The XC2S200-6FGG923C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family, manufactured by Xilinx (now AMD). This versatile FPGA delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it an ideal solution for complex digital design applications across telecommunications, industrial automation, and embedded systems.

Featuring a high-density 923-ball Fine-Pitch Ball Grid Array (FGG923) package, the XC2S200-6FGG923C provides superior I/O capabilities and thermal performance for demanding commercial applications. With its -6 speed grade designation, this FPGA ensures optimal performance in high-speed digital processing environments.

Key Features and Specifications

Core Architecture Specifications

Memory and Storage Capabilities

Package Information

Technical Performance and Capabilities

High-Speed Digital Processing

The XC2S200-6FGG923C FPGA supports system performance up to 200 MHz, enabling rapid data processing for time-critical applications. The -6 speed grade ensures minimum propagation delays and maximum operating frequencies, making this device suitable for:

• High-speed digital signal processing (DSP)
• Real-time data acquisition systems
• Fast communication protocols
• Video and image processing applications

Configurable Logic Block Architecture

The device features a robust 28 x 42 CLB array with 1,176 total configurable logic blocks. Each CLB contains:

• Look-up tables (LUTs) for combinatorial logic
• Flip-flops for sequential logic implementation
• Multiplexers for flexible signal routing
• Dedicated carry logic for arithmetic operations

Input/Output Capabilities

With 284 maximum available user I/O pins, the XC2S200-6FGG923C provides extensive connectivity options for interfacing with external components and systems. The I/O blocks support multiple industry-standard signaling protocols including:

• LVTTL (Low-Voltage TTL)
• LVCMOS (Low-Voltage CMOS)
• PCI 33/66 MHz
• GTL+ (Gunning Transceiver Logic Plus)

Application Areas and Use Cases

Industrial Automation and Control

The XC2S200-6FGG923C excels in industrial applications requiring precise control and monitoring:

• Motor control systems
• Process automation controllers
• Sensor interface modules
• PLC (Programmable Logic Controller) implementations
• Factory automation equipment

Telecommunications and Networking

This FPGA is well-suited for communication infrastructure applications:

• Protocol converters and bridges
• Network packet processors
• Baseband processing units
• Telecommunications switching systems
• Data routing and multiplexing

Medical and Healthcare Equipment

The reliability and reconfigurability of the XC2S200-6FGG923C make it ideal for medical devices:

• Medical imaging systems
• Patient monitoring equipment
• Diagnostic instrumentation
• Laboratory analysis tools
• Portable medical devices

Consumer Electronics

Deploy this FPGA in various consumer applications:

• Digital video processing
• Audio signal processing
• Display controllers
• Gaming systems
• Set-top boxes

Design and Development Support

Software Tools and Development Environment

The XC2S200-6FGG923C is fully supported by Xilinx ISE Design Suite, providing comprehensive development tools:

• Design entry through VHDL or Verilog HDL
• Synthesis and optimization engines
• Place-and-route capabilities
• Timing analysis and verification
• Device programming and configuration

IP Core Library

Access a vast library of pre-verified intellectual property (IP) cores:

• Processor cores (MicroBlaze, PicoBlaze)
• Communication interfaces (UART, SPI, I2C)
• Memory controllers
• DSP functions
• Custom peripheral controllers

Configuration Methods

The device supports multiple configuration modes:

• Master serial mode
• Slave serial mode
• Master parallel mode
• Boundary-scan (JTAG) programming
• Configuration PROM support

Advantages Over ASIC Solutions

Cost-Effective Development

The XC2S200-6FGG923C provides significant advantages over traditional ASIC (Application-Specific Integrated Circuit) designs:

• No NRE costs – Eliminate non-recurring engineering expenses
• Rapid prototyping – Reduce development time from months to weeks
• Lower risk – Test and verify designs before committing to production
• Flexible iterations – Modify designs without new silicon fabrication

Field Upgradability

Unlike fixed-function ASICs, the XC2S200-6FGG923C offers:

• In-system reprogramming capabilities
• Design updates without hardware replacement
• Feature additions through firmware updates
• Bug fixes and performance improvements post-deployment

Power Consumption and Thermal Management

Power Specifications

Thermal Considerations

The FGG923 package provides excellent thermal dissipation characteristics:

• Enhanced heat spreading capabilities
• Suitable for natural convection cooling in many applications
• Compatible with heatsinks for high-power designs
• Junction temperature monitoring available

Quality and Reliability

Manufacturing Standards

The XC2S200-6FGG923C is manufactured to the highest quality standards:

• ISO 9001 certified manufacturing facilities
• Rigorous testing and qualification procedures
• Long-term reliability testing
• Industry-standard quality metrics

Operating Life and MTBF

This FPGA offers excellent reliability characteristics:

• High Mean Time Between Failures (MTBF)
• Proven Spartan-II architecture reliability
• Extended operational lifetime
• Suitable for mission-critical applications

Comparison with Alternative FPGA Solutions

XC2S200 Package Variants

Device Selection Considerations

When choosing the XC2S200-6FGG923C versus other variants, consider:

• I/O Requirements – The FGG923 offers maximum pin count for complex interfacing
• Board Space – Larger package requires more PCB area
• Thermal Budget – Higher pin count enables better heat dissipation
• Cost Constraints – Package complexity affects unit pricing

Ordering and Availability Information

Part Number Breakdown

XC2S200-6FGG923C decoding:

• XC2S200 – Device family and gate count (200K gates)
• 6 – Speed grade (-6 commercial)
• FGG923 – Package type (923-ball fine-pitch BGA)
• C – Commercial temperature range (0°C to +85°C)

Lead-Free and Environmental Options

Xilinx offers environmentally compliant versions:

• Lead-free packages available with “G” designation
• RoHS-compliant manufacturing processes
• REACH regulation compliance
• Halogen-free options for specific applications

Getting Started with XC2S200-6FGG923C

Initial Design Steps

1. Download development tools – Install Xilinx ISE Design Suite
2. Review datasheets – Study electrical characteristics and timing specifications
3. Explore reference designs – Examine example projects and IP cores
4. Create initial design – Begin with simple logic to familiarize yourself
5. Simulate and verify – Use built-in simulation tools for validation

Development Resources

Access comprehensive support materials:

• Complete datasheet with electrical specifications
• Application notes for common implementations
• Reference design libraries
• Online training and tutorials
• Technical support forums and communities

Evaluation and Prototyping

Consider using development boards featuring the XC2S200 family:

• Pre-configured evaluation platforms
• Peripheral interfaces for testing
• Programming cables and software included
• Documentation and example projects

Why Choose Xilinx FPGA Solutions?

Xilinx FPGA devices, including the XC2S200-6FGG923C, represent the industry standard for programmable logic solutions. With decades of innovation and continuous improvement, Xilinx FPGAs deliver:

• Proven reliability in mission-critical applications
• Comprehensive ecosystem of tools, IP, and support
• Industry-leading performance across all product families
• Future-proof technology with ongoing development support

Conclusion: XC2S200-6FGG923C for Your Next Project

The XC2S200-6FGG923C Spartan-II FPGA offers an exceptional combination of performance, flexibility, and cost-effectiveness for demanding digital design applications. With 200,000 system gates, 5,292 logic cells, and 923 I/O pins in a high-density package, this device provides the resources and capabilities needed for complex embedded systems, telecommunications equipment, industrial controllers, and advanced consumer electronics.

Whether you’re developing new products, upgrading existing designs, or replacing obsolete ASICs, the XC2S200-6FGG923C delivers the programmability, performance, and reliability your project demands. Its proven Spartan-II architecture, comprehensive development tool support, and extensive IP library enable rapid development cycles and reduced time-to-market.

Key Takeaways

✓ 200,000 system gates with 5,292 logic cells for complex designs
✓ 923-pin BGA package providing maximum I/O flexibility
✓ -6 speed grade ensures high-performance operation up to 200 MHz
✓ Comprehensive development support through Xilinx ISE Design Suite
✓ Cost-effective alternative to ASIC development
✓ Field-upgradable for design flexibility and longevity

Contact your authorized distributor today to obtain pricing, availability, and technical support for the XC2S200-6FGG923C FPGA. Start your next high-performance digital design project with the proven capabilities of Xilinx Spartan-II technology.