The XC2S200-6FGG927C is a premium field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance and versatility for demanding digital design applications. This commercial-grade programmable logic device combines 200,000 system gates with 5,292 logic cells in a robust 927-ball fine-pitch ball grid array (FGG927) package, making it an ideal solution for complex embedded systems, telecommunications infrastructure, industrial automation, and high-speed data processing applications.

Built on advanced 0.18-micron CMOS technology, the XC2S200-6FGG927C operates at a core voltage of 2.5V and features a speed grade of -6, ensuring optimal performance across diverse operational environments. The FGG927 package provides extensive I/O capabilities with 284 maximum user I/O pins, enabling seamless integration with complex system architectures and multiple peripheral interfaces.

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Key Technical Specifications of XC2S200-6FGG927C

Core Architecture and Logic Resources

Memory and Storage Capabilities

Input/Output and Package Features

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Advanced Features of XC2S200-6FGG927C FPGA

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG927C incorporates 1,176 configurable logic blocks arranged in a 28 x 42 grid pattern. Each CLB contains multiple look-up tables (LUTs), flip-flops, and multiplexers, providing tremendous flexibility for implementing complex digital logic functions. This architecture enables designers to create custom logic circuits tailored to specific application requirements without the constraints of fixed-function ASICs.

Memory Architecture

This Spartan-II device features a dual-memory architecture combining distributed RAM and block RAM resources:

• Distributed RAM: 75,264 bits of flexible RAM distributed throughout the CLB array, ideal for small memory buffers, FIFOs, and shift registers
• Block RAM: 56 Kbits of dedicated dual-port synchronous block RAM organized in columns, perfect for larger data storage requirements, packet buffers, and lookup tables

Delay-Locked Loops (DLLs)

The XC2S200-6FGG927C includes four delay-locked loops positioned at each corner of the die. These DLLs provide precision clock management capabilities including:

• Clock de-skewing for synchronous designs
• Frequency synthesis and multiplication
• Phase shifting for advanced timing control
• Reduced clock distribution delay

I/O Block Architecture

With 284 maximum user I/O pins plus 4 dedicated global clock inputs, the FGG927 package offers exceptional connectivity. Each programmable I/O block supports:

• Multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+)
• Programmable drive strength
• Slew rate control
• Input delay compensation
• Three-state operation

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XC2S200-6FGG927C Application Areas

Telecommunications and Networking

The XC2S200-6FGG927C excels in telecommunications applications requiring high-speed data processing and protocol implementation:

• Network routers and switches
• Protocol converters and bridges
• Telecommunications base stations
• Data packet processing engines
• Communication interface controllers

Industrial Automation and Control

Industrial environments benefit from the XC2S200-6FGG927C’s reliability and flexible architecture:

• Programmable logic controllers (PLCs)
• Motor control systems
• Process automation controllers
• Industrial machine vision systems
• Real-time control interfaces

Embedded Systems Development

The device serves as an excellent platform for sophisticated embedded applications:

• Custom peripheral controllers
• Hardware acceleration modules
• System-on-chip (SoC) prototyping
• Digital signal processing implementations
• Embedded processor interfaces

Test and Measurement Equipment

High-performance test equipment leverages the XC2S200-6FGG927C’s capabilities:

• Logic analyzers and protocol analyzers
• Arbitrary waveform generators
• High-speed data acquisition systems
• Automated test equipment (ATE)
• Scientific instrumentation

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Design and Development Support

Development Tools and Software

The XC2S200-6FGG927C is fully supported by Xilinx ISE Design Suite, providing comprehensive design tools:

• Design Entry: Schematic capture, VHDL, and Verilog HDL support
• Synthesis: Logic optimization and technology mapping
• Implementation: Place and route with timing closure
• Verification: Functional and timing simulation
• Programming: Configuration file generation

IP Core Libraries

Designers can accelerate development using pre-verified intellectual property cores:

• Microprocessor cores (PicoBlaze, MicroBlaze soft processors)
• Communication interfaces (UART, SPI, I2C, Ethernet MAC)
• Memory controllers (SDRAM, DDR, Flash)
• DSP functions (FIR filters, FFT, cordic)
• Bus interfaces (Wishbone, AXI, PLB)

Reference Designs and Documentation

Comprehensive documentation supports rapid product development:

• Complete device datasheets with electrical specifications
• Application notes for common design patterns
• Reference designs for typical applications
• PCB layout guidelines for FGG927 package
• Timing analysis and constraints documentation

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XC2S200-6FGG927C vs Alternative Packages

Package Comparison Table

The FGG927 package provides the maximum I/O capability for the XC2S200 device, making it ideal for applications requiring extensive connectivity to multiple peripherals, memory devices, and communication interfaces.

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Performance Characteristics

Timing and Speed Performance

The -6 speed grade designation indicates commercial-grade performance optimized for demanding applications:

• Maximum Internal Clock Frequency: Up to 200 MHz for typical designs
• System Performance: 263 MHz maximum toggle rate
• Propagate Delay: Optimized for high-speed signal paths
• Setup and Hold Times: Stringent timing specifications for reliable operation

Power Consumption Profile

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PCB Design Considerations for FGG927 Package

Layout Requirements

Successful PCB implementation of the XC2S200-6FGG927C requires careful attention to:

• Ball Grid Array Routing: Fine-pitch BGA requires controlled impedance routing
• Power Distribution: Multiple ground and power planes for clean power delivery
• Decoupling Strategy: Distributed capacitor placement near package
• Thermal Management: Adequate copper area for heat dissipation
• Signal Integrity: Proper termination and impedance matching

Assembly Considerations

The FGG927 package mounting process demands:

• Professional BGA reflow soldering equipment
• X-ray inspection for solder joint verification
• Thermal profile optimization for reliable solder connections
• PCB surface finish compatible with lead-free soldering
• Moisture sensitivity level (MSL) compliance

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Quality and Compliance Standards

Reliability and Testing

Each XC2S200-6FGG927C undergoes rigorous quality assurance:

• Full functional testing at manufacturing
• Speed grading verification
• Temperature cycling qualification
• Electrostatic discharge (ESD) protection testing
• Long-term reliability validation

Environmental Compliance

The device meets international environmental standards:

• RoHS Compliant: Lead-free package option available (indicated by “G” in ordering code)
• REACH Compliance: Meets European chemical regulations
• Conflict Minerals: Responsible sourcing certification
• Green Package: Environmentally conscious manufacturing

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Ordering Information and Part Number Breakdown

Understanding the XC2S200-6FGG927C Part Number

Alternative Temperature Grades

• C Grade: Commercial (0°C to +85°C) – Standard applications
• I Grade: Industrial (-40°C to +100°C) – Harsh environments (if available)

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Migration and Scalability Options

Family Compatibility

The Spartan-II family offers vertical migration paths for design flexibility:

This migration capability allows designers to prototype with smaller devices and scale to the XC2S200-6FGG927C for production without board layout changes.

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Best Practices for XC2S200-6FGG927C Implementation

Design Optimization Strategies

Maximize performance and resource utilization through:

1. Hierarchical Design Methodology: Organize complex designs into manageable modules
2. Timing Constraint Definition: Establish clear timing requirements early in development
3. Resource Planning: Allocate CLBs, memory, and I/O strategically
4. Clock Domain Management: Minimize clock domain crossings for reliability
5. Power Optimization: Implement clock gating and unused resource management

Common Design Pitfalls to Avoid

• Inadequate timing constraint specification
• Insufficient decoupling capacitor networks
• Overlooking I/O buffer placement optimization
• Neglecting thermal considerations in enclosure design
• Improper configuration mode selection

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Technical Support and Resources

Documentation Resources

Comprehensive technical documentation available includes:

• DS001 Datasheet: Complete electrical and timing specifications
• UG002 User Guide: Architecture details and design guidelines
• XAPP Notes: Application-specific implementation guidance
• Answer Records: Solutions to common design challenges
• PCB Design Files: Reference layouts and stack-up recommendations

Community and Professional Support

Engineers working with the XC2S200-6FGG927C can access:

• Xilinx Community Forums for peer support
• Technical support channels through authorized distributors
• Design consultation services for complex implementations
• Training courses and webinars on FPGA design methodology
• Third-party design services and IP vendors

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Competitive Advantages of XC2S200-6FGG927C

Key Differentiators

The XC2S200-6FGG927C stands out through:

• Maximum I/O Density: 284 user I/O pins in Spartan-II XC2S200 family
• Proven Architecture: Mature, well-characterized platform with extensive deployment history
• Cost-Effective Solution: Superior price-performance ratio compared to high-end FPGAs
• Design Security: Configuration encryption and readback protection options
• Long-Term Availability: Established product with extended lifecycle support

Value Proposition

Organizations choose the XC2S200-6FGG927C for:

• Rapid development cycles with mature tools and libraries
• Lower total cost of ownership versus ASIC development
• Field upgradability for product improvements and bug fixes
• Reduced time-to-market through proven reference designs
• Minimal risk compared to new device families

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Getting Started with XC2S200-6FGG927C

Initial Development Steps

1. Acquire Development Tools: Download Xilinx ISE Design Suite
2. Review Documentation: Study device datasheet and user guide
3. Select Development Board: Choose or design evaluation platform
4. Define Requirements: Establish performance and resource specifications
5. Create Design Architecture: Develop high-level system block diagram
6. Implement and Verify: Code, simulate, and synthesize design
7. Prototype and Test: Validate functionality on hardware platform

Procurement and Supply Chain

The XC2S200-6FGG927C is available through:

• Authorized electronic component distributors
• Direct purchase from AMD Xilinx sales channels
• Global supply chain partners with regional support
• Consignment and scheduled delivery programs for production
• Quality-assured authentic components with full traceability

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Frequently Asked Questions About XC2S200-6FGG927C

Is the XC2S200-6FGG927C suitable for new designs?

While the Spartan-II family is a mature product line, it continues to be appropriate for cost-sensitive applications where proven reliability is valued over cutting-edge performance. For new designs requiring the latest features, consider evaluating newer AMD Xilinx FPGA families while referencing Spartan-II architecture principles.

What is the difference between the -5 and -6 speed grades?

The -6 speed grade offers faster performance than the -5 grade, with reduced propagation delays and higher maximum clock frequencies. However, the -6 grade is exclusively available in the commercial temperature range, while -5 may be available in industrial temperature variants.

Can I replace another XC2S200 package variant with the FGG927?

While all XC2S200 variants share the same core architecture and logic resources, package pinouts differ significantly. Migration from another package to FGG927 will require PCB redesign to accommodate the different ball pattern and footprint. However, the FPGA design code can be reused with modified I/O pin assignments.

What configuration options are supported?

The XC2S200-6FGG927C supports multiple configuration modes including:

• Master Serial mode with external PROM
• Slave Serial mode for microprocessor control
• Boundary Scan (JTAG) for development and debugging
• SelectMAP parallel configuration for fast loading

How do I obtain reliable pricing and availability?

For current pricing, lead times, and inventory availability, contact authorized distributors or visit the Xilinx FPGA product page for comprehensive supplier information and technical resources.

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Conclusion: XC2S200-6FGG927C for Professional FPGA Applications

The XC2S200-6FGG927C represents a mature, well-proven FPGA solution that continues to serve demanding applications across telecommunications, industrial automation, embedded systems, and test equipment sectors. With 200,000 system gates, 5,292 logic cells, and 284 maximum user I/O pins in the high-density FGG927 package, this Spartan-II device delivers exceptional connectivity and logic resources for complex digital designs.

The device’s robust architecture, comprehensive development tool support, extensive documentation, and proven deployment history make it an excellent choice for applications prioritizing reliability, cost-effectiveness, and design security. Whether developing telecommunications infrastructure, industrial control systems, or sophisticated embedded platforms, the XC2S200-6FGG927C provides the programmable logic resources and I/O capabilities necessary for successful product implementation.

For engineers and organizations seeking a dependable FPGA solution with maximum I/O density in the Spartan-II family, the XC2S200-6FGG927C delivers outstanding value through its combination of performance, flexibility, and long-term support.