Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG937C: High-Performance Spartan-II FPGA Solution

Product Details

Overview of XC2S200-6FGG937C FPGA

The XC2S200-6FGG937C represents Xilinx’s advanced Spartan-II family FPGA, delivering exceptional performance for embedded systems and digital logic applications. This field-programmable gate array combines 200,000 system gates with versatile I/O capabilities in a fine-pitch BGA package, making it ideal for space-constrained designs requiring robust functionality.

Key Technical Specifications

Core Architecture Details

Specification Value
System Gates 200,000
Logic Cells 4,704
CLB Array 28 x 42
Total Block RAM 56 Kbits
Distributed RAM 14,848 bits
Speed Grade -6 (Standard)
Package Type FGG937 (Fine-Pitch BGA)
Total I/O Pins 684 user I/O

Performance Characteristics

The XC2S200-6FGG937C operates with a -6 speed grade, providing balanced performance for demanding applications. This Xilinx FPGA delivers reliable operation across commercial temperature ranges while maintaining low power consumption characteristics essential for modern electronic designs.

Package Configuration and Pin Details

FGG937 Package Advantages

Feature Specification
Package Style 937-pin Fine-Pitch BGA
Ball Pitch 1.0mm
Package Dimensions 31mm x 31mm
Maximum User I/O 684 pins
Power/Ground Pins Dedicated distribution
Thermal Performance Enhanced heat dissipation

The FGG937 package offers maximum I/O density, making the XC2S200-6FGG937C perfect for high-bandwidth applications requiring extensive interconnectivity with peripheral devices and memory interfaces.

Memory Resources and Configuration

Embedded Memory Architecture

Memory Type Capacity Configuration
Block SelectRAM 56 Kbits Dual-port capability
Distributed RAM 14,848 bits Flexible implementation
Look-Up Tables 9,408 LUTs Logic/memory dual-use

The dual-port block RAM architecture enables simultaneous read/write operations, significantly improving data throughput for buffer-intensive applications.

Application Areas and Use Cases

Industrial and Commercial Applications

The XC2S200-6FGG937C excels in multiple demanding environments:

  • Digital Signal Processing: Real-time filtering and transformation algorithms
  • Motor Control Systems: PWM generation and encoder interfaces
  • Communication Protocols: Multi-standard serial interface implementation
  • Video Processing: Image capture and display controller designs
  • Instrumentation: Data acquisition and measurement systems
  • Networking Equipment: Packet processing and routing logic

System Integration Benefits

This Spartan-II device provides cost-effective FPGA solutions for mid-range applications where the 200K gate count matches project requirements perfectly, eliminating the need for oversized components.

Design Implementation Features

Configuration and Programming

Configuration Method Supported
Master Serial Yes
Slave Serial Yes
JTAG Boundary Scan Yes
Master Parallel Yes
Slave Parallel Yes

Multiple configuration options provide flexibility during prototyping and production deployment phases.

Clock Management Resources

The XC2S200-6FGG937C includes four Digital Clock Managers (DCMs) providing:

  • Clock frequency synthesis and division
  • Phase shifting capabilities
  • Clock deskew functionality
  • Multiple output clock generation

I/O Standards and Interface Support

Supported I/O Standards

Standard Type Voltage Levels Application
LVTTL 3.3V General purpose
LVCMOS 1.5V, 1.8V, 2.5V, 3.3V Mixed-voltage systems
SSTL-2/3 2.5V/3.3V Memory interfaces
GTL/GTL+ Terminated High-speed buses
PCI 33/66 3.3V/5V tolerant Legacy compatibility

The extensive I/O standard support enables seamless integration with various interface requirements without external level-shifting components.

Power Consumption and Thermal Management

Operating Specifications

Parameter Typical Value
Core Voltage (VCCINT) 2.5V ±5%
I/O Voltage (VCCO) 1.5V to 3.3V
Static Power Application-dependent
Junction Temperature -40°C to +100°C

Efficient power distribution through the FGG937 package ensures stable operation even in thermally challenging environments.

Development and Software Support

Design Tools Compatibility

The XC2S200-6FGG937C integrates seamlessly with Xilinx ISE Design Suite, providing comprehensive development capabilities including:

  • Synthesis and place-and-route optimization
  • Timing analysis and constraint management
  • In-system debugging capabilities
  • IP core library access

Advantages Over Alternative Solutions

Why Choose XC2S200-6FGG937C

Maximum I/O Accessibility: With 684 user I/O pins, this variant provides the highest connectivity density in the Spartan-II 200K gate family, eliminating I/O constraints in complex designs.

Package Efficiency: The 1.0mm ball pitch balances manufacturability with density, suitable for standard PCB fabrication processes.

Proven Technology: Spartan-II architecture offers mature, reliable performance with extensive design examples and community support.

Cost-Effective Scalability: Right-sized gate count prevents over-specification while maintaining upgrade paths within the Spartan family.

Quality and Reliability Standards

The XC2S200-6FGG937C meets stringent quality requirements:

  • RoHS compliant manufacturing
  • Automotive-grade options available
  • Extended temperature range versions
  • Comprehensive JEDEC standards compliance

Getting Started with Your Design

Development Workflow

  1. Requirements Analysis: Define gate count, I/O requirements, and performance targets
  2. Schematic Capture: Utilize Xilinx ISE or third-party HDL tools
  3. Simulation: Verify functionality before hardware implementation
  4. Implementation: Synthesize, map, and place-and-route your design
  5. Configuration: Program device via supported configuration method

Conclusion: Optimal FPGA Solution

The XC2S200-6FGG937C delivers exceptional value for applications requiring substantial I/O resources coupled with 200K system gates. Its FGG937 package maximizes pin accessibility while maintaining compact board footprint requirements. Whether developing communication interfaces, control systems, or signal processing applications, this Spartan-II FPGA provides the perfect balance of resources, performance, and cost-effectiveness.

The combination of proven architecture, comprehensive development tool support, and flexible configuration options makes the XC2S200-6FGG937C an excellent choice for engineers seeking reliable FPGA solutions for mid-range complexity projects with demanding I/O requirements.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.