The XC2S200-6FGG933C is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-II family, delivering exceptional performance for cost-sensitive applications. This FPGA combines 200,000 system gates with advanced features in a 933-ball Fine-Pitch BGA package, making it ideal for telecommunications, industrial control, and digital signal processing applications.
Key Technical Specifications
| Specification |
Details |
| Logic Cells |
4,704 |
| System Gates |
200,000 |
| CLB Array |
28 x 42 |
| Total Block RAM |
56 Kbits |
| Maximum User I/O |
684 |
| Package Type |
FGG933 (933-ball Fine-Pitch BGA) |
| Speed Grade |
-6 (6ns) |
| Operating Voltage |
2.5V Core |
Advanced Architecture Features
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG933C features a robust CLB architecture that provides:
- Dual 4-input lookup tables (LUTs) per logic cell
- Dedicated fast carry logic for arithmetic operations
- Distributed RAM capability up to 16 bits per CLB
- Flexible routing resources for optimal performance
Memory Configuration Options
| Memory Type |
Capacity |
Configuration |
| Block SelectRAM |
56 Kbits |
14 blocks x 4 Kbits |
| Distributed RAM |
Variable |
LUT-based implementation |
| FIFO Support |
Yes |
Synchronous/Asynchronous modes |
Performance Characteristics
Speed and Timing
The -6 speed grade designation indicates superior performance characteristics:
- Internal Clock Frequency: Up to 200 MHz
- System Performance: 6ns maximum delay
- Toggle Rate: High-speed I/O up to 311 Mbps
- Fast Carry Chain: Optimized for DSP applications
I/O Standards Support
| I/O Standard |
Voltage Level |
Application |
| LVTTL |
3.3V |
General purpose |
| LVCMOS |
2.5V, 3.3V |
Low-voltage applications |
| PCI |
3.3V |
PCI interface |
| GTL+ |
Differential |
High-speed communications |
| SSTL |
2.5V |
Memory interfaces |
Package Information: FGG933
Physical Dimensions and Layout
The FGG933 package offers maximum I/O density with excellent thermal characteristics:
- Ball Count: 933 balls
- Pitch: 1.0mm
- Package Size: 31mm x 31mm
- Maximum I/O Pins: 684 user-configurable pins
- Thermal Performance: Enhanced heat dissipation for demanding applications
Application Areas
Telecommunications Systems
The XC2S200-6FGG933C excels in telecommunications applications requiring:
- Protocol processing and conversion
- Digital filtering and signal conditioning
- High-speed data buffering
- Interface bridging between different standards
Industrial Control Solutions
| Application |
Benefits |
| Motor Control |
Real-time PWM generation, encoder processing |
| PLC Systems |
Flexible I/O configuration, ladder logic implementation |
| Machine Vision |
Image preprocessing, pattern recognition algorithms |
| Process Automation |
Multi-protocol support, deterministic timing |
Digital Signal Processing
The abundant block RAM and fast carry logic make this FPGA ideal for:
- FIR and IIR filter implementations
- FFT processing engines
- Adaptive filtering algorithms
- Multi-channel data acquisition systems
Design Resources and Development Tools
Supported Software Platforms
- Xilinx ISE Design Suite: Complete design entry and implementation
- Xilinx Alliance Series: Integrated third-party tool support
- ModelSim: Advanced simulation capabilities
- ChipScope Pro: Real-time debugging and analysis
IP Core Compatibility
The device supports extensive IP core libraries for rapid development:
- Communication controllers (UART, SPI, I2C)
- Memory controllers (SDRAM, DDR)
- Math functions (multipliers, dividers, CORDIC)
- Video and image processing cores
Power Management Features
Power Consumption Profile
| Power Mode |
Typical Consumption |
Conditions |
| Dynamic Power |
450-650 mW |
100 MHz, 50% toggle rate |
| Static Power |
75-125 mW |
Standby mode |
| I/O Power |
Variable |
Depends on I/O standards used |
Power Optimization Techniques
- Core voltage regulation at 2.5V
- Selective clock gating support
- Power-down modes for unused logic
- Flexible I/O banking for reduced power
Configuration and Programming
Configuration Methods
The XC2S200-6FGG933C supports multiple configuration options:
- Master Serial Mode: Direct configuration from serial PROM
- Slave Serial Mode: External controller-driven configuration
- JTAG Boundary-Scan: IEEE 1149.1 compliant programming
- SelectMAP: 8-bit parallel configuration for fast boot times
Configuration Memory Size
- Bitstream Size: Approximately 1,683,200 bits
- Recommended PROM: XC18V02 or larger
- Configuration Time: <100ms in SelectMAP mode
Quality and Reliability Standards
Environmental Specifications
| Parameter |
Range |
Notes |
| Operating Temperature |
0°C to +85°C |
Commercial grade |
| Storage Temperature |
-65°C to +150°C |
Long-term storage |
| Moisture Sensitivity |
Level 3 |
Per JEDEC J-STD-020 |
| Lead-Free Compliance |
RoHS-6 Compliant |
Environmental standards |
Competitive Advantages
Why Choose XC2S200-6FGG933C
The XC2S200-6FGG933C offers distinct advantages for embedded system designers:
- Exceptional I/O Density: 684 user I/O pins provide connectivity for complex multi-interface designs
- Proven Architecture: Mature Spartan-II platform with extensive design resources
- Cost-Effective Performance: Optimal balance of features and pricing
- Broad Software Support: Compatible with industry-standard design tools
Integration with System Components
For comprehensive FPGA solutions and related components, explore our complete range of Xilinx FPGA products featuring the latest programmable logic devices.
Design Considerations and Best Practices
Thermal Management
Proper thermal design ensures reliable operation:
- Use adequate PCB copper planes for heat spreading
- Consider active cooling for high-utilization designs
- Monitor junction temperature in demanding applications
- Follow Xilinx thermal design guidelines
Signal Integrity Guidelines
| Consideration |
Recommendation |
| PCB Stackup |
Minimum 6-layer design for high-speed signals |
| Decoupling |
0.1µF capacitors at each power pin |
| Termination |
Match I/O standards to trace impedance |
| Clock Distribution |
Dedicated clock routing with controlled impedance |
Migration and Scalability
Family Compatibility
The Spartan-II family offers seamless migration paths:
- Pin-compatible alternatives for capacity scaling
- Consistent software tool chain across family members
- Shared IP core libraries for design reuse
- Similar timing characteristics within speed grades
Conclusion: Versatile FPGA Solution
The XC2S200-6FGG933C represents an excellent choice for designers requiring high I/O count, reliable performance, and cost-effective implementation. Its extensive feature set, combined with the large 933-ball package, makes it suitable for telecommunications equipment, industrial automation systems, and complex digital designs requiring substantial external connectivity.
With robust development tool support, comprehensive documentation, and a proven track record in demanding applications, this FPGA delivers the flexibility and performance modern embedded systems require. Whether you’re designing communication infrastructure, implementing custom DSP algorithms, or creating sophisticated control systems, the XC2S200-6FGG933C provides the programmable logic resources necessary for success.
