The XC2S200-6FGG906C is a powerful Field-Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family, specifically designed for demanding digital applications requiring substantial logic capacity and high-speed performance. This commercial-grade device features 200,000 system gates, 5,292 logic cells, and comes packaged in a robust 906-ball Fine-pitch Grid Array (FGG906) configuration, making it ideal for complex embedded systems, telecommunications equipment, and industrial automation applications.
As part of the Xilinx FPGA product line, the XC2S200-6FGG906C represents an excellent balance between performance, cost-effectiveness, and flexibility for engineers and designers seeking programmable logic solutions.
Key Specifications of XC2S200-6FGG906C FPGA
Technical Specifications Table
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG906C |
| Manufacturer |
AMD Xilinx |
| Product Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Configurable Logic Blocks (CLBs) |
1,176 (28 x 42 array) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (57,344 bits) |
| Package Type |
FGG906 (Fine-pitch Grid Array) |
| Total Pins |
906 balls |
| Speed Grade |
-6 (fastest commercial grade) |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Core Voltage |
2.5V |
| Technology Node |
0.18μm CMOS process |
| Maximum Frequency |
263 MHz |
XC2S200-6FGG906C Architecture and Features
Advanced FPGA Architecture
The XC2S200-6FGG906C utilizes Xilinx’s proven Spartan-II architecture, featuring:
Configurable Logic Blocks (CLBs)
- 1,176 CLBs arranged in a 28 x 42 matrix
- Each CLB contains four logic slices
- Look-Up Tables (LUTs) for flexible logic implementation
- Dedicated fast carry logic for arithmetic operations
- Built-in multiplexers for efficient data routing
Memory Resources
The XC2S200-6FGG906C provides dual memory options:
- Distributed RAM: 75,264 bits for small, fast memory implementations
- Block RAM: 56 Kbits organized in dual-port RAM blocks
- Flexible memory configuration for buffers, FIFOs, and data storage
Input/Output Capabilities
- 284 maximum user I/O pins
- Multiple I/O standards support (LVTTL, LVCMOS, HSTL, SSTL)
- Programmable drive strength and slew rate control
- Built-in input/output buffer resources
FGG906 Package Benefits
The 906-ball Fine-pitch Grid Array (FGG906) package offers several advantages:
| Feature |
Benefit |
| High Pin Count |
906 balls provide maximum I/O connectivity |
| Compact Footprint |
Space-efficient design for dense board layouts |
| Thermal Performance |
Excellent heat dissipation for demanding applications |
| Signal Integrity |
Shorter interconnect paths reduce signal degradation |
| Manufacturing |
Industry-standard BGA mounting process |
XC2S200-6FGG906C Performance Characteristics
Speed Grade and Timing
The -6 speed grade designation indicates this is the fastest commercial-grade variant in the XC2S200 family:
- Maximum operating frequency: 263 MHz
- Optimized for high-speed applications
- Commercial temperature range: 0°C to +85°C
- Predictable timing characteristics for reliable design implementation
Power Specifications
| Power Parameter |
Typical Value |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V (depending on I/O standard) |
| Technology Process |
0.18μm CMOS |
| Power Consumption |
Application-dependent (configurable) |
Applications for XC2S200-6FGG906C FPGA
Industrial Control Systems
The XC2S200-6FGG906C excels in industrial automation applications:
- Motor control and servo systems
- PLC (Programmable Logic Controller) implementations
- Factory automation interfaces
- Real-time process control
Telecommunications Equipment
Ideal for communications infrastructure:
- Protocol converters and bridges
- Network routers and switches
- Data encryption/decryption engines
- Signal processing modules
Embedded Systems Development
Perfect for complex embedded applications:
- Custom processor implementations
- Hardware acceleration modules
- System-on-Chip (SoC) prototyping
- Interface bridging solutions
Medical Instrumentation
Reliable performance for medical devices:
- Diagnostic equipment controllers
- Medical imaging systems
- Patient monitoring devices
- Laboratory test equipment
XC2S200-6FGG906C vs Alternative FPGA Options
Comparison with Other Spartan-II Devices
| Device |
Logic Cells |
System Gates |
Block RAM |
Max I/O |
Best For |
| XC2S50 |
1,728 |
50,000 |
32K |
176 |
Small projects |
| XC2S100 |
2,700 |
100,000 |
40K |
176 |
Medium complexity |
| XC2S200 |
5,292 |
200,000 |
56K |
284 |
High-performance |
Package Options for XC2S200
The XC2S200 is available in multiple package configurations:
| Package |
Pin Count |
Size |
Application |
| PQ208 |
208 |
Quad Flat Pack |
Standard designs |
| FG256 |
256 |
Fine-pitch BGA |
Compact layouts |
| FG456 |
456 |
Fine-pitch BGA |
High I/O density |
| FGG906 |
906 |
Fine-pitch BGA |
Maximum connectivity |
Design Considerations for XC2S200-6FGG906C
PCB Layout Guidelines
When designing with the XC2S200-6FGG906C:
Power Supply Design
- Implement proper power plane design for 2.5V core voltage
- Separate analog and digital ground planes
- Use adequate decoupling capacitors near power pins
- Consider power sequencing requirements
Thermal Management
- Calculate thermal dissipation based on utilization
- Provide adequate airflow or heatsinking
- Consider ambient operating temperature
- Monitor junction temperature in critical applications
Signal Integrity
- Match impedance for high-speed signals
- Minimize trace lengths for clock distribution
- Use proper termination for I/O signals
- Follow Xilinx PCB design guidelines
Programming and Configuration
The XC2S200-6FGG906C supports multiple configuration methods:
| Configuration Mode |
Description |
Use Case |
| JTAG |
IEEE 1149.1 boundary scan |
Development and debugging |
| Master Serial |
FPGA controls external PROM |
Standalone operation |
| Slave Serial |
External controller programs FPGA |
System integration |
| SelectMAP |
Parallel configuration interface |
Fast configuration time |
Development Tools for XC2S200-6FGG906C
Software Requirements
Design and programming tools for the XC2S200-6FGG906C:
- Xilinx ISE Design Suite: Complete development environment
- Vivado Design Suite: Modern development platform (compatibility check required)
- VHDL/Verilog: Hardware description language support
- Simulation Tools: ModelSim, ISIM for design verification
- Programming Utilities: iMPACT for device configuration
Evaluation and Development Boards
While specific XC2S200-6FGG906C development boards may be limited, similar Spartan-II evaluation platforms include:
- Custom adapter boards for prototyping
- Third-party FPGA development systems
- University educational platforms
- Industrial evaluation modules
Ordering Information for XC2S200-6FGG906C
Part Number Breakdown
Understanding the XC2S200-6FGG906C nomenclature:
XC2S200 - 6 - FGG906 - C
│ │ │ │
│ │ │ └─ Temperature Range (C = Commercial: 0°C to +85°C)
│ │ └──────── Package Type (FGG = Fine-pitch Grid Array, 906 balls)
│ └────────────── Speed Grade (6 = Fastest commercial grade)
└───────────────────── Device Family and Size (Spartan-II, 200K gates)
Availability and Sourcing
The XC2S200-6FGG906C can be sourced through:
- Authorized Xilinx/AMD distributors
- Electronic component suppliers
- Surplus and obsolete part specialists
- OEM excess inventory channels
Note: The Spartan-II family is a mature product line. For new designs, consider evaluating current Spartan-7 or Artix-7 families for enhanced features and longer product lifecycle.
Quality and Reliability Standards
Manufacturing Quality
The XC2S200-6FGG906C meets stringent quality standards:
- RoHS Compliance: Lead-free option available (denoted by ‘G’ in part number)
- Manufacturing Process: Advanced 0.18μm CMOS technology
- Quality Certification: ISO 9001 manufacturing facilities
- Testing: 100% functional testing before shipment
Reliability Specifications
| Parameter | Specification | |—|—|—| | Operating Life | >100,000 hours MTBF | | ESD Protection | Human Body Model (HBM) compliant | | Latch-up Immunity | >100mA per JESD78 | | Configuration Cycles | >10,000 minimum |
Advantages of XC2S200-6FGG906C FPGA
Cost-Effective Solution
- Lower NRE costs compared to ASIC development
- Flexible design modifications without hardware changes
- Reduced time-to-market for product development
- Scalable solution for prototype to production
Design Flexibility
- Reconfigurable logic for multiple applications
- Field-upgradeable firmware capabilities
- Adaptable to changing requirements
- Rapid prototyping and iteration
High Performance
- 263 MHz maximum operating frequency
- Dedicated hardware resources for speed
- Parallel processing capabilities
- Low-latency signal processing
Robust Ecosystem
- Comprehensive development tools
- Extensive documentation and support
- Large user community
- Proven design IP cores available
Technical Support and Resources
Documentation
- Complete datasheets and specifications
- Application notes and design guidelines
- Reference designs and IP cores
- PCB layout recommendations
Community Resources
- Xilinx support forums
- Third-party FPGA communities
- University research groups
- Open-source FPGA projects
Frequently Asked Questions About XC2S200-6FGG906C
What is the difference between XC2S200-6FGG906C and XC2S200-5FGG906C?
The primary difference is the speed grade: -6 is faster than -5, offering better timing performance for high-speed applications. The -6 grade is exclusively available in commercial temperature range.
Can I use the XC2S200-6FGG906C in industrial temperature applications?
No, the -6 speed grade is only available in commercial temperature range (0°C to +85°C). For industrial applications (-40°C to +100°C), select the -5 speed grade variant.
What programming cable do I need for XC2S200-6FGG906C?
You’ll need a Xilinx-compatible JTAG programming cable such as Platform Cable USB II, Digilent JTAG-HS2, or compatible third-party JTAG programmers.
Is the XC2S200-6FGG906C suitable for new designs?
While the Spartan-II family is mature and reliable, Xilinx recommends newer families like Spartan-7 for new designs due to enhanced features, lower power consumption, and longer product lifecycle.
What is the typical power consumption of XC2S200-6FGG906C?
Power consumption varies based on design utilization, clock frequency, and I/O activity. Use Xilinx XPower tools to estimate power consumption for your specific application.
Conclusion: Why Choose XC2S200-6FGG906C for Your FPGA Project
The XC2S200-6FGG906C represents a proven, high-performance FPGA solution from Xilinx’s Spartan-II family. With 200,000 system gates, 5,292 logic cells, and 284 I/O pins in a 906-ball FGG package, this device provides excellent capabilities for complex digital designs requiring substantial logic resources and extensive connectivity.
Whether you’re developing industrial control systems, telecommunications equipment, embedded solutions, or medical instrumentation, the XC2S200-6FGG906C offers the performance, flexibility, and reliability needed for demanding applications. Its commercial-grade -6 speed rating ensures maximum performance, while the extensive I/O count supports complex interfacing requirements.
For engineers seeking a cost-effective, flexible programmable logic solution with proven reliability and comprehensive development tool support, the XC2S200-6FGG906C stands as an excellent choice in the Field-Programmable Gate Array market.
