The XC2S200-6FGG894C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This programmable logic device offers exceptional performance, reliability, and cost-effectiveness for demanding embedded system applications. With 200,000 system gates and advanced features, the XC2S200-6FGG894C FPGA stands as an optimal solution for telecommunications, industrial automation, medical equipment, and aerospace applications.
Key Specifications of XC2S200-6FGG894C
Technical Overview
The XC2S200-6FGG894C represents the pinnacle of the Spartan-II series, featuring a robust 894-ball Fine-Pitch Ball Grid Array (FBGA) package that provides maximum I/O capability for complex digital designs.
XC2S200-6FGG894C Core Specifications
| Specification |
Value |
Description |
| System Gates |
200,000 |
Maximum gate count for complex logic implementations |
| Logic Cells |
5,292 |
Configurable logic cells for flexible design |
| CLB Array |
28 x 42 |
Total of 1,176 Configurable Logic Blocks |
| Distributed RAM |
75,264 bits |
High-speed distributed memory |
| Block RAM |
56K bits (57,344 bits) |
Embedded memory blocks for data storage |
| Speed Grade |
-6 |
High-performance speed grade (263MHz) |
| Core Voltage |
2.5V |
Low-power operation voltage |
| Package Type |
FGG894 |
894-ball Fine-Pitch BGA |
| Process Technology |
0.18μm |
Advanced CMOS fabrication |
| Operating Temperature |
Commercial (0°C to 85°C) |
Standard commercial temperature range |
XC2S200-6FGG894C Package and Pinout Details
FGG894 Package Advantages
The FGG894 package configuration of the XC2S200-6FGG894C offers the highest I/O count available in the Spartan-II XC2S200 family, making it ideal for applications requiring extensive connectivity and signal routing.
| Package Feature |
Specification |
| Total Pins |
894 |
| Ball Pitch |
Fine-pitch array |
| Mounting Type |
Surface Mount Technology (SMT) |
| Maximum User I/O |
Up to 284 (device dependent) |
| Form Factor |
Square BGA |
| RoHS Compliance |
Available with “G” designation (lead-free) |
I/O Banks and Interface Standards
The XC2S200-6FGG894C supports 16 different I/O standards across 8 I/O banks, providing exceptional interfacing flexibility:
| I/O Feature |
Capability |
| I/O Banks |
8 banks with independent VCCO |
| Supported Standards |
LVTTL, LVCMOS, PCI, GTL, SSTL, HSTL, and more |
| VCCO Range |
1.5V to 3.3V |
| Differential Pairs |
Supported for high-speed signaling |
| Input Voltage Reference |
VREF pins for referenced standards |
XC2S200-6FGG894C Performance Characteristics
Speed and Timing Performance
| Performance Metric |
XC2S200-6 Specification |
| Maximum System Frequency |
263MHz |
| Speed Grade |
-6 (fastest commercial grade) |
| Internal Clock Speed |
Up to 200MHz+ |
| Toggle Rate |
High-speed I/O operation |
| Delay Lock Loops (DLLs) |
4 DLLs for clock management |
Memory Architecture Table
| Memory Type |
Capacity |
Configuration |
Use Case |
| Block RAM |
56K bits total |
4K-bit blocks |
FIFO, buffers, lookup tables |
| Distributed RAM |
75,264 bits |
16 bits per LUT |
Small memories, shift registers |
| Total RAM |
131,608 bits |
Combined |
Flexible memory hierarchy |
XC2S200-6FGG894C Applications
Industrial and Commercial Applications
The XC2S200-6FGG894C FPGA excels in numerous application domains where reconfigurable logic and high I/O density are essential.
| Application Area |
Use Cases |
Key Benefits |
| Telecommunications |
Protocol converters, network routers, base stations |
High-speed processing, flexibility |
| Industrial Automation |
Motor control, PLC, process control systems |
Reliability, real-time performance |
| Medical Devices |
Imaging systems, diagnostic equipment, monitors |
Regulatory compliance, precision |
| Aerospace & Defense |
Avionics, radar systems, secure communications |
Radiation tolerance options, security |
| Test & Measurement |
Oscilloscopes, logic analyzers, data acquisition |
High sampling rates, parallel processing |
| Video/Image Processing |
Broadcasting, surveillance, machine vision |
Parallel data paths, embedded RAM |
XC2S200-6FGG894C Architecture Features
Configurable Logic Block (CLB) Structure
Each CLB in the XC2S200-6FGG894C contains four logic cells (LCs) with the following capabilities:
| CLB Component |
Description |
Quantity per CLB |
| 4-Input LUTs |
Function generators |
4 |
| Flip-Flops/Latches |
Storage elements |
4 |
| Carry Logic |
Fast arithmetic operations |
Dedicated chains |
| Multiplexers |
F5/F6 for wider functions |
2 (F5), 1 (F6) |
| Distributed RAM |
LUT-based memory |
Up to 64 bits |
Clock Management and Distribution
| Clock Resource |
Specification |
Function |
| Global Clock Buffers |
4 dedicated GCK pins |
Low-skew distribution |
| Delay Lock Loops |
4 DLLs |
Clock de-skew, multiplication, division |
| DLL Features |
Phase shift, clock mirror |
Advanced clock control |
| Clock Networks |
Primary and secondary |
Hierarchical distribution |
XC2S200-6FGG894C vs Other Spartan-II Devices
Family Comparison Table
| Device Model |
System Gates |
Logic Cells |
Block RAM |
Max I/O |
Best For |
| XC2S15 |
15,000 |
432 |
16K |
86 |
Simple controllers |
| XC2S50 |
50,000 |
1,728 |
32K |
176 |
Medium designs |
| XC2S100 |
100,000 |
2,700 |
40K |
176 |
Complex logic |
| XC2S150 |
150,000 |
3,888 |
48K |
260 |
High-density apps |
| XC2S200-6FGG894C |
200,000 |
5,292 |
56K |
284+ |
Maximum capability |
Design Tools and Development for XC2S200-6FGG894C
Supported Software Platforms
| Tool/Software |
Version |
Purpose |
| Xilinx ISE |
Legacy support |
Primary development environment |
| Vivado Design Suite |
For migration |
Modern tool chain |
| Programming Tools |
JTAG, Platform Cable |
Device configuration |
| Simulation |
ModelSim, ISIM |
Design verification |
Programming and Configuration
| Configuration Mode |
Interface |
Features |
| Master Serial |
SPI Flash |
Independent configuration |
| Slave Serial |
External controller |
Daisy-chain capable |
| JTAG |
Boundary scan |
In-system programming |
| SelectMAP |
Parallel |
Fast configuration |
XC2S200-6FGG894C Power and Thermal Management
Power Consumption Profile
| Power Parameter |
Typical Value |
Notes |
| Core Voltage (VCCINT) |
2.5V ±5% |
Internal logic |
| I/O Voltage (VCCO) |
1.5V – 3.3V |
Per bank configuration |
| Auxiliary Voltage (VCCAUX) |
2.5V or 3.3V |
DLL operation |
| Static Power |
Low |
Depends on configuration |
| Dynamic Power |
Design dependent |
Function of toggle rate |
Thermal Characteristics
| Thermal Parameter |
Specification |
| Junction Temperature (Commercial) |
0°C to 85°C TJ |
| Package Thermal Resistance |
θJA (depends on PCB) |
| Heat Dissipation |
Natural or forced air cooling |
Why Choose XC2S200-6FGG894C for Your Design?
Advantages Over ASICs
The XC2S200-6FGG894C offers significant advantages compared to traditional Application-Specific Integrated Circuits (ASICs):
| Advantage |
XC2S200-6FGG894C FPGA |
Traditional ASIC |
| Development Cost |
Low initial investment |
High NRE costs |
| Time to Market |
Rapid prototyping |
Long development cycles |
| Flexibility |
Unlimited reprogramming |
Fixed functionality |
| Design Iteration |
In-field updates possible |
Requires new silicon |
| Risk |
Low financial risk |
High investment risk |
| Volume |
Cost-effective for low-medium |
Only economical at high volume |
Key Benefits Summary
| Benefit Category |
Features |
| Performance |
263MHz operation, 200K gates, optimized routing |
| Memory |
56K block RAM + 75K distributed RAM |
| I/O Capability |
894-pin package, 16 I/O standards, 284+ user I/Os |
| Reliability |
Proven architecture, extensive testing, field-tested |
| Support |
Comprehensive documentation, active community |
| Cost |
Cost-effective alternative to larger FPGAs/ASICs |
XC2S200-6FGG894C Ordering Information
Part Number Breakdown
Understanding the XC2S200-6FGG894C part number:
| Code |
Meaning |
| XC2S |
Spartan-II family |
| 200 |
200,000 system gates |
| -6 |
Speed grade (fastest commercial) |
| FGG |
Fine-pitch Ball Grid Array package |
| 894 |
894-ball count |
| C |
Commercial temperature range |
Package Variants Available
| Package Code |
Ball Count |
Dimensions |
I/O Count |
Application |
| FG256 |
256 |
17mm x 17mm |
176 |
Compact designs |
| FG456 |
456 |
23mm x 23mm |
284 |
Standard applications |
| FGG894 |
894 |
Larger footprint |
284+ |
Maximum I/O density |
Getting Started with XC2S200-6FGG894C FPGA
Design Checklist
| Step |
Task |
Tools Required |
| 1 |
Design entry |
HDL editor (VHDL/Verilog) |
| 2 |
Synthesis |
Xilinx ISE |
| 3 |
Implementation |
Place & Route tools |
| 4 |
Timing analysis |
Timing Analyzer |
| 5 |
Programming file generation |
BitGen |
| 6 |
Device configuration |
JTAG programmer |
Reference Design Resources
| Resource Type |
Availability |
Purpose |
| Application Notes |
Xilinx website |
Design guidance |
| Reference Designs |
Development kits |
Starting templates |
| IP Cores |
Xilinx Core Generator |
Pre-built functions |
| Development Boards |
Third-party vendors |
Prototyping platforms |
XC2S200-6FGG894C Quality and Reliability
Quality Standards
| Standard |
Compliance |
Description |
| RoHS |
Available (G suffix) |
Lead-free packaging option |
| Automotive |
Select grades |
Extended temperature range |
| Military |
Contact manufacturer |
MIL-STD options |
| ISO 9001 |
Certified |
Quality management |
Reliability Metrics
| Reliability Parameter |
Specification |
| MTBF |
High (>1M hours typical) |
| Qualification |
Full AEC-Q100 available in industrial grades |
| Lifecycle |
Extended product availability |
| Field Returns |
Industry-leading low rates |
XC2S200-6FGG894C Technical Support and Resources
Documentation Resources
| Document Type |
Content |
Access |
| Datasheet |
Complete specifications |
Xilinx website |
| User Guide |
Architecture details |
Official documentation |
| Packaging Info |
Mechanical drawings |
Package files |
| Application Notes |
Design examples |
Technical library |
Where to Learn More About Xilinx FPGA
For comprehensive information about Xilinx FPGA products, design resources, and technical support, visit the dedicated resource hub at the link above. You’ll find extensive documentation, tutorials, and community support for all Xilinx FPGA families including the Spartan-II series.
Frequently Asked Questions About XC2S200-6FGG894C
Common Questions
Q: What is the difference between XC2S200-6FGG894C and XC2S200-5FGG894C?
A: The “-6” speed grade offers faster performance (263MHz) compared to the “-5” speed grade, making it suitable for more demanding high-speed applications.
Q: Can the XC2S200-6FGG894C be used in new designs?
A: While the Spartan-II family is mature and considered legacy, many designs continue to use these devices. For new designs, consider evaluating newer Spartan families (Spartan-7, Spartan UltraScale+) for enhanced features and longevity.
Q: What development boards support XC2S200-6FGG894C?
A: Several third-party vendors offer Spartan-II development boards, though dedicated XC2S200 boards may be limited. Custom PCB design is common for production applications.
Q: Is the XC2S200-6FGG894C radiation-hardened?
A: The commercial version is not radiation-hardened. Contact AMD Xilinx for aerospace/defense-specific variants if radiation tolerance is required.
Q: What is the recommended operating lifetime?
A: Xilinx typically supports products for 10-15+ years from introduction, with advanced notice for end-of-life transitions.
XC2S200-6FGG894C Price and Availability
Purchasing Considerations
| Factor |
Consideration |
| Volume Pricing |
Significant discounts at higher quantities |
| Lead Time |
Varies by distributor and market conditions |
| Minimum Order |
Typically 1 unit for samples, varies for production |
| Distributors |
Authorized distributors ensure authentic parts |
| Alternatives |
Consider XC2S150 or newer Spartan families |
Cost-Effective Design Strategy
| Strategy |
Benefit |
| Right-sizing |
Don’t over-specify; XC2S150 may suffice |
| Package selection |
Smaller packages cost less if I/O permits |
| Speed grade |
-5 grade may be adequate, reducing cost |
| Volume commitment |
Negotiate pricing for production volumes |
Conclusion: XC2S200-6FGG894C for Professional FPGA Solutions
The XC2S200-6FGG894C represents a mature, well-understood FPGA solution offering 200,000 system gates, 5,292 logic cells, and extensive I/O capability in a 894-ball package. This Spartan-II family member excels in industrial automation, telecommunications, medical equipment, and embedded control applications where proven reliability and cost-effectiveness are paramount.
With its robust feature set including 56K block RAM, four DLLs, support for 16 I/O standards, and -6 speed grade performance up to 263MHz, the XC2S200-6FGG894C continues to serve designers who need a dependable, field-programmable gate array solution. Whether replacing ASICs, implementing complex digital logic, or prototyping next-generation systems, this FPGA delivers the flexibility and performance required for demanding applications.
For detailed technical specifications, design tools, and comprehensive support resources about this and other Xilinx FPGA products, consult the official documentation and authorized distributors to ensure you’re selecting the optimal device for your specific application requirements.
