain access to decades of AMD Xilinx engineering excellence, comprehensive development tools, and a global support network—all essential ingredients for successful FPGA implementation and long-term product viability.
