The XC2S200-6FGG931C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family. This advanced programmable logic device delivers exceptional performance for cost-sensitive applications requiring high logic density and flexible I/O configurations. With 200,000 system gates and a fine-pitch 931-ball grid array package, this FPGA provides designers with the perfect balance of functionality, speed, and reliability.
Key Technical Specifications
| Parameter |
Specification |
| Logic Cells |
4,704 |
| System Gates |
200,000 |
| CLB Array |
28 x 42 |
| Total Block RAM |
56 Kbits |
| Maximum User I/O |
624 |
| Package Type |
FGG931 (Fine-pitch BGA) |
| Speed Grade |
-6 (High Performance) |
| Operating Voltage |
2.5V Core |
Architecture and Performance Features
Advanced Logic Resources
The XC2S200-6FGG931C incorporates Xilinx’s proven Spartan-II architecture, offering designers substantial logic resources for complex digital implementations. The device features 4,704 configurable logic blocks (CLBs) arranged in an optimized 28 x 42 array, providing excellent routing efficiency and reduced propagation delays.
High-Speed Operation
With a -6 speed grade, this FPGA delivers superior performance for timing-critical applications. The device supports:
- Fast internal clock frequencies
- Reduced setup and hold times
- Optimized critical path delays
- Enhanced system performance margins
Memory Configuration
| Memory Type |
Capacity |
Configuration |
| Block RAM |
56 Kbits total |
Dual-port capability |
| Distributed RAM |
Flexible |
Using LUTs |
| RAM Blocks |
14 blocks |
4 Kbit each |
Package and Pinout Details
FGG931 Package Advantages
The 931-ball Fine-pitch Grid Array (FGG931) package offers several critical benefits:
- Maximum I/O availability: Up to 624 user-configurable pins
- Superior thermal performance: Enhanced heat dissipation
- Reduced board space: Compact footprint for space-constrained designs
- High-density interconnect: Ideal for complex multi-signal applications
- Industry-standard pitch: Compatible with modern PCB manufacturing
Pin Configuration Overview
| I/O Standard |
Supported |
| LVTTL |
Yes |
| LVCMOS |
3.3V, 2.5V |
| PCI |
33 MHz, 66 MHz |
| GTL/GTL+ |
Yes |
| SSTL |
Multiple variants |
| HSTL |
Class I, II, III, IV |
Application Areas
Industrial Automation
The XC2S200-6FGG931C excels in industrial control systems, providing:
- Real-time process control
- Motor control interfaces
- Sensor data acquisition
- Protocol conversion capabilities
Communications Infrastructure
Ideal for telecommunications applications including:
- Digital signal processing
- Protocol bridging
- Network packet processing
- Base station controllers
Consumer Electronics
Perfect for high-volume consumer products:
- Digital video processing
- Audio/video codecs
- Gaming peripherals
- Set-top box designs
Automotive Systems
Suitable for automotive electronics:
- In-vehicle networking
- Advanced driver assistance systems (ADAS)
- Infotainment controllers
- Engine control units
Design Implementation Features
Flexible I/O Standards
The device supports multiple I/O standards simultaneously, enabling seamless interfacing with various components and subsystems. Each I/O bank can be independently configured, providing maximum design flexibility.
Clock Management
| Clock Feature |
Capability |
| DLLs |
4 Digital Delay Locked Loops |
| Clock Distribution |
Low-skew global networks |
| Input Clocks |
Multiple dedicated pins |
| Frequency Synthesis |
Clock multiplication/division |
Configuration Options
The XC2S200-6FGG931C supports multiple configuration modes:
- Master Serial
- Slave Serial
- Master Parallel
- Slave Parallel
- Boundary Scan (JTAG)
Power Management and Efficiency
Power Specifications
| Parameter |
Typical Value |
| Core Voltage |
2.5V ±5% |
| I/O Voltage |
1.5V to 3.3V |
| Standby Power |
Low |
| Active Power |
Design-dependent |
Power Optimization Techniques
- Configurable I/O drive strength
- Unused logic power-down
- Selective clock gating
- Multiple voltage domains
Development and Programming
Design Tools Compatibility
The XC2S200-6FGG931C integrates seamlessly with industry-standard development tools:
- Xilinx ISE Design Suite: Complete implementation flow
- HDL Support: VHDL, Verilog synthesis
- Simulation: ModelSim, ISim compatibility
- Timing Analysis: Comprehensive static timing tools
Programming Interface
Standard JTAG boundary scan programming enables:
- In-system programming (ISP)
- Device configuration verification
- Boundary scan testing
- Debug capabilities
Quality and Reliability
Operating Conditions
| Parameter |
Range |
| Commercial Temperature |
0°C to +85°C |
| Junction Temperature |
Up to +125°C |
| Storage Temperature |
-65°C to +150°C |
Manufacturing Standards
- RoHS compliant
- Automotive-grade options available
- Comprehensive qualification testing
- Long-term supply commitment
Competitive Advantages
Why Choose the XC2S200-6FGG931C?
- Proven Architecture: Spartan-II family reliability
- Cost-Effective: Optimal price-performance ratio
- High I/O Count: 624 user pins for complex designs
- Speed Grade -6: Maximum performance option
- Industry Support: Extensive documentation and community
Comparison Matrix
| Feature |
XC2S200-6FGG931C Advantage |
| Logic Density |
200K system gates |
| I/O Pins |
Maximum availability (624) |
| Package |
Largest Spartan-II option |
| Speed |
Highest performance grade |
| Flexibility |
Multiple configuration modes |
Integration and System Design
PCB Design Considerations
When designing with the XC2S200-6FGG931C:
- Layer Stack: Minimum 6-layer recommended
- Power Planes: Dedicated 2.5V core and I/O planes
- Decoupling: Multiple capacitor values near package
- Signal Integrity: Controlled impedance routing
- Thermal Management: Adequate copper pour and vias
Interface Examples
The device easily interfaces with:
- Microprocessors and microcontrollers
- Memory devices (DDR, SDRAM, Flash)
- High-speed communication ports
- Analog-to-digital converters
- Display controllers
Getting Started Resources
For comprehensive information about Xilinx FPGA products and technical support, designers can access extensive documentation, reference designs, and application notes.
Ordering and Availability
Part Number Breakdown
XC2S200-6FGG931C:
- XC2S: Spartan-II family identifier
- 200: 200,000 system gates
- -6: Speed grade (highest performance)
- FGG931: Package type (931-ball fine-pitch BGA)
- C: Commercial temperature range
Package Marking
Each device includes:
- Part number identification
- Date code
- Manufacturing lot code
- Country of origin
Conclusion
The XC2S200-6FGG931C represents an excellent choice for designers requiring high logic capacity, maximum I/O flexibility, and superior performance in a proven FPGA architecture. Its combination of 200,000 system gates, 624 user I/O pins, and -6 speed grade makes it ideal for demanding applications across industrial, communications, consumer, and automotive markets.
Whether you’re developing next-generation communication equipment, sophisticated industrial controllers, or high-performance consumer products, the XC2S200-6FGG931C provides the resources, performance, and reliability needed for successful product implementation.
