The XC2S200-6FGG896C represents a powerful field-programmable gate array (FPGA) solution from Xilinx’s renowned Spartan-II family, delivering exceptional programmable logic capabilities for industrial, telecommunications, and embedded system applications. This comprehensive guide explores the technical specifications, features, applications, and advantages of the XC2S200-6FGG896C FPGA.
What is the XC2S200-6FGG896C FPGA?
The XC2S200-6FGG896C is a high-density programmable logic device manufactured by Xilinx (now part of AMD), featuring 200,000 system gates and 5,292 logic cells. As part of the Spartan-II family, this FPGA offers a cost-effective alternative to traditional ASICs while providing superior flexibility and faster time-to-market for digital design projects.
Key Specifications at a Glance
| Specification |
Value |
| Part Number |
XC2S200-6FGG896C |
| Family |
Spartan-II |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| Speed Grade |
-6 (263 MHz) |
| Package Type |
FGG896 (Fine-Pitch Ball Grid Array) |
| Total Pins |
896 |
| Operating Voltage |
2.5V Core |
| Temperature Range |
Commercial (0°C to +85°C) |
| Technology Node |
0.18μm CMOS |
Core Architecture and Features of XC2S200-6FGG896C
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG896C features a robust CLB array measuring 28 × 42, providing 1,176 total configurable logic blocks. Each CLB contains four logic slices, offering:
- Dual 4-input lookup tables (LUTs) per slice
- Two flip-flops per slice
- Fast arithmetic carry logic
- Multiplexer-based logic functions
- Distributed RAM capabilities
Memory Resources and Block RAM
| Memory Type |
Capacity |
Configuration |
| Block RAM |
56 Kbits |
Dual-port synchronous RAM |
| Distributed RAM |
75,264 bits |
Flexible depth/width configuration |
| Total RAM Resources |
131 Kbits |
Configurable as FIFO, RAM, or ROM |
The XC2S200-6FGG896C provides 14 block RAM modules, each offering 4 Kbits of fast, synchronous dual-port memory. This architecture enables efficient data buffering, look-up table storage, and FIFO implementation without consuming logic resources.
Input/Output Capabilities
The FGG896 package variant offers extensive I/O capabilities optimized for high-pin-count applications:
- Maximum User I/O: 284 pins (device dependent)
- I/O Standards Supported: LVTTL, LVCMOS, PCI, GTL, SSTL, HSTL
- Programmable Drive Strength: 2mA to 24mA
- Input Voltage Reference: Eight independent VREF banks
- Differential I/O: Supported for high-speed signaling
Performance Specifications
Speed Grade -6 Performance Characteristics
| Performance Metric |
Specification |
| Maximum System Frequency |
263 MHz |
| Internal Clock Speed |
Up to 200 MHz |
| Toggle Frequency |
200 MHz |
| Clock-to-Output Delay |
4.5 ns (typical) |
| Setup Time |
2.0 ns (typical) |
| Propagation Delay |
Low-latency signal routing |
The -6 speed grade designation indicates this FPGA offers the highest performance tier within the Spartan-II XC2S200 family, making it ideal for timing-critical applications requiring maximum operating frequencies.
Advanced Features and Capabilities
Delay-Locked Loop (DLL) Technology
The XC2S200-6FGG896C incorporates four precision Delay-Locked Loops positioned at each corner of the die, providing:
- Clock deskew and phase shifting
- Frequency multiplication and division
- Precise clock distribution management
- Reduced clock-to-output timing
- Enhanced system synchronization
Routing Architecture
The hierarchical routing architecture features:
- General Routing Matrix (GRM): Connects all CLBs and I/O blocks
- Long Lines: Span the entire device for high-speed signal distribution
- Double Lines: Traverse half the device with low capacitance
- Direct Connections: Provide fast inter-CLB communication
- Tri-State Buffers: Enable efficient bus implementation
XC2S200-6FGG896C Package Information
FGG896 Package Specifications
| Package Parameter |
Detail |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Pin Count |
896 pins |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
Industry-standard footprint |
| Mounting Type |
Surface Mount Technology (SMT) |
| Thermal Performance |
Enhanced heat dissipation |
| RoHS Compliance |
Lead-free option available (“G” designation) |
The FGG896 package provides excellent thermal characteristics and reliable electrical performance, making it suitable for high-density board designs requiring maximum I/O connectivity.
Target Applications for XC2S200-6FGG896C
Industrial Control Systems
- Programmable logic controllers (PLCs)
- Motor control and drive systems
- Industrial automation equipment
- Sensor interface and data acquisition
- Real-time monitoring and control
Telecommunications Infrastructure
- Digital signal processing (DSP) applications
- Protocol conversion and bridging
- Network packet processing
- Telecommunication switching systems
- Wireless base station equipment
Embedded Systems and Computing
- Custom embedded processors
- System-on-chip (SoC) prototyping
- Hardware acceleration modules
- Cryptographic processing engines
- Video and image processing systems
Consumer Electronics
- High-definition video processing
- Audio processing and enhancement
- Gaming console development
- Set-top box applications
- Display controller interfaces
Programming and Development Tools
ISE Design Suite Compatibility
The XC2S200-6FGG896C is fully supported by Xilinx ISE (Integrated Software Environment) Design Suite, offering:
- Schematic and VHDL/Verilog design entry
- Advanced synthesis and implementation
- Timing analysis and constraint management
- Power estimation and optimization
- Comprehensive simulation capabilities
Configuration Methods
| Configuration Mode |
Description |
| Master Serial |
Self-configuring from external PROM |
| Slave Serial |
Configuration via external controller |
| JTAG Boundary-Scan |
IEEE 1149.1 compliant programming |
| SelectMAP |
Parallel configuration interface |
Competitive Advantages Over ASIC Solutions
Cost-Effectiveness
The XC2S200-6FGG896C eliminates significant ASIC development costs:
- No NRE (Non-Recurring Engineering) Costs: Avoid expensive mask sets
- No Minimum Order Quantities: Purchase only required quantities
- Reduced Development Time: Weeks instead of months
- Lower Total Cost of Ownership: Especially for low to medium volumes
Design Flexibility
- In-field Upgradability: Update logic without hardware replacement
- Rapid Prototyping: Test and iterate designs quickly
- Version Control: Implement multiple design variants easily
- Future-Proof Solutions: Adapt to changing specifications
Power Management and Thermal Considerations
Power Consumption Profile
| Power Parameter |
Typical Value |
| Core Voltage (VCCINT) |
2.5V ± 5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V (configurable) |
| Quiescent Power |
Low standby current |
| Dynamic Power |
Design and frequency dependent |
| Total Power Dissipation |
Application specific |
Thermal Management
The FGG896 package provides effective thermal dissipation through:
- Exposed thermal pad for heat sink attachment
- Low junction-to-ambient thermal resistance
- Compatibility with standard cooling solutions
- Thermal simulation models available
Quality and Reliability Standards
Manufacturing Quality
The XC2S200-6FGG896C undergoes rigorous quality control:
- Process Technology: Advanced 0.18μm CMOS fabrication
- Defect Screening: 100% electrical testing
- Burn-in Testing: Available for critical applications
- Quality Certifications: ISO 9001 compliant manufacturing
Reliability Metrics
- MTBF (Mean Time Between Failures): Exceeds industry standards
- Operating Lifetime: Extended operational life expectancy
- ESD Protection: Built-in electrostatic discharge protection
- Latch-up Immunity: Robust circuit design prevents latch-up conditions
Supply Chain and Procurement
Authorized Distribution Channels
For genuine XC2S200-6FGG896C devices, purchase through:
- Authorized Xilinx/AMD distributors
- Certified electronics component suppliers
- Direct manufacturer sales channels
- Verified online component marketplaces
Pricing Considerations
Pricing varies based on several factors:
- Order Quantity: Volume discounts available
- Lead Time: Stock versus build-to-order
- Distribution Channel: Direct or through distributors
- Market Conditions: Semiconductor supply and demand
- Packaging Options: Standard versus lead-free
Typical Pricing Ranges (Reference)
| Quantity |
Approximate Unit Price |
| 1-99 units |
Premium pricing |
| 100-499 units |
Volume discount tier 1 |
| 500-999 units |
Volume discount tier 2 |
| 1000+ units |
Maximum volume discount |
Contact authorized distributors for current pricing and availability
Migration and Upgrade Paths
Pin-Compatible Alternatives
When planning for future designs or seeking alternatives:
- Spartan-3 Family: Higher density and performance upgrade
- Spartan-6 Family: Advanced features and lower power
- Artix-7 Family: Modern architecture with enhanced capabilities
- Kintex Series: For applications requiring maximum performance
Design Migration Considerations
- Review I/O standard compatibility
- Verify timing constraint adjustments
- Check block RAM configuration differences
- Assess power supply requirements
Technical Documentation and Resources
Available Documentation
- Product Datasheet: Complete electrical and timing specifications
- User Guide: Comprehensive implementation guidelines
- Application Notes: Design best practices and reference implementations
- Package Drawings: Mechanical specifications and dimensions
- IBIS Models: Signal integrity simulation models
- PCB Layout Guidelines: Board design recommendations
Support Resources
- Xilinx community forums and knowledge base
- Technical support through authorized distributors
- Application engineering assistance
- Training and educational resources
- Reference designs and IP cores
Environmental Compliance and Certifications
RoHS and Environmental Standards
- RoHS Directive Compliance: Lead-free options available
- REACH Compliance: Meets European chemical regulations
- Conflict Minerals: Compliant sourcing practices
- WEEE Directive: Electronic waste management compliance
Export Control Information
- HTS Classification: Proper customs classification
- ECCN Number: Export control classification
- Country of Origin: Manufacturing location information
Conclusion: Why Choose XC2S200-6FGG896C
The XC2S200-6FGG896C delivers exceptional value for engineers and designers seeking a proven, reliable FPGA solution. With its combination of abundant logic resources, flexible I/O options, high-speed performance, and cost-effective implementation, this device excels in diverse applications from industrial automation to telecommunications infrastructure.
Key advantages include:
- Proven Track Record: Mature technology with extensive field deployment
- Comprehensive Toolchain: Full-featured development environment
- Flexible Architecture: Adaptable to wide range of applications
- Cost-Effective Solution: Superior value compared to ASIC alternatives
- Reliable Performance: Industrial-grade quality and reliability
For engineers working with Xilinx FPGA technologies, the XC2S200-6FGG896C represents a strategic choice for current projects while offering clear migration paths for future design evolution. Its balanced combination of features, performance, and affordability makes it an optimal selection for both prototyping and production deployment.
