Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG898C: High-Performance Spartan-II FPGA for Advanced Digital Design

Product Details

The XC2S200-6FGG898C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, delivering exceptional performance for complex digital applications. This advanced programmable logic device features 200,000 system gates and 5,292 logic cells, making it an ideal solution for engineers and designers seeking cost-effective, high-density programmable logic solutions.

As part of the Xilinx FPGA product line, the XC2S200-6FGG898C offers superior reconfigurability compared to traditional ASICs, enabling rapid prototyping, field upgrades, and design iterations without hardware replacement costs.

Key Technical Specifications

Core FPGA Architecture Features

Specification Value
Logic Cells 5,292
System Gates 200,000
CLB Array Configuration 28 x 42 (1,176 total CLBs)
Maximum User I/O 284 pins
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Technology Node 0.18μm
Core Voltage 2.5V
Speed Grade -6 (Commercial)

Performance Characteristics

Parameter Specification
Maximum Frequency 200-263 MHz (application dependent)
Pin-to-Pin Delay As low as 5ns
Configuration Time Fast reconfiguration capability
Operating Temperature Commercial range (0°C to 85°C)
Power Consumption Optimized for low-power applications

Advanced FPGA Capabilities

Memory Architecture

The XC2S200-6FGG898C incorporates a robust dual-memory architecture:

  • Block RAM: 56 Kbits of dedicated block memory for data buffering and storage
  • Distributed RAM: 75,264 bits integrated within CLBs for fast, localized storage
  • Flexible memory configuration supporting various data width requirements
  • High-speed memory access for real-time processing applications

Input/Output Features

I/O Feature Specification
Total User I/O Up to 284 pins
I/O Standards Support Multiple voltage standards
MultiVolt I/O Interface with 1.5V to 3.3V systems
Global Clock Inputs 4 dedicated clock pins
I/O Configuration Programmable pull-ups/pull-downs

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG898C features 1,176 CLBs arranged in a 28×42 array, providing:

  • Look-Up Tables (LUTs) for implementing combinational logic
  • Flip-flops for sequential logic operations
  • Dedicated carry logic for high-speed arithmetic
  • Distributed RAM capabilities within each CLB
  • Flexible routing resources between logic elements

Package Information

FGG898 Package Details

Note: The FGG898 package designation is non-standard for the XC2S200 series. Standard packages include FG456/FGG456, FG256/FGG256, and PQ208/PQG208. Please verify the exact package code with your supplier.

Package Feature Details
Package Type Fine-Pitch Ball Grid Array (FBGA)
Lead-Free Option “G” designation indicates Pb-free
Ball Count 898 (non-standard – verify with manufacturer)
Thermal Performance Enhanced heat dissipation
Mounting Surface mount technology

Target Applications

Communications & Networking

The XC2S200-6FGG898C excels in communication infrastructure:

  • Network routers and switches
  • Wireless base stations and access points
  • Protocol converters and bridges
  • High-speed data transmission systems
  • Telecommunications equipment

Industrial Automation

Ideal for demanding industrial environments:

  • Programmable logic controllers (PLCs)
  • Motor control systems
  • Process automation and monitoring
  • Sensor interface and data acquisition
  • Real-time control applications

Medical Equipment

Supporting critical healthcare technology:

  • Medical imaging systems
  • Patient monitoring devices
  • Diagnostic equipment
  • Laboratory instrumentation
  • Portable medical devices

Consumer Electronics

Enabling advanced consumer products:

  • Digital signal processing
  • Video/audio processing
  • Smart home devices
  • Gaming consoles
  • Embedded vision systems

Competitive Advantages

FPGA vs ASIC Benefits

Advantage Description
Lower Initial Costs No mask or NRE charges
Faster Time-to-Market Immediate implementation without fabrication delays
Design Flexibility In-field reconfiguration and updates
Risk Mitigation Modify designs post-deployment
Prototyping Rapid iteration and testing

Spartan-II Family Benefits

  • Proven architecture with extensive design resources
  • Cost-optimized for high-volume production
  • Wide ecosystem of development tools
  • Comprehensive IP core library
  • Mature technology with reliable performance

Development Tools & Support

Design Software Compatibility

The XC2S200-6FGG898C is supported by industry-standard tools:

  • ISE Design Suite: Legacy support for Spartan-II development
  • JTAG Programming: Standard boundary-scan configuration
  • ModelSim: HDL simulation and verification
  • Vivado: Advanced design and analysis features

Configuration Options

Mode Description Data Width
Master Serial FPGA controls configuration 1-bit
Slave Serial External controller 1-bit
Slave Parallel Fast parallel loading 8-bit
Boundary Scan JTAG-based programming 1-bit

Design Considerations

Power Management

Optimize power consumption with:

  • Strategic clock gating techniques
  • Unused I/O configuration
  • Core voltage regulation
  • Dynamic power analysis tools

Thermal Management

Ensure reliable operation through:

  • Adequate heat sink design
  • PCB thermal vias
  • Airflow considerations
  • Junction temperature monitoring

Signal Integrity

Maintain signal quality with:

  • Controlled impedance routing
  • Proper termination schemes
  • Ground plane optimization
  • Power supply decoupling

Ordering Information

Part Number Breakdown

XC2S200-6FGG898C

  • XC2S200: Device family and gate count (200K gates)
  • 6: Speed grade (-6 is fastest commercial grade)
  • FGG: Fine-pitch BGA with Pb-free packaging
  • 898: Ball count (non-standard – verify with distributor)
  • C: Commercial temperature range (0°C to 85°C)

Quality & Compliance

  • RoHS compliant (lead-free packaging)
  • Commercial temperature grade
  • Industry-standard quality testing
  • Long-term availability support

Technical Resources

Documentation Available

  • Complete datasheet with electrical specifications
  • User guide for Spartan-II architecture
  • Application notes for specific implementations
  • PCB layout guidelines
  • Reference designs and examples

Support Resources

Engineers can access:

  • Online design forums and communities
  • Technical support from distributors
  • Training materials and tutorials
  • IP core libraries
  • Design examples and templates

Comparison with Related Products

XC2S200 Package Variants

Part Number Package Pin Count I/O Count
XC2S200-6FG456C FBGA 456 284
XC2S200-6FG256C FBGA 256 176
XC2S200-6PQ208C PQFP 208 140

Family Comparison

Device Logic Cells System Gates Block RAM
XC2S100 2,700 100,000 40K
XC2S200 5,292 200,000 56K
XC2S150 3,888 150,000 48K

Frequently Asked Questions

What makes the XC2S200-6FGG898C suitable for my application?

This FPGA offers an excellent balance of logic density, memory resources, and I/O capabilities, making it versatile for applications requiring 200,000 system gates and moderate complexity.

Is the FGG898 package standard for XC2S200?

The FGG898 designation is uncommon for the XC2S200 series. Standard packages include FG456, FG256, and PQ208. Verify the exact package code with your authorized distributor or consult the official datasheet.

What temperature ranges are available?

The “C” suffix indicates commercial temperature range (0°C to 85°C). Industrial temperature grades may be available with different suffix designations.

Can I upgrade designs in the field?

Yes, FPGA technology allows complete reconfiguration without hardware changes, enabling firmware updates and feature enhancements post-deployment.

What development tools do I need?

Xilinx ISE Design Suite provides comprehensive support for Spartan-II FPGAs, including synthesis, implementation, and programming tools.

Conclusion

The XC2S200-6FGG898C represents a proven, cost-effective FPGA solution for designers requiring 200,000 system gates of programmable logic. With its robust architecture, flexible I/O capabilities, and comprehensive development tool support, this Spartan-II device continues to serve applications across telecommunications, industrial automation, medical equipment, and consumer electronics.

Whether you’re prototyping new designs, upgrading existing systems, or developing production hardware, the XC2S200-6FGG898C delivers the performance, flexibility, and reliability demanded by modern digital systems.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.