The XC2S200-6FGG926C represents a flagship device in the Xilinx Spartan-II FPGA family, delivering exceptional programmable logic capabilities in a robust 926-ball fine-pitch BGA package. This field-programmable gate array combines 200,000 system gates with advanced 0.18μm CMOS technology, making it an ideal solution for high-volume applications requiring reliable performance and extensive I/O connectivity.

Manufactured by Xilinx (now part of AMD), the XC2S200-6FGG926C offers designers a cost-effective alternative to traditional ASICs while maintaining the flexibility to implement design changes without hardware replacement. With its 2.5V core voltage operation and commercial-grade temperature range, this FPGA excels in demanding industrial, telecommunications, and embedded systems applications.

Key Specifications and Technical Features

Core Architecture Specifications

Package and Physical Characteristics

Advanced Features of XC2S200-6FGG926C

Configurable Logic Block (CLB) Architecture

The XC2S200-6FGG926C incorporates 1,176 Configurable Logic Blocks arranged in a 28×42 array, providing designers with substantial logic resources. Each CLB contains four logic slices, with each slice offering two 4-input Look-Up Tables (LUTs), carry logic, and two storage elements. This architecture enables efficient implementation of complex combinational and sequential logic designs.

Flexible Memory Resources

This Spartan-II FPGA delivers dual-layer memory architecture:

Distributed RAM: With 75,264 bits of distributed RAM, designers can implement small memory blocks directly within the CLB fabric, reducing routing congestion and improving performance for applications requiring scattered memory access.

Block RAM: The device features 56 Kbits of true dual-port block RAM organized in multiple blocks, perfect for implementing FIFOs, buffers, and data storage elements with synchronous read and write capabilities.

Input/Output Capabilities

The FGG926 package provides access to 284 user I/O pins, excluding dedicated global clock inputs. These I/O pins support multiple industry-standard interfaces and voltage levels, enabling seamless integration with various external components and systems. Each I/O block includes programmable pull-up/pull-down resistors, slew rate control, and three-state buffers.

Clock Management System

Four Delay-Locked Loops (DLLs) positioned at each corner of the die provide sophisticated clock management capabilities. These DLLs eliminate clock distribution delays, reduce clock skew, and support clock multiplication and division, ensuring reliable timing across complex designs.

Applications and Use Cases

Industrial Control Systems

The XC2S200-6FGG926C excels in industrial automation, providing the logic density and I/O count necessary for motor control, sensor interfacing, and real-time data processing applications. Its commercial temperature range ensures reliable operation in typical factory environments.

Telecommunications Equipment

With extensive I/O capabilities and substantial logic resources, this FPGA serves as an excellent platform for protocol processing, data packet routing, and interface conversion in telecommunications infrastructure. The high-speed performance of the -6 speed grade supports demanding timing requirements.

Embedded Systems Development

System designers leverage the XC2S200-6FGG926C for embedded processing applications, implementing custom peripherals, memory controllers, and application-specific processors. The programmable nature eliminates lengthy ASIC development cycles while maintaining flexibility for future enhancements.

Medical Instrumentation

Medical device manufacturers utilize this FPGA for signal processing, data acquisition, and control functions in diagnostic and monitoring equipment. The device’s reliability and extensive logic resources support complex algorithms and multiple simultaneous operations.

Performance Characteristics

Speed Grade Analysis

The -6 speed grade represents the highest performance tier available in commercial-temperature Spartan-II devices, offering:

• Reduced propagation delays through logic elements
• Faster clock-to-output times for registered signals
• Enhanced setup and hold time margins
• Maximum internal clock frequencies up to 263 MHz for specific designs

Power Consumption Profile

The XC2S200-6FGG926C operates at 2.5V core voltage, balancing performance with reasonable power consumption. Power usage varies based on design utilization, clock frequencies, and I/O switching rates. The 0.18μm process technology provides excellent power efficiency compared to older FPGA generations.

Design and Development Resources

Compatible Development Tools

Xilinx ISE (Integrated Software Environment) provides comprehensive support for the XC2S200-6FGG926C, including:

• Synthesis and optimization tools
• Place-and-route engines optimized for Spartan-II architecture
• Timing analysis and constraint management
• BitGen configuration file generation
• ChipScope Pro for embedded logic analysis

Configuration Options

The device supports multiple configuration modes:

• Master Serial configuration
• Slave Serial configuration
• Boundary Scan (JTAG) configuration
• SelectMAP parallel configuration

This flexibility enables designers to choose the most appropriate configuration method based on system requirements and available resources.

Comparison with Related FPGA Solutions

Position Within Spartan-II Family

The XC2S200-6FGG926C represents the largest device in the standard Spartan-II family, offering maximum logic density and I/O resources for demanding applications.

Package Selection Advantages

FGG926 Package Benefits

The 926-ball fine-pitch BGA package offers several advantages:

Maximum I/O Access: Unlike smaller packages that limit available I/O pins, the FGG926 provides access to all 284 user I/O pins, ensuring designers can fully utilize the device’s capabilities.

Thermal Performance: The BGA package’s large thermal pad and multiple ground connections provide excellent heat dissipation, supporting reliable operation in high-utilization designs.

Signal Integrity: Short, controlled-impedance ball connections minimize signal degradation and support high-speed I/O operations with reduced electromagnetic interference.

Board Space Efficiency: Despite its high pin count, the BGA format maintains a relatively compact footprint suitable for space-constrained designs.

Quality and Reliability Standards

Manufacturing Excellence

Xilinx manufactures the XC2S200-6FGG926C using proven 0.18μm CMOS process technology in certified fabrication facilities. Each device undergoes comprehensive testing including:

• Functional testing of all logic resources
• Speed grade verification
• I/O characterization across voltage and temperature ranges
• Package integrity inspection

Long-Term Availability

As part of the mature Spartan-II product line, the XC2S200-6FGG926C benefits from extended product lifecycle support, making it suitable for applications requiring multi-year production runs and long-term field support.

Getting Started with XC2S200-6FGG926C

Design Considerations

When implementing designs on the XC2S200-6FGG926C, engineers should consider:

Clock Domain Management: Utilize the four DLLs strategically to minimize clock skew and ensure reliable timing across multiple clock domains.

Memory Architecture: Balance the use of distributed RAM and block RAM based on access patterns and performance requirements, leveraging distributed RAM for shallow, distributed memories and block RAM for larger, centralized storage.

I/O Planning: Assign pins carefully considering bank locations and voltage requirements, using Xilinx PinOut Area Constraints (PACs) to optimize routing and signal integrity.

Timing Closure: For -6 speed grade designs targeting maximum performance, implement proper timing constraints early in the design process and utilize timing-driven place-and-route options.

Recommended Design Flow

1. Architecture Definition: Specify system requirements and partition functionality
2. RTL Development: Create HDL code (VHDL/Verilog) implementing desired functionality
3. Synthesis: Generate gate-level netlist optimized for Spartan-II architecture
4. Constraints Entry: Define timing, placement, and I/O constraints
5. Implementation: Execute place-and-route to create physical design
6. Timing Verification: Analyze timing reports and iterate as needed
7. BitStream Generation: Create configuration file for device programming

Support and Technical Resources

For comprehensive technical information and support regarding the XC2S200-6FGG926C, engineers can access:

• Official Xilinx datasheets and application notes
• ISE Design Suite documentation
• Spartan-II user guides and reference manuals
• PCB layout guidelines for FGG926 package
• Power estimation tools and thermal analysis resources

Finding Quality Xilinx FPGA Components

When sourcing the XC2S200-6FGG926C for production or prototyping, ensure you work with authorized distributors who provide genuine Xilinx components with proper traceability and warranty support.

Conclusion

The XC2S200-6FGG926C stands as a robust, feature-rich FPGA solution that combines substantial logic resources, extensive I/O capabilities, and high-performance operation in a reliable package. Its 200,000 system gates, 284 user I/O pins, and advanced memory architecture make it ideal for demanding industrial, telecommunications, and embedded applications.

Whether you’re developing custom hardware accelerators, implementing complex control systems, or creating specialized communication interfaces, the XC2S200-6FGG926C delivers the flexibility, performance, and reliability required for successful product deployment. The device’s mature architecture, comprehensive tool support, and proven track record in field applications ensure designers can confidently build innovative solutions that meet stringent performance and quality requirements.