The XC2S200-6FGG928C is a powerful field-programmable gate array (FPGA) from Xilinx’s acclaimed Spartan-II family, delivering exceptional performance and versatility in a 928-ball fine-pitch BGA package. This cost-effective programmable logic device offers 200,000 system gates and 5,292 logic cells, making it an ideal solution for complex digital designs, embedded systems, and high-volume applications requiring flexibility without the high cost and long development cycles of ASICs.
As part of the Spartan-II series, the XC2S200-6FGG928C combines robust functionality with competitive pricing, making it a superior alternative to mask-programmed ASICs for engineers and designers seeking rapid prototyping capabilities and in-field upgrade flexibility.
Key Specifications and Features
Technical Specifications Table
| Specification |
Value |
| Part Number |
XC2S200-6FGG928C |
| FPGA Family |
Spartan-II |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Speed Grade |
-6 (Commercial temperature) |
| Package Type |
FGG928 (928-ball Fine-pitch BGA) |
| Operating Voltage |
2.5V |
| Technology Node |
0.18µm process |
| Temperature Range |
Commercial (0°C to +85°C) |
Core Architecture Features
The XC2S200-6FGG928C FPGA incorporates advanced architectural elements that deliver superior performance for demanding applications:
- Configurable Logic Blocks (CLBs): 1,176 CLBs arranged in a 28 x 42 array provide flexible logic implementation
- Block RAM Resources: 56 Kbits of dedicated block RAM for efficient memory implementation
- Distributed RAM: 75,264 bits of distributed RAM integrated within CLBs
- Delay-Locked Loops (DLLs): Four DLLs positioned at each corner for precise clock management
- High I/O Density: 284 maximum user I/O pins supporting various interface standards
XC2S200-6FGG928C Package Information
FGG928 Package Characteristics
| Package Feature |
Description |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Ball Count |
928 balls |
| Package Designation |
FGG928 (Lead-free “G” designation) |
| Pin Density |
High-density I/O configuration |
| Mounting Type |
Surface mount technology (SMT) |
| Thermal Performance |
Enhanced heat dissipation |
| Assembly Compatibility |
Requires fine-pitch PCB assembly capability |
The 928-ball fine-pitch BGA package offers maximum I/O availability and superior thermal characteristics compared to smaller packages. This package format is ideal for designs requiring extensive connectivity and high signal integrity.
Performance Specifications
Speed and Timing Characteristics
| Performance Parameter |
Specification |
| Speed Grade |
-6 (fastest commercial grade) |
| System Performance |
Up to 200 MHz operation |
| Configuration Time |
Fast configuration via multiple modes |
| Power Consumption |
Optimized for 2.5V operation |
| Signal Integrity |
Excellent with proper PCB design |
The -6 speed grade designation indicates this device operates at the fastest commercial temperature range performance level, ensuring minimal propagation delays and maximum operating frequencies for time-critical applications.
Application Areas for XC2S200-6FGG928C
Primary Application Segments
- Digital Signal Processing (DSP): Audio/video processing, filtering, and transformation
- Communication Systems: Protocol converters, baseband processing, network interfaces
- Industrial Control: Programmable logic controllers, motor control, process automation
- Consumer Electronics: Set-top boxes, gaming consoles, multimedia devices
- Automotive Systems: Dashboard electronics, infotainment systems, sensor interfaces
- Test and Measurement: Logic analyzers, oscilloscopes, signal generators
- Embedded Systems: Microprocessor interfaces, custom peripherals, co-processors
Configuration and Programming Options
Supported Configuration Modes
| Configuration Mode |
Description |
Data Width |
| Master Serial |
FPGA controls configuration |
1-bit |
| Slave Serial |
External controller manages config |
1-bit |
| Slave Parallel |
High-speed parallel configuration |
8-bit |
| Boundary-Scan (JTAG) |
IEEE 1149.1 compliant |
1-bit |
The XC2S200-6FGG928C supports multiple configuration modes, providing flexibility for various system architectures. Master modes enable autonomous configuration from external memory, while slave modes allow microcontroller-managed configuration.
Design Resources and Development Tools
Compatible Development Environment
- ISE Design Suite: Complete FPGA design flow from synthesis to implementation
- WebPACK Edition: Free design tools supporting Spartan-II devices
- ChipScope Pro: Advanced debugging and verification
- IP Core Library: Pre-verified IP cores for common functions
- Simulation Tools: ModelSim, ISim for functional verification
- Programming Solutions: iMPACT for device programming via JTAG
Memory Architecture
Memory Resource Distribution
| Memory Type |
Capacity |
Implementation |
| Block RAM |
56 Kbits |
Dedicated dual-port RAM blocks |
| Distributed RAM |
75,264 bits |
CLB-based memory using LUTs |
| Total On-chip Memory |
131,264 bits |
Combined block and distributed |
The dual-memory architecture provides designers with flexibility to optimize memory implementation based on specific application requirements. Block RAM offers higher density for large buffers, while distributed RAM provides faster access for small, scattered memory needs.
I/O Capabilities and Standards
Input/Output Features
- Total User I/O: 284 pins available in FGG928 package
- Voltage Standards: Supports 2.5V, 3.3V, 5V tolerant I/O with appropriate configuration
- I/O Banks: Multiple independent I/O banks for voltage flexibility
- Programmable Features: Slew rate control, pull-up/pull-down resistors, drive strength selection
- Differential Pairs: Support for differential signaling standards
- Bus Interface: Compatible with PCI, processor bus interfaces
Advantages Over Traditional ASICs
Why Choose XC2S200-6FGG928C FPGA
Cost Efficiency: Eliminates NRE costs, mask charges, and minimum order quantities associated with ASICs
Rapid Development: Immediate prototyping and testing without fabrication lead times
Design Flexibility: In-field reprogramming enables feature updates and bug fixes post-deployment
Risk Mitigation: Design changes require only bitstream updates, not silicon respins
Time-to-Market: Accelerated product launches with iterative design refinement
Volume Scalability: Economical for medium to high-volume production runs
Power Management and Thermal Considerations
Power Specifications
| Power Parameter |
Typical Value |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Voltage (VCCO) |
2.5V, 3.3V (bank-dependent) |
| Standby Current |
Low power consumption |
| Dynamic Power |
Design and frequency dependent |
| Thermal Resistance |
Package-dependent θJA |
Proper thermal management is essential when operating at maximum frequency and I/O utilization. The FGG928 package provides excellent thermal characteristics through its large thermal pad and ball grid array structure.
Quality and Reliability
Manufacturing Excellence
- Xilinx Quality Standards: Manufactured to ISO 9001 certified processes
- RoHS Compliance: Lead-free “G” package meets environmental regulations
- Testing: 100% factory tested for functionality and performance
- Reliability: Designed for long-term operation in commercial environments
- Supply Chain: Available through authorized distributors worldwide
Ordering Information and Part Number Breakdown
Part Number Decode: XC2S200-6FGG928C
- XC: Xilinx Commercial FPGA
- 2S: Spartan-II family designation
- 200: 200,000 system gates device size
- -6: Speed grade (fastest commercial)
- FG: Fine-pitch Ball Grid Array package
- G: Lead-free (RoHS compliant) package option
- 928: 928-ball package configuration
- C: Commercial temperature range (0°C to +85°C)
PCB Design Considerations for FGG928 Package
Layout Guidelines
When designing PCBs for the XC2S200-6FGG928C, engineers should consider:
- Ball Pitch: Fine-pitch BGA requires precise PCB manufacturing tolerances
- Via Technology: Micro-vias or via-in-pad techniques may be necessary
- Layer Count: Multi-layer PCB design typically required for signal routing
- Power Distribution: Robust power plane design with adequate decoupling
- Thermal Management: Thermal vias and potential heatsink attachment
- Signal Integrity: Controlled impedance traces for high-speed signals
- Assembly: Professional-grade SMT equipment with X-ray inspection capability
Comparison with Alternative Packages
Package Options Comparison
| Package |
Ball Count |
Max I/O |
Application Focus |
| FGG928 |
928 balls |
284 I/O |
Maximum I/O density, complex systems |
| FG456 |
456 balls |
284 I/O |
Balanced I/O and footprint |
| PQ208 |
208 pins |
140 I/O |
Moderate I/O requirements |
| FG256 |
256 balls |
176 I/O |
Space-constrained designs |
The FGG928 package provides the highest I/O count and best thermal performance, making it ideal for applications demanding maximum connectivity and power handling.
Xilinx has established itself as a pioneer in programmable logic solutions, with the Spartan-II family representing a mature, proven technology platform. The XC2S200-6FGG928C benefits from years of production optimization and extensive design ecosystem support, ensuring reliable performance across diverse applications.
Documentation and Support Resources
Available Technical Documentation
- Data Sheet: Comprehensive electrical and functional specifications
- User Guide: Detailed architectural description and design guidelines
- Application Notes: Design tips, best practices, and implementation examples
- PCB Design Guidelines: Package-specific layout recommendations
- Configuration Guide: Programming and configuration procedures
- SelectIO User Guide: I/O standards and interface specifications
Competitive Advantages
Why XC2S200-6FGG928C Stands Out
Proven Technology: Mature, well-characterized device with extensive field deployment
Design Security: FPGA programmability protects intellectual property better than exposed ASIC layouts
Supply Continuity: Long-term availability commitment from Xilinx/AMD
Ecosystem Support: Extensive third-party IP cores, reference designs, and development boards
Community Resources: Large user community with forums, tutorials, and shared knowledge
Summary and Conclusion
The XC2S200-6FGG928C represents an excellent choice for designers requiring a powerful, flexible FPGA solution with maximum I/O capability in the Spartan-II family. With 200,000 system gates, 5,292 logic cells, and 284 user I/O pins in the high-density FGG928 package, this device offers the resources needed for complex digital designs while maintaining cost-effectiveness.
Whether you’re developing communication systems, industrial controllers, consumer electronics, or embedded applications, the XC2S200-6FGG928C provides the performance, flexibility, and reliability required for successful product deployment. Its programmable nature eliminates the risks associated with ASICs while enabling rapid development and in-field updates.
For engineers seeking a proven FPGA platform with extensive design tool support and a robust development ecosystem, the XC2S200-6FGG928C delivers exceptional value and capability.
