Overview of XC2S200-6FGG947C Field Programmable Gate Array
The XC2S200-6FGG947C represents a powerful solution in the Spartan-II FPGA family, manufactured by AMD Xilinx. This advanced field-programmable gate array delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it an ideal choice for complex digital processing applications. Built on proven 0.18μm CMOS technology, this device operates at 2.5V and features a high-density 947-ball Fine-pitch Ball Grid Array (FGG947) package.
Designed for engineers and developers seeking cost-effective programmable logic solutions, the XC2S200-6FGG947C combines high-speed performance with flexible configuration options. This FPGA stands as a superior alternative to traditional mask-programmed ASICs, offering shorter development cycles and field-upgradable capabilities without hardware replacement.
Key Technical Specifications and Features
Core Performance Parameters
| Specification |
Value |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,288 bits) |
| Maximum User I/O |
284 pins |
| Speed Grade |
-6 (Commercial Temperature) |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm CMOS |
| Package Type |
947-ball Fine-pitch BGA (FGG947) |
Advanced Architecture Capabilities
The XC2S200-6FGG947C features a sophisticated architecture designed for high-performance digital applications:
- Configurable Logic Blocks (CLBs): 1,176 CLBs arranged in a 28 x 42 array provide extensive logic implementation flexibility
- On-Chip Memory Resources: Combined distributed RAM (75,264 bits) and block RAM (56K bits) for efficient data buffering and storage
- I/O Capabilities: Up to 284 user I/O pins supporting multiple signaling standards
- Delay-Locked Loops (DLLs): Four DLLs positioned at die corners for precise clock management
- Routing Architecture: Hierarchical routing structure ensuring optimal signal integrity
Package Information and Physical Characteristics
FGG947 Ball Grid Array Package Details
| Package Parameter |
Specification |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Total Ball Count |
947 balls |
| Ball Pitch |
Fine-pitch configuration |
| Package Designation |
FGG947 |
| Thermal Performance |
Enhanced heat dissipation |
| RoHS Compliance |
Pb-free option available (G designation) |
The 947-ball configuration provides maximum I/O density and superior thermal characteristics compared to smaller package options. This high-pin-count package enables access to all 284 user I/O pins while maintaining excellent signal integrity for high-speed applications.
Performance Specifications and Speed Characteristics
Speed Grade -6 Performance Metrics
| Performance Metric |
Specification |
| Speed Grade |
-6 (Highest Performance) |
| Maximum Operating Frequency |
Up to 263 MHz (system-dependent) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Pin-to-Pin Delay |
Optimized for high-speed paths |
| Clock Distribution |
Four DLL-based clock networks |
The -6 speed grade designation indicates this device operates at the highest performance tier within the Spartan-II family, making it suitable for demanding applications requiring maximum throughput and minimal latency.
Application Areas and Use Cases
Industrial and Commercial Applications
The XC2S200-6FGG947C excels in diverse application domains:
Communication Systems
- Network routers and switches
- Protocol converters and bridges
- High-speed data transmission equipment
- Telecommunications infrastructure
Industrial Automation
- Motor control systems
- Process automation controllers
- Sensor interface modules
- Real-time monitoring systems
Medical Electronics
- Diagnostic imaging equipment
- Patient monitoring devices
- Laboratory instrumentation
- Medical data processing units
Consumer Electronics
- Set-top boxes and media processors
- Gaming peripherals
- Display controllers
- Audio/video processing systems
Memory Architecture and Resources
Embedded Memory Configuration
| Memory Type |
Capacity |
Configuration |
| Distributed RAM |
75,264 bits |
Flexible LUT-based implementation |
| Block RAM |
56,288 bits |
Dual-port synchronous RAM blocks |
| Total On-Chip Memory |
131,552 bits |
Combined distributed and block RAM |
The dual-memory architecture provides designers with flexible storage options. Distributed RAM integrates directly within CLBs for small, fast memories, while block RAM modules deliver efficient storage for larger data buffers and FIFOs.
Design and Development Advantages
Benefits Over Traditional ASICs
Cost Efficiency
- Eliminates NRE (Non-Recurring Engineering) costs associated with ASIC development
- Reduces time-to-market for product launches
- Allows design iterations without fabrication delays
Flexibility and Upgradability
- In-field reconfiguration capability
- Design modifications without hardware changes
- Rapid prototyping and validation cycles
Risk Mitigation
- No minimum order quantities required
- Design changes accommodate evolving specifications
- Testing and validation before production commitment
Compatibility and Integration
Development Tool Support
The XC2S200-6FGG947C integrates seamlessly with industry-standard design tools:
- Xilinx ISE Design Suite for synthesis and implementation
- ModelSim for simulation and verification
- ChipScope for in-system debugging
- JTAG-based configuration and testing
Pin Configuration and Signal Standards
| I/O Feature |
Capability |
| Maximum User I/O |
284 pins |
| Global Clock Inputs |
4 dedicated pins |
| Voltage Standards |
Multiple I/O standards supported |
| I/O Banking |
Organized for voltage flexibility |
| SelectIO Technology |
Programmable drive strength and slew rate |
Power Management and Thermal Considerations
Power Supply Requirements
| Power Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V ± 5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V (bank-dependent) |
| Power Consumption |
Application and utilization dependent |
| Standby Current |
Low-power CMOS design |
The 2.5V core voltage provides an optimal balance between performance and power efficiency, while multi-voltage I/O banks enable interface flexibility with various logic families.
Quality and Reliability Features
Manufacturing and Testing Standards
- Manufactured using advanced 0.18μm CMOS process technology
- Comprehensive production testing ensures device functionality
- Extended temperature range options for industrial applications
- High reliability through proven semiconductor manufacturing
Ordering Information and Part Number Breakdown
Part Number Nomenclature: XC2S200-6FGG947C
| Code |
Meaning |
| XC |
Xilinx FPGA designation |
| 2S |
Spartan-II family identifier |
| 200 |
Device size (200,000 system gates) |
| -6 |
Speed grade (highest performance) |
| FGG |
Fine-pitch Ball Grid Array package |
| 947 |
Ball count (947 balls) |
| C |
Commercial temperature range (0°C to +85°C) |
Why Choose XC2S200-6FGG947C for Your Design?
Optimal Solution for Complex Digital Systems
Engineers select the XC2S200-6FGG947C when projects demand:
- High Logic Density: 5,292 logic cells accommodate complex digital designs
- Extensive I/O Count: 284 user I/O pins support multi-interface applications
- Memory Resources: 131 Kbits total on-chip memory for data-intensive operations
- Performance: Speed grade -6 ensures maximum operating frequencies
- Proven Technology: Mature Spartan-II architecture with extensive design support
Comparison with Alternative Package Options
Package Selection Guide
| Package Type |
Ball Count |
User I/O |
Applications |
| PQ208/PQG208 |
208 |
140 |
Moderate I/O designs |
| FG256/FGG256 |
256 |
176 |
Standard applications |
| FG456/FGG456 |
456 |
284 |
High I/O requirements |
| FGG947 |
947 |
284 |
Maximum density/thermal needs |
The FGG947 package offers the highest ball count, providing superior routing flexibility and enhanced thermal dissipation for demanding applications requiring all 284 user I/O pins.
Technical Resources and Support
Documentation and Design Assets
Comprehensive technical resources support XC2S200-6FGG947C implementation:
- Complete datasheet with AC/DC specifications
- Package drawings and ball assignment diagrams
- Reference designs and application notes
- PCB layout guidelines for BGA assembly
- Thermal modeling data and recommendations
For additional information on Xilinx FPGA solutions and technical support resources, designers can access extensive documentation libraries and community forums.
PCB Design Considerations for FGG947 Package
Layout Best Practices
| Design Aspect |
Recommendation |
| Layer Count |
Minimum 6-layer PCB recommended |
| Ball Pitch |
Precision routing for fine-pitch balls |
| Via Strategy |
Via-in-pad or dog-bone routing |
| Power Distribution |
Dedicated power and ground planes |
| Thermal Management |
Proper heat sink interface design |
| Impedance Control |
Controlled impedance for high-speed signals |
Assembly and Soldering Requirements
The 947-ball BGA package requires professional assembly equipment:
- Automated pick-and-place machinery for accurate positioning
- Controlled reflow soldering with precise temperature profiles
- X-ray inspection capability for solder joint verification
- Proper PCB pad design matching ball grid pattern
Environmental and Compliance Standards
Operating Conditions
| Parameter |
Commercial Grade |
| Ambient Temperature Range |
0°C to +85°C |
| Junction Temperature |
Specified in thermal characteristics |
| Storage Temperature |
-55°C to +125°C |
| Humidity |
Non-condensing conditions |
Frequently Asked Questions
Q: What distinguishes the XC2S200-6FGG947C from smaller package variants? A: The FGG947 package provides the highest ball count (947 balls) enabling superior thermal performance and routing flexibility while accessing all 284 user I/O pins.
Q: Is the XC2S200-6FGG947C suitable for new designs? A: While the Spartan-II family is mature technology, it remains viable for cost-sensitive applications. For new designs, consider current-generation FPGAs for enhanced features and support.
Q: What development tools support XC2S200-6FGG947C programming? A: The device programs using Xilinx ISE Design Suite, supporting VHDL and Verilog HDL design entry with comprehensive synthesis and implementation tools.
Q: Can the device operate with 3.3V I/O standards? A: Yes, the multi-voltage I/O banks support various standards from 1.5V to 3.3V, enabling interface flexibility with different logic families.
Q: What configuration methods does the XC2S200-6FGG947C support? A: Multiple configuration modes include Master/Slave Serial, SelectMAP parallel, and JTAG boundary-scan programming.
Conclusion: Reliable FPGA Solution for Professional Applications
The XC2S200-6FGG947C delivers robust performance for applications demanding high logic density, extensive I/O capabilities, and proven reliability. With 200,000 system gates, 5,292 logic cells, and 284 user I/O pins in a high-density 947-ball package, this Spartan-II FPGA provides engineers with a cost-effective platform for complex digital designs.
Whether developing communication systems, industrial controllers, medical equipment, or consumer electronics, the XC2S200-6FGG947C offers the flexibility and performance characteristics essential for successful product implementation. Combined with comprehensive development tool support and extensive technical documentation, this FPGA represents a solid choice for professional engineering applications requiring field-programmable logic solutions.
