The XC2S200-6FGG939C is a powerful field-programmable gate array from Xilinx’s renowned Spartan-II family, delivering exceptional performance and versatility for high-volume applications. This 939-ball fine-pitch BGA FPGA combines 200,000 system gates with advanced programmable logic capabilities, making it an ideal solution for cost-sensitive embedded systems, industrial automation, telecommunications, and digital signal processing applications.
Overview of XC2S200-6FGG939C FPGA
The XC2S200-6FGG939C represents a superior alternative to traditional mask-programmed ASICs, offering designers the flexibility of reprogrammability without the high initial costs and lengthy development cycles associated with custom silicon. Built on reliable 0.18-micron technology with a 2.5V core voltage, this FPGA delivers robust performance while maintaining power efficiency.
Key Features and Benefits
- 200,000 system gates for complex logic implementation
- 5,292 logic cells providing extensive design capacity
- 939-ball Fine-Pitch BGA package for high-density PCB layouts
- Speed grade -6 for commercial temperature range applications
- 284 maximum user I/O pins enabling extensive interfacing options
- 0.18µm CMOS technology ensuring reliable, proven performance
- 2.5V core voltage for reduced power consumption
Technical Specifications Table
| Specification |
Value |
| Part Number |
XC2S200-6FGG939C |
| Device Family |
Spartan-II |
| Logic Cells |
5,292 |
| System Gates |
200,000 (Logic and RAM) |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Package Type |
FGG939 (939-ball Fine-Pitch BGA) |
| Speed Grade |
-6 (Commercial) |
| Core Voltage |
2.5V |
| Process Technology |
0.18µm |
| Operating Temperature |
Commercial (0°C to +85°C) |
Memory and Logic Resources
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG939C features a comprehensive 28 x 42 array of Configurable Logic Blocks, totaling 1,176 CLBs. Each CLB contains multiple logic slices with lookup tables (LUTs), flip-flops, and dedicated carry logic, enabling efficient implementation of arithmetic functions, counters, and state machines.
On-Chip Memory Architecture
| Memory Type |
Capacity |
Features |
| Distributed RAM |
75,264 bits |
Flexible, fast access using LUT resources |
| Block RAM |
56K bits |
Dedicated dual-port memory blocks |
| Total Memory |
131,264 bits |
Combined storage for data buffering |
The dual-column block RAM architecture provides dedicated memory resources ideal for FIFO buffers, lookup tables, and data storage applications, while distributed RAM offers flexibility for smaller memory requirements integrated directly into logic functions.
Package Specifications: FGG939 Fine-Pitch BGA
FGG939 Package Advantages
The 939-ball Fine-Pitch Ball Grid Array (FGG939) package offers several advantages for high-performance designs:
- High I/O density supporting up to 284 user I/O pins
- Excellent thermal performance with efficient heat dissipation
- Reduced PCB footprint compared to equivalent QFP packages
- Superior signal integrity with shorter bond wire lengths
- Pb-free option available (designated with “G” in part number)
Package Dimensions and Layout
| Package Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array |
| Total Balls |
939 |
| Ball Pitch |
1.0mm nominal |
| Package Designator |
FGG939 |
| RoHS Compliance |
Pb-free version available |
Performance Characteristics
Speed Grade -6 Performance
The -6 speed grade designation indicates this device is optimized for commercial temperature applications, delivering:
- Maximum system performance up to 200 MHz
- Fast logic propagation delays for time-critical paths
- Optimized routing delays ensuring timing closure
- Predictable performance across commercial temperature range
Clock Management Features
The XC2S200-6FGG939C includes four Delay-Locked Loops (DLLs) positioned at each corner of the die, providing:
- Precise clock de-skewing capabilities
- Clock frequency multiplication and division
- Reduced clock distribution delays
- Enhanced system timing margins
I/O Capabilities and Standards
Flexible I/O Architecture
With 284 maximum user I/O pins, the XC2S200-6FGG939C supports numerous I/O standards:
- LVTTL (Low Voltage TTL)
- LVCMOS (Low Voltage CMOS) at various voltage levels
- PCI 33MHz and 66MHz compatibility
- GTL and GTL+ for high-speed backplane applications
- SSTL and HSTL for memory interfaces
Input/Output Block Features
Each I/O pin features:
- Programmable drive strength
- Slew rate control for EMI reduction
- Individual tri-state control
- Input delay elements
- Optional pull-up/pull-down resistors
Configuration Options and Modes
Supported Configuration Modes
| Configuration Mode |
Data Width |
CCLK Direction |
Serial DOUT |
Typical Use Case |
| Master Serial |
1-bit |
Output |
Yes |
Standalone operation with external PROM |
| Slave Serial |
1-bit |
Input |
Yes |
Configuration from microcontroller |
| Slave Parallel |
8-bit |
Input |
No |
Fast configuration from processor |
| Boundary-Scan (JTAG) |
1-bit |
N/A |
No |
Development and debugging |
Configuration Memory Size
The XC2S200 requires 1,335,840 bits of configuration data, allowing quick reconfiguration and design updates in the field.
Application Areas for XC2S200-6FGG939C
Industrial and Embedded Systems
- Motor control and motion systems
- Industrial networking and protocols
- Sensor interfacing and data acquisition
- Programmable logic controllers (PLCs)
Telecommunications
- Protocol converters and bridges
- Channel coding and decoding
- Signal multiplexing and demultiplexing
- Network packet processing
Digital Signal Processing
- FIR and IIR filter implementation
- FFT and transform operations
- Image and video processing
- Software-defined radio applications
Consumer Electronics
- Display controllers and scalers
- Audio/video processing
- Interface bridging (USB, Ethernet, HDMI)
- Embedded system co-processors
Development and Design Support
Compatible Design Tools
The XC2S200-6FGG939C is fully supported by Xilinx ISE Design Suite, providing:
- Integrated synthesis and implementation
- Timing analysis and constraints management
- Power analysis and optimization
- IP core integration (CoreGen)
- Hardware debugging with ChipScope
Programming and Configuration
Multiple programming options are available:
- JTAG programming via Xilinx Platform Cable
- In-system serial programming
- Indirect configuration through microcontrollers
- Flash memory-based configuration solutions
Comparison with Other Spartan-II Devices
| Device |
Logic Cells |
System Gates |
CLBs |
User I/O (Max) |
Block RAM |
| XC2S50 |
1,728 |
50,000 |
384 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
600 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
864 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
1,176 |
284 |
56K |
The XC2S200 represents the flagship device in the Spartan-II family, offering maximum logic capacity and I/O resources for demanding applications.
Power Consumption and Thermal Management
Power Supply Requirements
| Power Rail |
Voltage |
Tolerance |
Purpose |
| VCCINT |
2.5V |
±5% |
Core logic power |
| VCCO |
1.5V – 3.3V |
±5% |
I/O bank power (programmable) |
| VCCAUX |
2.5V |
±5% |
Auxiliary circuits (DLLs) |
Thermal Considerations
The FGG939 package provides excellent thermal performance with:
- Low junction-to-ambient thermal resistance
- Central thermal pad for enhanced heat sinking
- Airflow-optimized ball grid pattern
- Compatibility with standard BGA heat sinks
Quality and Reliability
Manufacturing Standards
Xilinx manufactures the XC2S200-6FGG939C to the highest quality standards:
- ISO 9001 certified production facilities
- Automotive-grade quality options available
- Extended temperature range variants for industrial use
- RoHS-compliant Pb-free packaging options
Reliability Features
- ESD protection on all I/O pins
- Latch-up resistant CMOS design
- Low soft error rate (SER) for mission-critical applications
- Proven 0.18µm process technology
Ordering Information and Part Number Breakdown
Understanding the Part Number: XC2S200-6FGG939C
- XC2S200: Device type (Spartan-II, 200K gates)
- -6: Speed grade (commercial temperature)
- FGG939: Package type (939-ball Fine-Pitch BGA)
- C: Temperature range (Commercial: 0°C to +85°C)
Package Marking
Devices are marked with:
- Xilinx logo and Spartan-II branding
- Full part number
- Lot code and date code
- Pin 1 indicator for proper orientation
Getting Started with XC2S200-6FGG939C
Design Flow Overview
- Requirements Specification: Define system requirements and constraints
- HDL Design Entry: Create design using VHDL or Verilog
- Simulation and Verification: Validate functionality using ModelSim or ISE Simulator
- Synthesis: Convert HDL to gate-level netlist
- Implementation: Place and route design in FPGA fabric
- Timing Analysis: Verify timing requirements are met
- Bitstream Generation: Create configuration file
- Programming: Load design into FPGA
Recommended Development Boards
Several third-party development boards support the XC2S200:
- Educational prototyping boards with VGA, PS/2, and peripheral interfaces
- Industrial evaluation platforms with isolated I/O
- Custom carrier boards for application-specific development
Where to Buy XC2S200-6FGG939C
The XC2S200-6FGG939C is available through authorized Xilinx distributors and electronic component suppliers worldwide. For comprehensive Xilinx FPGA solutions including programming support, design resources, and technical documentation, consult specialized FPGA distributors.
Procurement Considerations
When sourcing XC2S200-6FGG939C devices:
- Verify authenticity through authorized distributors
- Check date codes for recent manufacturing
- Confirm package type matches PCB footprint (FGG939)
- Specify temperature grade requirements
- Consider lead-time for large volume orders
Technical Support and Resources
Documentation and Datasheets
Comprehensive technical documentation is available including:
- Complete Spartan-II family datasheet (DS001)
- Package specifications and mechanical drawings
- PCB design guidelines for BGA packages
- Application notes and reference designs
- Timing and characterization reports
Community and Forums
Designers can access extensive support through:
- Xilinx community forums
- FPGA-specific discussion boards
- University and research institution resources
- Third-party tutorial and training websites
Migration and Upgrade Paths
Forward Compatibility
For designs requiring enhanced performance or additional resources, migration paths include:
- Spartan-3 family: Pin-compatible upgrades with more logic
- Spartan-6 family: Next-generation architecture with improved performance
- Artix-7 family: Modern 7-series architecture with DSP blocks
Legacy Device Support
The Spartan-II family benefits from:
- Long-term availability commitments
- Continued toolchain support
- Extensive documentation archive
- Replacement and alternate sourcing options
Environmental and Compliance Information
RoHS and Environmental Compliance
- RoHS Directive 2002/95/EC: Pb-free versions available (FGG939 designation)
- REACH: Compliant with European chemical regulations
- Conflict Minerals: Xilinx conflict-free sourcing policies
- Recycling: Semiconductor recycling programs available
Export Compliance
The XC2S200-6FGG939C is subject to:
- US export control regulations (EAR)
- Encryption technology export restrictions
- Country-specific import regulations
Conclusion: Why Choose XC2S200-6FGG939C
The XC2S200-6FGG939C delivers exceptional value for high-density FPGA applications, combining 200,000 system gates with 284 user I/O pins in a space-efficient 939-ball BGA package. Its proven 0.18µm technology, comprehensive I/O standard support, and flexible configuration options make it ideal for industrial, telecommunications, and embedded system designs.
Whether you’re developing industrial control systems, telecommunications equipment, or complex digital signal processing applications, the XC2S200-6FGG939C provides the logic resources, performance, and reliability needed for successful product deployment. With extensive design tool support, comprehensive documentation, and long-term availability, this Spartan-II FPGA remains a solid choice for cost-sensitive, high-volume applications.
Key Takeaways
- 200K system gates and 5,292 logic cells for complex designs
- 939-ball BGA package with 284 I/O pins for high-density applications
- Speed grade -6 delivering up to 200 MHz performance
- Proven 0.18µm technology with 2.5V core voltage
- Comprehensive design tool and IP core support
- Cost-effective alternative to ASIC development
- Ideal for industrial, telecom, and embedded applications
For more information about Xilinx FPGA products and comprehensive design support, consult authorized distributors and Xilinx technical resources.
