Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG889C: High-Performance Spartan-II FPGA for Advanced Digital Applications

Product Details

The XC2S200-6FGG889C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family, manufactured by AMD Xilinx. This advanced programmable logic device delivers exceptional performance with 200,000 system gates, making it an ideal solution for complex digital design applications across telecommunications, industrial automation, and embedded systems.

As a cost-effective alternative to application-specific integrated circuits (ASICs), the XC2S200-6FGG889C eliminates lengthy development cycles and high initial costs while providing field-upgradeable programmability that conventional ASICs cannot match.

Key Technical Specifications

Core Architecture Parameters

Specification Value
System Gates 200,000
Logic Cells 5,292
CLB Array Configuration 28 × 42 (1,176 total CLBs)
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Maximum User I/O 284 pins
Speed Grade -6 (highest performance)
Operating Voltage 2.5V
Process Technology 0.18μm CMOS
Maximum Frequency 263 MHz

Package Specifications

Package Feature Details
Package Type FGG889 Fine-Pitch Ball Grid Array
Pin Count 889 balls
Temperature Range Commercial (0°C to +85°C)
Package Technology Pb-free available (G suffix)

Advanced Features and Capabilities

Programmable Logic Resources

The XC2S200-6FGG889C incorporates sophisticated configurable logic blocks (CLBs) that provide maximum design flexibility. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers, enabling implementation of complex combinational and sequential logic functions.

Memory Architecture

This Xilinx FPGA features dual memory configurations:

  • Distributed RAM: 75,264 bits organized throughout the CLB array for fast, localized data storage
  • Block RAM: 56 Kbits of synchronous dual-port memory for high-capacity data buffering and processing

Clock Management System

Clock Feature Description
Delay-Locked Loops (DLLs) 4 DLLs (one per corner)
Clock Distribution Dedicated global clock networks
Clock Frequency Up to 263 MHz system performance
Phase Adjustment Precise clock deskew capabilities

Performance Characteristics

Speed Grade Analysis

The -6 speed grade represents the fastest performance tier in the Spartan-II family, exclusively available for commercial temperature ranges. This designation ensures:

  • Minimum propagation delays
  • Maximum operating frequencies
  • Optimized timing for high-speed applications
  • Superior performance for time-critical designs

I/O Performance

I/O Specification Details
Total I/O Pins 284 maximum user I/O
I/O Standards Support Multiple voltage standards
Programmable Drive Adjustable output drive strength
Input Protection ESD protection on all pins

Application Areas

Industrial Automation and Control

The XC2S200-6FGG889C excels in industrial control applications requiring:

  • Motor control systems
  • Process automation controllers
  • PLC (Programmable Logic Controller) implementations
  • Real-time monitoring and data acquisition

Telecommunications Infrastructure

Ideal for communication systems demanding high-speed data processing:

  • Protocol implementation and conversion
  • Digital signal processing (DSP) applications
  • Network routing and switching
  • Baseband processing for wireless systems

Embedded Systems Development

Perfect for embedded applications including:

  • Custom computing engines
  • Video and image processing
  • Hardware acceleration modules
  • Reconfigurable computing platforms

Medical and Scientific Instrumentation

Reliable performance for critical applications:

  • Medical imaging systems
  • Diagnostic equipment
  • Patient monitoring devices
  • Laboratory instrumentation

Comparison with Other Spartan-II Devices

Device Model System Gates Logic Cells Total CLBs Block RAM Max I/O
XC2S50 50,000 1,728 384 32K 176
XC2S100 100,000 2,700 600 40K 176
XC2S150 150,000 3,888 864 48K 260
XC2S200 200,000 5,292 1,176 56K 284

Design and Development Tools

Software Support

  • ISE Design Suite: Complete development environment
  • Vivado Design Suite: Advanced synthesis and implementation
  • ChipScope Pro: Integrated logic analyzer
  • CORE Generator: Pre-optimized IP cores

Programming Options

Programming Method Description
JTAG Boundary Scan Standard IEEE 1149.1 compliant
Master Serial Mode Direct PROM-based configuration
Slave Serial Mode Processor-controlled programming
SelectMAP Parallel configuration interface

Advantages Over ASIC Solutions

Cost Benefits

  • No NRE costs: Eliminates non-recurring engineering expenses
  • Reduced development time: Rapid prototyping and deployment
  • Lower initial investment: Pay only for devices needed
  • Inventory flexibility: Single design, multiple applications

Technical Advantages

  • Field upgradeability: Update logic without hardware changes
  • Design iteration: Quick modifications during development
  • Risk mitigation: Test before production commitment
  • IP protection: Encrypted bitstream security

Power Management Features

Power Specification Details
Core Voltage (VCCINT) 2.5V ±5%
I/O Voltage (VCCO) 1.5V to 3.3V (bank dependent)
Power Consumption Optimized for low-power operation
Sleep Modes Configurable power-down options

Quality and Reliability

Manufacturing Standards

  • Advanced 0.18μm CMOS process technology
  • Rigorous quality control and testing
  • RoHS-compliant lead-free options available
  • Extended temperature range variants

Reliability Features

  • ESD protection on all I/O pins
  • Latch-up resistant design
  • Extensive JEDEC qualification testing
  • Long-term availability commitment

Integration and Interfacing

Compatible I/O Standards

The XC2S200-6FGG889C supports multiple industry-standard interfaces:

  • LVTTL (Low-Voltage TTL)
  • LVCMOS (Low-Voltage CMOS)
  • PCI 33MHz/66MHz
  • GTL/GTL+ (Gunning Transceiver Logic)
  • SSTL (Stub Series Terminated Logic)
  • HSTL (High-Speed Transceiver Logic)

Thermal Characteristics

Thermal Parameter Value
Junction Temperature (Commercial) 0°C to +85°C
Thermal Resistance (θJA) Package dependent
Recommended Cooling Natural or forced convection
Hot Spot Monitoring Internal temperature sensors

Ordering Information and Package Marking

Part Number Breakdown

XC2S200-6FGG889C

  • XC2S200: Device type (Spartan-II, 200K gates)
  • -6: Speed grade (fastest commercial grade)
  • FGG889: Package type (Fine-pitch BGA, 889 balls)
  • C: Commercial temperature range

Package Options Available

Package Code Pin Count Package Type Lead-Free Option
PQ208/PQG208 208 Plastic Quad Flat Pack Yes (G suffix)
FG256/FGG256 256 Fine-pitch BGA Yes (G suffix)
FG456/FGG456 456 Fine-pitch BGA Yes (G suffix)

Technical Support and Resources

Documentation Available

  • Complete datasheet specifications
  • Application notes and design guides
  • Reference designs and example projects
  • Migration guides from other FPGA families

Development Resources

  • Evaluation boards and starter kits
  • IP core libraries
  • Online training and tutorials
  • Technical support forums

Frequently Asked Questions

What makes the -6 speed grade special?

The -6 speed grade offers the highest performance in the Spartan-II family, with minimum propagation delays and maximum operating frequencies, exclusively available for commercial temperature applications.

Can I upgrade my design after deployment?

Yes, one of the key advantages of the XC2S200-6FGG889C is field programmability, allowing logic updates without hardware replacement.

What development tools are required?

Xilinx ISE or Vivado Design Suite provides complete development capabilities, including synthesis, implementation, simulation, and programming tools.

Is the device suitable for high-volume production?

Absolutely. The Spartan-II family is specifically optimized for cost-effective, high-volume manufacturing while maintaining superior performance and reliability.

Competitive Advantages

Why Choose XC2S200-6FGG889C?

  1. Proven Architecture: Based on mature, reliable Spartan-II technology
  2. Scalable Resources: 200,000 gates provide ample design headroom
  3. High I/O Count: 284 user I/Os support complex interfacing
  4. Cost-Effective: Superior price-to-performance ratio
  5. Industry Support: Extensive ecosystem and community resources

Market Position

The XC2S200-6FGG889C occupies a sweet spot in the programmable logic market, offering:

  • More resources than entry-level FPGAs
  • Lower cost than high-end Virtex families
  • Proven reliability in production environments
  • Comprehensive tool support and documentation

Environmental and Regulatory Compliance

Compliance Standard Status
RoHS Directive Compliant (Pb-free versions)
REACH Regulation Compliant
Conflict Minerals Compliant reporting
JEDEC Standards Fully compliant

Summary and Recommendations

The XC2S200-6FGG889C represents an excellent choice for engineers seeking a balance between performance, cost, and flexibility. With 200,000 system gates, 5,292 logic cells, and the fastest -6 speed grade, this FPGA delivers professional-grade capabilities for demanding applications.

Whether you’re developing telecommunications equipment, industrial control systems, medical devices, or embedded computing platforms, the XC2S200-6FGG889C provides the resources and performance needed for successful implementation.

Best Use Cases

  • High-speed digital signal processing requiring maximum clock frequencies
  • Complex control systems with multiple interface requirements
  • Prototyping ASIC designs before production commitment
  • Small to medium volume production where flexibility is valued

Getting Started

To begin working with the XC2S200-6FGG889C:

  1. Download Xilinx ISE or Vivado Design Suite
  2. Review the complete datasheet and reference materials
  3. Consider evaluation boards for initial development
  4. Leverage available IP cores and reference designs
  5. Engage with the Xilinx developer community

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.