The XC2S200-6FGG925C is a premium field-programmable gate array (FPGA) from the renowned Spartan-II family, manufactured by Xilinx (now AMD). This powerful programmable logic device delivers exceptional performance for complex digital designs, offering 200,000 system gates and 5,292 logic cells in a robust 925-ball fine-pitch BGA package. Designed for commercial temperature range applications, this FPGA provides engineers with the flexibility and performance needed for demanding embedded systems.

As a member of the Spartan-II FPGA series, the XC2S200-6FGG925C represents a cost-effective alternative to mask-programmed ASICs, eliminating lengthy development cycles and high initial costs while maintaining superior performance characteristics.

Key Technical Specifications

Core Performance Features

Memory Architecture

Electrical Characteristics

Advanced Architecture and Design Features

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG925C incorporates 1,176 configurable logic blocks arranged in a 28×42 array, providing substantial resources for implementing complex digital logic functions. Each CLB contains multiple logic slices with look-up tables (LUTs), flip-flops, and dedicated carry logic for high-speed arithmetic operations.

Input/Output Block Capabilities

With 284 maximum available user I/O pins, the XC2S200-6FGG925C offers extensive connectivity options for interfacing with external devices and systems. The I/O blocks support various voltage standards and include features such as:

• Programmable slew rate control
• Three-state output capability
• On-chip termination options
• Support for multiple I/O standards (LVTTL, LVCMOS, PCI, etc.)

Memory Resources

The dual-memory architecture combines distributed RAM within CLBs and dedicated block RAM modules, offering designers flexibility in memory implementation strategies. This configuration is ideal for applications requiring buffering, lookup tables, and data storage.

Clock Management

Four Delay-Locked Loops (DLLs) positioned at each corner of the die provide advanced clock management capabilities, including:

• Clock de-skewing
• Phase shifting
• Frequency multiplication and division
• Low-jitter clock distribution

FGG925 Package Specifications

Package Advantages

The fine-pitch ball grid array (FGG925) package offers several distinct advantages for high-density designs:

Physical Dimensions

The FGG925 package provides a professional-grade mounting solution optimized for industrial PCB applications, offering reliable solder joint connections and mechanical stability across temperature variations.

Target Applications and Use Cases

Industrial Automation Systems

The XC2S200-6FGG925C excels in industrial control applications, providing the computational power and I/O flexibility needed for:

• Programmable logic controllers (PLCs)
• Motion control systems
• Factory automation equipment
• Process monitoring and control

Communications Equipment

This FPGA is ideally suited for telecommunications infrastructure, including:

• Network routers and switches
• Protocol conversion systems
• Data packet processing
• Signal conditioning circuits

Automotive Electronics

The commercial temperature range makes the XC2S200-6FGG925C suitable for various automotive applications:

• Dashboard electronics
• Infotainment systems
• Sensor interface modules
• Electronic control units (ECUs)

Medical Device Development

Medical equipment designers leverage this FPGA for:

• Patient monitoring systems
• Diagnostic equipment interfaces
• Medical imaging processing
• Laboratory instrumentation

Performance Characteristics

Speed Grade -6 Benefits

The -6 speed grade designation indicates this device is optimized for commercial applications with the following performance characteristics:

System Integration Advantages

Designers choosing the XC2S200-6FGG925C benefit from:

• In-system programmability via JTAG
• Unlimited reprogramming cycles
• Fast configuration times
• Bitstream security features
• Readback capability for debugging

Comparison with Alternative FPGA Solutions

Spartan-II Family Positioning

The XC2S200-6FGG925C occupies the top tier of the Spartan-II family, delivering maximum logic density and I/O resources while maintaining cost-effectiveness compared to more advanced FPGA families.

Design Tools and Development Support

Compatible Development Environments

Engineers can leverage industry-standard Xilinx FPGA development tools for the XC2S200-6FGG925C, including:

• ISE Design Suite
• FPGA Editor for advanced placement
• ChipScope Pro for in-system debugging
• Timing Analyzer for performance optimization

IP Core Integration

The XC2S200-6FGG925C supports numerous pre-verified IP cores:

• DSP functions (FIR filters, FFT processors)
• Communication protocols (UART, SPI, I2C)
• Memory controllers
• Arithmetic processors
• Custom peripheral interfaces

Procurement and Availability

Ordering Information Breakdown

Understanding the part number nomenclature:

• XC2S200: Device type and gate count
• -6: Speed grade (commercial)
• FGG925: Package type (925-ball fine-pitch BGA)
• C: Commercial temperature range (0°C to +85°C)

Quality and Reliability

As a Xilinx-manufactured component, the XC2S200-6FGG925C undergoes rigorous quality control:

• 100% electrical testing
• Burn-in screening available
• Extended temperature testing
• Long-term reliability validation
• RoHS and environmental compliance

Implementation Best Practices

PCB Layout Considerations

For optimal performance with the FGG925 package:

1. Power Distribution: Implement proper decoupling capacitors near all power pins
2. Thermal Management: Ensure adequate thermal vias and heat dissipation paths
3. Signal Integrity: Maintain controlled impedance for high-speed signals
4. Escape Routing: Plan BGA fanout strategy during early design phases

Configuration Methods

The XC2S200-6FGG925C supports multiple configuration modes:

Competitive Advantages

Why Choose XC2S200-6FGG925C?

This FPGA delivers compelling benefits over alternative solutions:

1. Cost-Effective Scalability: More economical than larger FPGA families for 200K gate designs
2. Proven Reliability: Mature Spartan-II architecture with extensive field deployment history
3. Design Security: Bitstream encryption capabilities protect intellectual property
4. Extensive I/O: 284 user I/O pins accommodate complex interface requirements
5. Rapid Prototyping: In-system programmability enables quick design iterations

ASIC Replacement Strategy

The XC2S200-6FGG925C provides a strategic alternative to ASIC development:

• Zero NRE costs
• Immediate availability
• Field upgradability
• Risk mitigation for volume uncertainty
• Shorter time-to-market

Technical Support and Resources

Documentation Suite

Comprehensive technical documentation includes:

• Complete datasheet with AC/DC specifications
• Application notes for specific use cases
• Reference designs and example code
• Package mechanical drawings
• Thermal characterization data

Design Verification

Recommended verification methodologies:

• Functional simulation with ModelSim or similar tools
• Static timing analysis
• Power estimation and optimization
• In-system verification with ChipScope

Environmental Specifications

RoHS Compliance

The “G” designation in FGG925 indicates lead-free, RoHS-compliant packaging, meeting international environmental regulations for electronic components.

Reliability Data

Frequently Asked Questions

What distinguishes the -6 speed grade?

The -6 speed grade is specifically designed for commercial temperature range applications, offering optimized performance-to-cost ratio for systems operating between 0°C and +85°C.

Is the XC2S200-6FGG925C suitable for new designs?

While the Spartan-II family is mature technology, it remains viable for cost-sensitive applications where proven reliability is preferred over cutting-edge performance.

What configuration memory is required?

The XC2S200 requires approximately 2,692,176 configuration bits, typically stored in serial PROM devices such as XC18V04 or compatible SPI Flash memory.

Can I migrate from smaller Spartan-II devices?

Yes, the Spartan-II family maintains pin compatibility across certain package types, facilitating design scalability and future upgrades.

Conclusion: XC2S200-6FGG925C for Industrial FPGA Solutions

The XC2S200-6FGG925C represents a robust, field-proven FPGA solution for industrial and commercial applications requiring substantial logic resources, extensive I/O capability, and reliable operation. With 5,292 logic cells, 200,000 system gates, and 284 user I/O pins in a space-efficient 925-ball BGA package, this device delivers exceptional value for complex digital designs.

Whether implementing industrial control systems, communications equipment, automotive electronics, or medical devices, the XC2S200-6FGG925C provides the programmability, performance, and reliability demanded by professional engineering applications. Its mature architecture, comprehensive development tool support, and proven field reliability make it an intelligent choice for projects prioritizing cost-effectiveness without compromising functionality.

For procurement inquiries, technical specifications, or application support regarding the XC2S200-6FGG925C Spartan-II FPGA, consult with authorized distributors and leverage the extensive Xilinx FPGA resource ecosystem to accelerate your embedded system development.