The XC2S200-6FGG922C is a powerful field-programmable gate array (FPGA) from Xilinx’s proven Spartan-II family. Engineered with 200,000 system gates and 5,292 logic cells, this FPGA delivers exceptional performance for embedded systems, industrial control applications, and digital signal processing. The FGG922 package variant features a 922-ball fine pitch ball grid array configuration, providing maximum I/O capability and superior signal integrity for demanding applications.
Key Features and Specifications
Core FPGA Architecture
The XC2S200-6FGG922C integrates advanced programmable logic technology with comprehensive memory resources, making it an ideal solution for complex digital designs.
| Feature |
Specification |
| Logic Cells |
5,292 |
| System Gates (Logic and RAM) |
200,000 |
| CLB Array Configuration |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Speed Grade |
-6 (Commercial) |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm |
Package Specifications: FGG922
The FGG922 package is a 922-ball fine pitch ball grid array designed for high-density applications requiring maximum I/O count and optimal thermal performance.
| Package Parameter |
Details |
| Package Type |
Fine Pitch BGA (FPGA) |
| Ball Count |
922 balls |
| Package Designation |
FGG922 |
| Available User I/O |
Up to 284 (excluding global clocks) |
| Lead-Free Option |
Yes (G designation) |
| Mounting Type |
Surface Mount |
| Temperature Range |
Commercial (0°C to 85°C) |
Technical Advantages of XC2S200-6FGG922C
Superior I/O Density
The 922-ball configuration provides the highest I/O count available in the XC2S200 series, enabling designers to implement complex interfaces and high-speed communication protocols without I/O constraints.
Enhanced Signal Integrity
Fine pitch BGA technology offers shorter signal paths and reduced parasitic effects compared to standard packages, resulting in improved signal integrity and higher operating frequencies.
Thermal Management
The large ball array distributes heat more effectively across the PCB, providing excellent thermal dissipation characteristics essential for industrial and high-reliability applications.
Application Areas
Industrial Automation and Control
The XC2S200-6FGG922C excels in programmable logic controllers (PLCs), motor control systems, and factory automation equipment where reliable performance and extensive I/O capabilities are critical.
Digital Signal Processing
With 56K bits of block RAM and substantial distributed memory, this FPGA handles complex DSP algorithms, filtering operations, and real-time data processing tasks efficiently.
Communication Systems
The high I/O count and speed grade -6 performance make this device suitable for telecommunications infrastructure, protocol conversion, and network processing applications.
Embedded System Development
System designers leverage the XC2S200-6FGG922C for prototyping, ASIC replacement, and custom hardware acceleration in embedded computing platforms.
Performance Specifications
Timing and Speed Characteristics
| Parameter |
Value |
| Speed Grade |
-6 |
| Maximum System Performance |
Up to 200 MHz |
| Technology Node |
0.18μm |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Supply Voltage |
2.5V ±5% |
Configuration Options
The XC2S200-6FGG922C supports multiple configuration modes for flexible system integration:
| Configuration Mode |
Data Width |
CCLK Direction |
| Master Serial |
1-bit |
Output |
| Slave Serial |
1-bit |
Input |
| Slave Parallel |
8-bit |
Input |
| Boundary Scan (JTAG) |
1-bit |
N/A |
Memory Architecture
On-Chip Memory Resources
The dual-tier memory architecture provides flexibility for both logic implementation and data storage requirements.
Distributed RAM Capabilities:
- Total Capacity: 75,264 bits
- Implementation: Within CLB structure
- Access Speed: Single-cycle access
- Application: Small FIFOs, register files, lookup tables
Block RAM Features:
- Total Capacity: 56K bits
- Organization: Dual-port configuration
- Data Width: Configurable 1, 2, 4, 8, or 16 bits
- Application: Data buffers, packet storage, coefficient storage
Design Advantages Over Mask-Programmed ASICs
Eliminate NRE Costs
The XC2S200-6FGG922C eliminates non-recurring engineering charges associated with ASIC development, reducing initial project costs by thousands to hundreds of thousands of dollars.
Accelerated Time-to-Market
FPGA-based designs can move from concept to production in weeks rather than months, providing crucial competitive advantages in fast-moving markets.
Field Upgradability
Unlike fixed-function ASICs, the XC2S200-6FGG922C supports in-field upgrades and bug fixes through configuration updates, extending product lifetime and reducing maintenance costs.
Development Flexibility
Engineers can iterate designs rapidly during development, testing multiple architectures and optimizations without fabrication delays or additional tooling costs.
PCB Design Considerations
Fine Pitch BGA Assembly Requirements
Successful implementation of the 922-ball FGG package requires careful PCB design and assembly planning.
Design Guidelines:
- Ball pitch typically 0.8mm to 1.0mm
- Via-in-pad recommended for optimal signal integrity
- Controlled impedance routing for high-speed signals
- Adequate copper planes for power distribution and thermal management
Assembly Recommendations:
- Solder mask defined (SMD) pads
- ENIG or ENEPIG surface finish
- X-ray inspection capability
- Reflow profile optimization for lead-free assembly
Power Distribution Network
Supply Voltage Requirements
| Power Rail |
Voltage |
Tolerance |
Purpose |
| VCCINT |
2.5V |
±5% |
Core logic |
| VCCO |
2.5V to 3.3V |
±5% |
I/O banks |
| GND |
0V |
– |
Ground reference |
Power Estimation
Typical power consumption varies based on design utilization, switching frequency, and I/O activity. Xilinx XPower tools provide accurate power estimation for specific applications.
Development Tools and Support
Design Software
ISE Design Suite Compatibility: The XC2S200-6FGG922C is fully supported by Xilinx ISE (Integrated Software Environment) for synthesis, implementation, and configuration file generation.
Key Tool Features:
- Schematic and HDL entry (VHDL, Verilog)
- Synthesis and optimization
- Place and route
- Timing analysis
- Bitstream generation
Programming Options
Configuration Devices:
- Platform Flash PROMs
- Serial Flash memory
- External processor-based configuration
Programming Interfaces:
- JTAG boundary scan
- SelectMAP parallel interface
- Serial peripheral interface
Quality and Reliability
Manufacturing Standards
Xilinx manufactures the XC2S200-6FGG922C using advanced 0.18μm CMOS technology with rigorous quality control processes ensuring consistent performance and reliability.
Environmental Compliance
Available in both standard and lead-free (RoHS-compliant) versions, identified by the “G” suffix in the ordering code for green packaging options.
Temperature Range Options
| Grade |
Temperature Range |
Application |
| Commercial (C) |
0°C to +85°C |
Standard applications |
| Industrial (I) |
-40°C to +100°C |
Harsh environments |
Note: The -6 speed grade shown in XC2S200-6FGG922C is exclusively available in the Commercial temperature range.
Comparison with Other Spartan-II Devices
XC2S200 Package Options
| Package |
Ball/Pin Count |
Max User I/O |
Application Focus |
| FG256 |
256-ball FBGA |
176 |
Moderate I/O designs |
| FGG456 |
456-ball FBGA |
284 |
High-density applications |
| FGG922 |
922-ball FBGA |
284 |
Maximum I/O, thermal performance |
Why Choose FGG922?
The 922-ball package offers the same user I/O count as the 456-ball variant but with superior thermal characteristics and enhanced signal integrity due to the larger package footprint and optimized ball array distribution.
Purchasing Considerations
Part Number Breakdown
XC2S200-6FGG922C
- XC = Xilinx commercial FPGA
- 2S = Spartan-II family
- 200 = 200,000 system gates
- -6 = Speed grade (fastest commercial grade)
- FGG = Fine pitch BGA, green (lead-free)
- 922 = 922-ball count
- C = Commercial temperature range
Authenticity Verification
When sourcing XC2S200-6FGG922C devices, verify authenticity through authorized distributors to ensure genuine Xilinx components with full warranty and technical support.
Getting Started with XC2S200-6FGG922C
Development Resources
- Datasheet Review: Study the complete Spartan-II family datasheet for detailed electrical and timing specifications
- Reference Designs: Leverage Xilinx reference designs and application notes
- Design Tools: Download ISE Design Suite with device support packages
- Technical Support: Access Xilinx technical forums and support channels
Prototyping Recommendations
For initial development and prototyping, consider evaluation boards compatible with the XC2S200 family or design a custom PCB with proper power distribution, decoupling, and signal integrity considerations for the FGG922 package.
Designers working with the XC2S200-6FGG922C may also consider other Spartan-II family members based on project requirements:
- XC2S50 to XC2S100: Lower gate count for cost-sensitive applications
- XC2S150: Mid-range option balancing resources and cost
- Spartan-3 Family: Next-generation devices with enhanced features and performance
Conclusion
The XC2S200-6FGG922C represents a mature, reliable FPGA solution combining substantial logic resources, comprehensive memory architecture, and maximum I/O capabilities in a high-performance fine pitch BGA package. Its proven track record in industrial, communications, and embedded applications makes it an excellent choice for designers seeking cost-effective programmable logic with superior thermal and electrical characteristics.
Whether replacing legacy ASICs, developing custom hardware accelerators, or implementing complex control systems, the XC2S200-6FGG922C delivers the performance, flexibility, and reliability required for successful product deployment.
