Contact Sales & After-Sales Service

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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG905C: High-Performance Xilinx Spartan-II FPGA for Advanced Digital Design

Product Details

The XC2S200-6FGG905C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance for demanding digital applications. This advanced programmable logic device combines 200,000 system gates with 5,292 logic cells, making it an ideal solution for telecommunications, industrial automation, embedded systems, and complex digital signal processing applications.

As part of the Spartan-II architecture, the XC2S200-6FGG905C offers designers a cost-effective alternative to traditional ASICs while providing the flexibility of in-field reconfiguration. With its -6 speed grade designation, this FPGA ensures optimal performance in high-speed digital applications, supporting system operation up to 200 MHz.

Key Specifications and Technical Features

Core Architecture Specifications

Parameter Specification
Device Family Spartan-II FPGA
System Gates 200,000
Logic Cells 5,292
Configurable Logic Blocks (CLBs) 1,176 (28 x 42 array)
Maximum User I/O Pins 284
Distributed RAM 75,264 bits
Block RAM 56K bits (56 Kbits)
Speed Grade -6 (Commercial Grade)
Core Voltage 2.5V
Technology Node 0.18μm
Maximum Frequency Up to 200 MHz

Memory and Storage Capabilities

The XC2S200-6FGG905C features dual memory architecture for optimal performance:

  • Distributed RAM: 75,264 bits of distributed memory embedded within the CLB structure, ideal for small, fast storage requirements
  • Block RAM: 56 Kbits of dedicated block RAM organized in efficient columns, perfect for larger data buffers, FIFOs, and lookup tables
  • Memory Flexibility: Both memory types can be configured independently to match specific application requirements

Advanced I/O Capabilities

I/O Feature Details
User I/O Pins Up to 284 pins (package dependent)
I/O Standards Supported LVTTL, LVCMOS, PCI 33/66, SSTL, HSTL, GTL+
Differential I/O Support Yes, with LVDS capability
Voltage Banks Multiple independent VCCO banks
Input Reference Voltage (VREF) Eight internal VREF banks for differential standards

Why Choose XC2S200-6FGG905C for Your Design?

Superior Performance Advantages

The XC2S200-6FGG905C delivers outstanding benefits for digital designers and system architects:

  1. High Logic Density: With 5,292 logic cells and 1,176 CLBs arranged in a 28×42 array, this FPGA provides ample resources for implementing complex digital designs, including DSP algorithms, communication protocols, and control systems.
  2. Flexible Memory Architecture: The combination of 75,264 bits of distributed RAM and 56K bits of block RAM enables efficient data management for buffering, signal processing, and temporary storage applications.
  3. Fast Performance: The -6 speed grade ensures maximum performance across all operating conditions, making it suitable for high-speed data processing, real-time control, and time-critical applications.
  4. Cost-Effective Solution: As a mid-range FPGA, the XC2S200 offers an excellent balance between capability and cost, making it ideal for both prototyping and volume production.

Programmable Logic Excellence

Unlike traditional ASICs, the XC2S200-6FGG905C FPGA offers:

  • In-Field Reconfigurability: Update designs without hardware replacement
  • Reduced Development Time: Eliminate lengthy ASIC fabrication cycles
  • Lower Initial Investment: No NRE costs or minimum order quantities
  • Design Iteration Freedom: Test and refine designs rapidly during development

Design Features and Functional Blocks

Configurable Logic Block (CLB) Architecture

Each CLB in the XC2S200-6FGG905C contains:

  • Four logic cells with look-up tables (LUTs)
  • Fast carry logic for arithmetic operations
  • Distributed RAM capability
  • Flip-flops for sequential logic
  • Multiplexers for routing flexibility

Clock Management and Distribution

Clock Feature Specification
Delay-Locked Loops (DLLs) 4 DLLs (one at each corner)
Clock De-skew Automatic clock distribution network
Clock Multiplication/Division Supported through DLL configuration
Global Clock Lines Multiple dedicated global clock networks

The four integrated DLLs provide advanced clock management capabilities, including clock de-skewing, multiplication, and phase shifting for precise timing control in high-speed designs.

Application Areas and Use Cases

Telecommunications and Networking

The XC2S200-6FGG905C excels in communication systems applications:

  • Protocol implementation (Ethernet, USB, CAN, SPI, I2C)
  • Network routers and switches
  • Baseband processing
  • Data encryption and security
  • Signal modulation/demodulation

Industrial Control and Automation

For industrial applications, this Xilinx FPGA provides:

  • Motor control systems with PWM generation
  • PLC (Programmable Logic Controller) functionality
  • Process monitoring and control
  • Sensor interface and data acquisition
  • Machine vision preprocessing

Embedded Systems Development

The XC2S200-6FGG905C serves as an excellent coprocessor for:

  • Real-time data processing
  • Custom peripheral implementation
  • Hardware acceleration
  • System-on-chip (SoC) prototyping
  • Interface bridging between different protocols

Medical and Scientific Instrumentation

In medical technology applications:

  • Diagnostic equipment signal processing
  • Patient monitoring systems
  • Medical imaging preprocessing
  • Laboratory instrumentation control
  • Biometric data analysis

Development Tools and Design Resources

Xilinx ISE Design Suite Compatibility

The XC2S200-6FGG905C is fully supported by Xilinx ISE Design Suite, providing:

  • Comprehensive design entry (schematic and HDL)
  • Advanced synthesis and optimization
  • Place and route with timing analysis
  • BitStream generation
  • Comprehensive simulation environment

Supported Hardware Description Languages

HDL/Design Method Support Level
VHDL Full support
Verilog HDL Full support
Schematic Entry Supported via ISE
System Generator Compatible
IP Core Integration Xilinx and third-party IP

Design Verification and Testing

Development support includes:

  • Built-in boundary scan (JTAG) for testing
  • ChipScope Pro for in-circuit debugging
  • Comprehensive timing analysis tools
  • Power analysis utilities
  • Configuration memory testing

Package Information and Physical Specifications

Fine-Pitch Ball Grid Array (FBGA) Package

While the specific FGG905 package designation is referenced in the part number, standard XC2S200 packages include:

Package Type Pin Count Body Size Pitch
FG456/FGG456 456-ball 27mm x 27mm 1.0mm
FG256/FGG256 256-ball 17mm x 17mm 1.0mm
PQ208/PQG208 208-pin Plastic Quad Standard

Note: The “FGG” prefix indicates Pb-free (RoHS compliant) packaging with the green package identifier.

Operating Conditions

Parameter Commercial Grade (-6C)
Operating Temperature 0°C to +85°C
Core Voltage (VCCINT) 2.5V ±5%
I/O Voltage (VCCO) 1.5V to 3.3V (standard dependent)
Recommended Junction Temp TJ < 85°C

Configuration and Programming Options

Multiple Configuration Methods

The XC2S200-6FGG905C supports flexible configuration approaches:

  1. Master Serial Mode: FPGA controls configuration from external PROM
  2. Slave Serial Mode: External controller drives configuration
  3. JTAG Configuration: Direct programming via boundary scan
  4. SelectMAP Mode: Parallel configuration for faster boot times

Configuration Memory Devices

Compatible configuration PROMs include:

  • Xilinx Platform Flash PROMs
  • Serial Flash memory devices
  • Standard SPI flash memories
  • Battery-backed SRAM (for volatile configuration retention)

Power Management and Thermal Considerations

Power Consumption Profile

Power Parameter Typical Value Maximum Value
Core Static Power Low (design dependent) Specified in datasheet
Dynamic Power Varies with utilization Design and switching dependent
I/O Power Standard dependent VCCO × I/O switching

Thermal Design Recommendations

For reliable operation:

  • Ensure adequate airflow across the device
  • Consider heatsink attachment for high-utilization designs
  • Monitor junction temperature during operation
  • Follow PCB thermal design guidelines
  • Use thermal vias for heat dissipation

Quality, Reliability, and Compliance

Manufacturing Standards

The XC2S200-6FGG905C meets stringent quality requirements:

  • Manufactured in ISO-certified facilities
  • Comprehensive testing at production
  • Quality assurance per automotive standards (where applicable)
  • Long-term reliability guaranteed

Environmental Compliance

Standard Compliance Status
RoHS (Restriction of Hazardous Substances) Compliant (FGG packages)
REACH Compliant
Conflict Minerals Compliant per industry standards
Halogen-Free Available in select packages

Comparison with Alternative FPGAs

XC2S200 vs. Other Spartan-II Devices

Device Logic Cells System Gates Block RAM User I/O
XC2S150 3,888 150,000 48K 260
XC2S200 5,292 200,000 56K 284
XC2S300 Not in family

The XC2S200 represents the largest device in the Spartan-II family, offering maximum logic density and I/O capability.

Getting Started with XC2S200-6FGG905C

Initial Design Steps

  1. Install Development Tools: Download and install Xilinx ISE Design Suite
  2. Review Documentation: Study device datasheet and user guides
  3. Select Package: Verify pin assignments for your specific package
  4. Create Project: Set up new ISE project with XC2S200-6 device selection
  5. Design Entry: Implement your design in VHDL, Verilog, or schematic

Essential Design Resources

  • XC2S200 Device Datasheet (DS001)
  • Spartan-II User Guide
  • ISE Design Suite tutorials
  • Xilinx Answer Records database
  • Application notes for specific implementations

Procurement and Availability

Sourcing Considerations

When purchasing XC2S200-6FGG905C devices:

  • Verify authentic Xilinx/AMD parts from authorized distributors
  • Check date codes for recent manufacturing
  • Confirm temperature grade requirements (-C, -I)
  • Validate package marking and part number
  • Request certificates of conformance for critical applications

Volume Pricing and Lead Times

  • Pricing varies based on order quantity
  • Volume discounts available for production quantities
  • Lead times depend on distributor inventory
  • Consider long-term availability for production designs
  • Contact authorized distributors for current pricing

Frequently Asked Questions (FAQ)

What is the main advantage of the XC2S200-6FGG905C FPGA?

The XC2S200-6FGG905C offers the highest logic density in the Spartan-II family with 200,000 system gates and 5,292 logic cells, making it ideal for complex digital designs that require substantial processing capability at a competitive price point.

Can I upgrade from a smaller Spartan-II device to the XC2S200?

Yes, the Spartan-II family maintains pin compatibility across many packages, allowing for potential design migration. However, always verify specific pin assignments and I/O bank configurations when migrating between devices.

What software do I need to program the XC2S200-6FGG905C?

You’ll need Xilinx ISE Design Suite for design entry, synthesis, implementation, and BitStream generation. For actual device programming, you’ll also need compatible programming hardware such as Platform Cable USB or similar JTAG programming tools.

Is the XC2S200 suitable for automotive applications?

While the standard commercial grade (-6C suffix) operates from 0°C to +85°C, Xilinx offers industrial temperature grade versions for extended temperature ranges. Consult with Xilinx regarding automotive-qualified versions and compliance with automotive standards like AEC-Q100.

How does the -6 speed grade compare to -5 speed grade devices?

The -6 speed grade offers faster performance compared to -5 grade devices, with shorter propagation delays and higher maximum operating frequencies. However, -6 speed grade devices are typically available only in commercial temperature ranges.

Technical Support and Additional Resources

Xilinx/AMD Support Channels

  • Official AMD Xilinx technical support portal
  • Community forums for peer assistance
  • Application engineering support for complex designs
  • Training courses and webinars
  • Regional field application engineers (FAEs)

Documentation Library

Essential documents for XC2S200-6FGG905C development:

  1. DS001 – Spartan-II Family Datasheet
  2. UG002 – Spartan-II User Guide
  3. Package drawings and pinout diagrams
  4. ISE Design Suite documentation
  5. Application notes for specific interfaces

Conclusion: Why XC2S200-6FGG905C Stands Out

The XC2S200-6FGG905C represents the pinnacle of the Spartan-II FPGA family, offering designers a powerful combination of logic capacity, memory resources, and I/O flexibility. With 200,000 system gates, 5,292 logic cells, and comprehensive development tool support, this FPGA delivers exceptional value for telecommunications, industrial control, embedded systems, and scientific instrumentation applications.

Whether you’re prototyping a new design or implementing a production system, the XC2S200-6FGG905C provides the performance, reliability, and cost-effectiveness needed for successful FPGA implementation. Its proven architecture, combined with extensive design resources and robust development tools, makes it an excellent choice for engineers seeking a dependable programmable logic solution.

For more information about Xilinx FPGAs and to explore additional devices in the Spartan family, visit specialized Xilinx FPGA resources and authorized distributors.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.