The XC2S200-6FGG924C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family, manufactured by AMD Xilinx. This high-density programmable logic device delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it an ideal solution for complex digital designs across telecommunications, industrial automation, medical imaging, and embedded systems applications. The XC2S200-6FGG924C features a robust 924-ball fine-pitch ball grid array (FBGA) package, providing extensive I/O capabilities and superior thermal performance for demanding applications.
Key Technical Specifications of XC2S200-6FGG924C
| Specification |
Value |
| Device Family |
Spartan-II FPGA |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Maximum User I/O |
284 pins |
| Package Type |
924-ball Fine-Pitch BGA (FGG924) |
| Speed Grade |
-6 (High Performance) |
| Core Voltage |
2.5V |
| Operating Temperature |
Commercial (0°C to 85°C) |
| Technology Node |
0.18μm |
| Maximum Frequency |
263 MHz |
Advanced Features and Architecture
Configurable Logic Block (CLB) Architecture
The XC2S200-6FGG924C incorporates 1,176 configurable logic blocks arranged in a 28 x 42 array, providing unmatched flexibility for implementing complex digital circuits. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers that enable designers to create custom logic functions tailored to specific application requirements.
Memory Resources for Data-Intensive Applications
This Spartan-II FPGA offers comprehensive memory solutions:
- 75,264 bits of distributed RAM integrated throughout the CLB array for low-latency data storage
- 56 Kbits of block RAM organized in dedicated columns for high-speed buffering and data processing
- Flexible memory configuration supporting various depth and width combinations
High-Speed I/O Capabilities
The 924-ball fine-pitch BGA package provides up to 284 user I/O pins, enabling extensive connectivity for complex system integration. The XC2S200-6FGG924C supports multiple I/O standards and features four delay-locked loops (DLLs) positioned at each corner of the die for precise clock management and distribution.
Package Details: FGG924 Fine-Pitch Ball Grid Array
Package Characteristics
| Package Feature |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Ball Count |
924 balls |
| Ball Material |
Lead-free (SnAgCu) |
| Ball Pitch |
1.0 mm |
| Package Marking |
FGG924 |
| Assembly Type |
Surface Mount Technology (SMT) |
| Thermal Performance |
Enhanced with multilayer substrate |
Advanced Packaging Technology
The FGG924 package utilizes advanced ball grid array technology with a multilayer BT (bismaleimide triazene) epoxy substrate, delivering superior electrical and thermal performance. The lead-free solder balls comply with RoHS environmental standards while maintaining excellent reliability under various operating conditions.
Performance Characteristics and Speed Grade
Speed Grade -6 Performance
The -6 speed grade designation indicates this device is optimized for high-performance applications requiring fast signal processing and minimal propagation delays. Key performance metrics include:
- Maximum system frequency: 263 MHz
- Optimized timing paths for critical applications
- Enhanced setup and hold time margins
- Commercial temperature range operation (0°C to 85°C)
Clock Management System
Four integrated delay-locked loops (DLLs) provide advanced clock management features:
- Clock deskewing and phase shifting
- Clock frequency multiplication and division
- Reduced clock-to-output delay
- Improved system-level timing closure
Application Areas for XC2S200-6FGG924C
Telecommunications and Networking
The XC2S200-6FGG924C excels in communication infrastructure applications, supporting protocol implementation, packet processing, and high-speed data routing. Its abundant logic resources and I/O capabilities make it suitable for:
- Network routers and switches
- Protocol converters
- Telecommunications equipment
- Data encryption systems
Industrial Automation and Control
For industrial applications, this FPGA provides reliable, real-time control capabilities:
- Motor control systems
- Process automation controllers
- Machine vision systems
- Industrial protocol interfaces
Medical Electronics
The device’s reconfigurability and high performance support advanced medical applications:
- Medical imaging equipment
- Diagnostic instruments
- Patient monitoring systems
- Laboratory analysis equipment
Security and Surveillance Systems
High-speed processing and extensive I/O make this FPGA ideal for security applications:
- Video surveillance systems
- Biometric identification
- Access control systems
- Secure data transmission
Design Advantages and Development Benefits
Cost-Effective Alternative to ASICs
The XC2S200-6FGG924C provides a superior alternative to mask-programmed application-specific integrated circuits (ASICs) by eliminating:
- High non-recurring engineering (NRE) costs
- Extended development cycles
- Manufacturing risks associated with custom silicon
- Inventory management challenges
Field Programmability and Upgrade Capability
Unlike fixed-function ASICs, the XC2S200-6FGG924C offers in-system reprogrammability, enabling:
- Design modifications without hardware changes
- Feature upgrades in deployed systems
- Bug fixes through firmware updates
- Product customization for different markets
Rapid Prototyping and Time-to-Market
FPGA technology accelerates product development by providing:
- Immediate design verification
- Iterative design refinement
- Reduced development risk
- Faster time-to-market for new products
Integration with Development Tools
Xilinx ISE Design Suite Compatibility
The XC2S200-6FGG924C is fully supported by Xilinx ISE (Integrated Software Environment) development tools, offering comprehensive design entry, synthesis, implementation, and verification capabilities.
Programming and Configuration Options
Multiple configuration methods provide flexibility for different deployment scenarios:
- JTAG boundary scan interface
- Serial peripheral interface (SPI)
- Master serial mode
- Slave serial mode
For additional information on Xilinx FPGA products and design resources, visit our comprehensive FPGA resource center.
PCB Design Considerations for FGG924 Package
Board Layout Requirements
| Design Parameter |
Recommendation |
| PCB Layers |
Minimum 4-layer stackup |
| Pad Type |
Non-Solder Mask Defined (NSMD) |
| Via Technology |
Via-in-pad for dense routing |
| Ball Pitch |
1.0 mm center-to-center |
| Thermal Management |
Adequate copper pour and vias |
| Escape Routing |
Fanout routing strategy required |
Assembly and Soldering Guidelines
The lead-free FGG924 package requires specific reflow parameters:
- Peak reflow temperature: 230°C to 245°C
- Reflow time above liquidus: 60-90 seconds
- Recommended solder paste: SnAgCu formulation
- No-clean or water-soluble flux recommended
Reliability and Quality Standards
Environmental Compliance
The XC2S200-6FGG924C meets stringent environmental regulations:
- RoHS compliant (lead-free package)
- REACH compliant materials
- Halogen-free options available
- MSL (Moisture Sensitivity Level) rated
Quality and Testing
Each device undergoes comprehensive testing:
- 100% electrical testing
- Functional verification
- Boundary scan testing
- Temperature cycling qualification
Ordering Information and Part Number Breakdown
Part Number Decoding: XC2S200-6FGG924C
- XC = Xilinx Commercial FPGA
- 2S = Spartan-II family
- 200 = 200,000 system gates
- -6 = Speed grade (high performance)
- FGG924 = 924-ball fine-pitch BGA package
- C = Commercial temperature range
Package Variants and Options
The XC2S200 series is available in multiple package configurations to suit different design requirements, with the FGG924 offering the highest I/O count and thermal performance for demanding applications.
Competitive Advantages of XC2S200-6FGG924C
Superior Price-Performance Ratio
The Spartan-II family delivers exceptional value by combining:
- High logic density at competitive pricing
- Low power consumption (2.5V core)
- Extensive I/O resources
- Proven reliability in deployed systems
Scalable Design Platform
The Spartan-II architecture supports vertical migration within the family, enabling:
- Design reuse across different device densities
- Future capacity upgrades with minimal redesign
- Consistent development methodology
- Common pin assignments across devices
Established Ecosystem Support
Benefit from mature development resources:
- Comprehensive documentation and datasheets
- Extensive reference designs
- Active user community
- Third-party IP cores and tools
Technical Support and Resources
Design Documentation
Access complete technical documentation including:
- Detailed product datasheets
- Application notes
- PCB layout guidelines
- Thermal design considerations
- Programming specifications
Development Boards and Kits
Evaluate the XC2S200-6FGG924C using available development platforms that provide immediate access to the device’s capabilities through pre-configured hardware and example designs.
Power Management and Consumption
Power Supply Requirements
| Power Rail |
Voltage |
Typical Current |
| VCCINT (Core) |
2.5V ± 5% |
Application dependent |
| VCCO (I/O) |
1.8V to 3.3V |
Bank specific |
| VCCAUX |
2.5V |
Auxiliary circuits |
Low Power Design Features
Optimize power consumption through:
- Dynamic power management
- Selective clock gating
- I/O standard selection
- Unused logic power-down
Conclusion: Why Choose XC2S200-6FGG924C
The XC2S200-6FGG924C represents an excellent choice for engineers and designers requiring a high-performance, cost-effective FPGA solution with extensive I/O capabilities. Its combination of 200,000 system gates, 5,292 logic cells, 284 I/O pins, and advanced 924-ball BGA packaging makes it suitable for the most demanding applications across telecommunications, industrial, medical, and security sectors.
With proven reliability, comprehensive development tool support, and the flexibility of field programmability, the XC2S200-6FGG924C delivers the performance and versatility needed for successful product development while reducing time-to-market and development costs compared to traditional ASIC approaches.
Whether you’re designing next-generation communication systems, implementing complex control algorithms, or developing innovative embedded solutions, the XC2S200-6FGG924C provides the logic resources, memory capacity, and I/O bandwidth to bring your vision to reality.
