The XC2S200-6FGG903C is a powerful field-programmable gate array from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance for demanding digital design applications. This FPGA combines 200,000 system gates with 5,292 logic cells in a Fine-Pitch Ball Grid Array package, making it an ideal choice for industrial automation, telecommunications, and embedded systems development.
Key Features and Specifications
The XC2S200-6FGG903C stands out in the Xilinx FPGA product line with its robust architecture and versatile capabilities. Built on advanced 0.18-micron technology, this device operates at 2.5V, ensuring optimal power efficiency while maintaining high-speed performance up to 263 MHz.
Technical Specifications Table
| Specification |
Value |
| Part Number |
XC2S200-6FGG903C |
| Manufacturer |
AMD Xilinx |
| FPGA Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Maximum Frequency |
263 MHz |
| Technology Node |
0.18 µm |
| Core Voltage |
2.5V |
| Speed Grade |
-6 |
| Package Type |
FGG903 (Fine-pitch BGA) |
| Pin Count |
903 |
| Temperature Range |
Commercial (0°C to +85°C) |
| Configuration Memory |
1,335,840 bits |
Architecture and Design Features
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG903C features 1,176 Configurable Logic Blocks arranged in a 28 x 42 array, providing extensive resources for implementing complex digital circuits. Each CLB contains four logic slices with Look-Up Tables (LUTs), flip-flops, and multiplexers, enabling flexible design implementation.
Memory Resources and Capabilities
| Memory Feature |
Specification |
| Block RAM |
56 Kbits (57,344 bits) |
| Distributed RAM |
75,264 bits |
| Block RAM Blocks |
28 blocks of 2 Kbit each |
| RAM Configuration |
Dual-port structure |
Input/Output Architecture
The XC2S200-6FGG903C provides extensive I/O capabilities with 284 user I/O pins, plus four dedicated global clock inputs. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, and various differential standards, making it compatible with diverse interface requirements.
Performance Characteristics
Speed Grade and Timing Performance
The -6 speed grade designation indicates this FPGA is optimized for applications requiring maximum performance. Key timing parameters include:
- Pin-to-pin delay: Approximately 5 nanoseconds
- System clock frequency: Up to 263 MHz
- High-speed data processing capability
- Low propagation delays for time-critical applications
Power Consumption Profile
| Power Parameter |
Typical Value |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
| Auxiliary Voltage (VCCAUX) |
2.5V |
| Static Power |
Low (device-dependent) |
| Dynamic Power |
Application-dependent |
Application Areas and Use Cases
Industrial Automation and Control
The XC2S200-6FGG903C excels in industrial applications requiring:
- Real-time process control systems
- Motor control and drive systems
- Programmable logic controllers (PLCs)
- Factory automation equipment
- Sensor interface and data acquisition
Communications and Networking
This FPGA is well-suited for telecommunications infrastructure:
- Network protocol implementation
- Data packet processing
- Communication interface bridges
- Signal processing applications
- Router and switch controllers
Medical and Instrumentation
Medical device manufacturers leverage the XC2S200-6FGG903C for:
- Diagnostic imaging equipment
- Patient monitoring systems
- Laboratory instrumentation
- Portable medical devices
- Biomedical signal processing
Consumer Electronics Applications
| Application Category |
Use Cases |
| Audio/Video |
Digital signal processing, codec implementation |
| Display Systems |
LCD/LED controllers, video processing |
| Gaming |
Graphics acceleration, game logic controllers |
| IoT Devices |
Smart sensors, edge computing nodes |
Design and Development Support
Software Tools and Programming
The XC2S200-6FGG903C is fully supported by Xilinx ISE Design Suite, providing comprehensive tools for:
- HDL synthesis (Verilog, VHDL)
- Place and route optimization
- Timing analysis and verification
- In-system programming
- Simulation and debugging
Configuration Options
| Configuration Mode |
Clock Direction |
Data Width |
Features |
| Master Serial |
Output |
1-bit |
Independent operation |
| Slave Serial |
Input |
1-bit |
External clock control |
| Slave Parallel |
Input |
8-bit |
Fastest configuration |
| JTAG Boundary Scan |
N/A |
1-bit |
Debug and programming |
Package Information and Pin Configuration
FGG903 Package Details
The Fine-pitch Ball Grid Array (FGG903) package offers:
- High pin density for maximum I/O availability
- Enhanced thermal dissipation characteristics
- Compact footprint for space-constrained designs
- Reliable ball grid interconnections
- Industry-standard BGA mounting compatibility
I/O Pin Distribution
The 903-pin configuration provides extensive connectivity options with dedicated pins for:
- User-configurable I/O (284 pins)
- Power and ground distribution
- Global clock inputs (4 dedicated pins)
- Configuration interface pins
- JTAG boundary scan pins
Advantages Over Alternative Solutions
FPGA vs ASIC Comparison
| Feature |
XC2S200-6FGG903C FPGA |
Traditional ASIC |
| Development Time |
Weeks to months |
6-18 months |
| Initial Cost |
Low NRE |
High NRE ($100K+) |
| Flexibility |
Reprogrammable |
Fixed design |
| Time to Market |
Fast |
Slow |
| Design Changes |
Easy updates |
Requires new mask |
| Volume Economics |
Cost-effective for low-medium |
Better for high volume |
Competitive Advantages
The XC2S200-6FGG903C offers several key benefits:
- Reconfigurability: Update designs in the field without hardware replacement
- Rapid prototyping: Accelerate product development cycles
- Risk mitigation: Avoid ASIC fabrication risks and costs
- Design security: Bitstream encryption available
- Proven reliability: Extensive qualification and testing
Reliability and Quality Standards
Operating Conditions
| Parameter |
Minimum |
Typical |
Maximum |
Unit |
| Core Voltage |
2.375 |
2.5 |
2.625 |
V |
| Ambient Temperature |
0 |
25 |
+85 |
°C |
| Junction Temperature |
– |
– |
+125 |
°C |
Quality and Compliance
The XC2S200-6FGG903C meets stringent industry standards:
- RoHS compliant options available
- Meets JEDEC standards for reliability
- Full electrical and functional testing
- Comprehensive quality assurance programs
Pricing and Availability Considerations
Factors Affecting XC2S200-6FGG903C Pricing
- Order quantity (volume discounts available)
- Market demand and supply dynamics
- Distribution channel selection
- Lead time requirements
- Package and speed grade options
Procurement Recommendations
When sourcing the XC2S200-6FGG903C:
- Verify part authenticity through authorized distributors
- Check for counterfeit prevention measures
- Request proper documentation and traceability
- Consider lead times for production planning
- Evaluate total cost of ownership including tools and support
Design Considerations and Best Practices
PCB Layout Guidelines
Optimal board design for the XC2S200-6FGG903C requires:
- Proper power plane design with adequate decoupling
- Controlled impedance traces for high-speed signals
- Careful clock distribution and routing
- Thermal management considerations
- Ground plane integrity
Power Supply Design
| Supply Rail |
Voltage |
Current (Typical) |
Decoupling |
| VCCINT |
2.5V |
Device dependent |
Multiple 0.1µF + 10µF |
| VCCO |
1.5-3.3V |
I/O dependent |
Per bank decoupling |
| VCCAUX |
2.5V |
< 100mA |
0.1µF + 10µF |
Migration and Upgrade Paths
Compatible Alternatives and Upgrades
Engineers can consider these alternatives within the Xilinx ecosystem:
- XC2S150-6FGG903C: Lower gate count for cost optimization
- XC3S200: Spartan-3 upgrade with enhanced features
- XC6SLX series: Modern Spartan-6 with improved performance
- Artix-7 series: Latest generation with advanced capabilities
Legacy Design Support
Xilinx provides robust support for Spartan-II designs including:
- Continued availability of development tools
- Extensive documentation and app notes
- Technical support and community forums
- Migration guides to newer devices
Environmental and Sustainability
The XC2S200-6FGG903C aligns with environmental standards:
- Lead-free package options (indicated by “G” suffix)
- RoHS and REACH compliance
- Conflict mineral reporting
- Energy-efficient 2.5V operation
- Long product lifecycle reducing e-waste
Technical Support and Resources
Documentation and References
Essential resources for XC2S200-6FGG903C implementation:
- Spartan-II Family Data Sheet (DS001)
- User Guides and Application Notes
- ISE Design Suite documentation
- Package mechanical drawings
- Reference designs and examples
Community and Support Channels
Access comprehensive support through:
- Xilinx technical support portal
- Community forums and user groups
- Third-party design service partners
- Online training and webinars
- FAQs and knowledge base articles
Conclusion
The XC2S200-6FGG903C represents a mature, reliable FPGA solution for applications requiring 200,000 system gates of programmable logic. Its combination of proven Spartan-II architecture, comprehensive I/O capabilities, and cost-effective implementation makes it an excellent choice for industrial, communications, and embedded applications.
With extensive development tool support, flexible configuration options, and the inherent advantages of FPGA technology over ASICs, the XC2S200-6FGG903C enables engineers to deliver innovative products with reduced time-to-market and lower development risk.
Whether you’re developing industrial control systems, telecommunications equipment, medical devices, or consumer electronics, the XC2S200-6FGG903C provides the performance, flexibility, and reliability needed for successful product development.
