The XC2S200-6FGG884C is a premium field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance for complex digital applications. With 200,000 system gates, 5,292 logic cells, and an 884-ball Fine-Pitch Ball Grid Array (FBGA) package, this FPGA represents the ideal solution for engineers seeking high-density programmable logic in a cost-effective platform.

Overview of XC2S200-6FGG884C FPGA

The XC2S200-6FGG884C stands as one of the most capable devices in the Spartan-II FPGA family, offering superior logic density and flexible I/O capabilities. This programmable logic device combines advanced semiconductor technology with proven architecture, making it the preferred choice for telecommunications, industrial automation, medical equipment, and embedded system applications.

What Makes XC2S200-6FGG884C Unique?

This FPGA variant features the largest package option in the XC2S200 series, providing maximum I/O pins and enhanced thermal performance. The FGG884 package delivers 284 user I/O pins, enabling complex interfacing requirements while maintaining signal integrity and system reliability.

Key Technical Specifications

Advanced Features and Capabilities

High-Density Logic Resources

The XC2S200-6FGG884C integrates 5,292 logic cells organized in a 28×42 Configurable Logic Block (CLB) array, providing substantial computational resources for implementing sophisticated digital designs. Each CLB contains four logic slices with Look-Up Tables (LUTs), flip-flops, and multiplexers, enabling efficient implementation of complex Boolean functions and sequential logic.

Flexible Memory Architecture

Distributed RAM: 75,264 bits of distributed RAM embedded within CLBs provides fast, localized memory for data-intensive operations.

Block RAM: 56K bits of dedicated block RAM offers high-speed storage for buffering, FIFOs, and lookup tables.

This dual-memory architecture allows designers to optimize memory placement for maximum performance and minimal routing congestion.

Speed Grade -6 Performance

The -6 speed grade designation indicates this is the fastest variant available in the XC2S200 family, supporting system frequencies up to 200 MHz. This high-performance specification enables:

• Rapid signal processing applications
• High-speed communication protocols
• Real-time data acquisition systems
• Time-critical control systems

Extensive I/O Capabilities

With 284 user I/O pins, the XC2S200-6FGG884C provides exceptional connectivity options:

Four Delay-Locked Loops (DLLs)

The XC2S200-6FGG884C incorporates four DLLs positioned at each corner of the die, providing:

• Clock de-skewing and multiplication
• Precise phase alignment
• Duty cycle correction
• Clock distribution network optimization

Package Details: FGG884

Physical Characteristics

Package Advantages

The FGG884 package offers several critical advantages for high-performance designs:

1. Maximum I/O Density – Largest pin count in XC2S200 series
2. Superior Thermal Management – Better heat dissipation than smaller packages
3. Signal Integrity – Shorter bond wire lengths reduce parasitic effects
4. PCB Layout Flexibility – More pins allow for optimized routing
5. EMI Performance – Better ground plane connectivity

Primary Applications

Communications Infrastructure

The XC2S200-6FGG884C excels in telecommunications equipment:

• Protocol converters and bridges
• Network routers and switches
• Baseband processing units
• Digital signal processing (DSP) systems
• Software-defined radio (SDR) platforms

Industrial Automation

This FPGA powers mission-critical industrial applications:

• Programmable Logic Controllers (PLCs)
• Motion control systems
• Machine vision processing
• Process monitoring and control
• Factory automation interfaces

Medical Electronics

Healthcare applications benefit from the XC2S200-6FGG884C’s reliability:

• Medical imaging equipment
• Patient monitoring systems
• Diagnostic instrument control
• Laboratory automation
• Ultrasound signal processing

Automotive Systems

Advanced automotive electronics leverage this FPGA:

• Engine control unit (ECU) prototyping
• Advanced driver assistance systems (ADAS)
• Infotainment system development
• Vehicle network gateways
• Electronic control module testing

Comparison with Other Spartan-II Devices

The XC2S200-6FGG884C represents the flagship device in the Spartan-II family, offering the highest logic density, memory capacity, and I/O count.

Design Tools and Development Support

Compatible Development Software

The XC2S200-6FGG884C is fully supported by AMD Xilinx design tools:

• ISE Design Suite – Legacy tool chain with proven reliability
• Vivado Design Suite – Modern development environment
• ModelSim – Industry-standard simulation platform
• ChipScope Pro – Integrated logic analyzer

Programming and Configuration

Multiple configuration options provide design flexibility:

Performance Specifications

Timing Characteristics

Power Consumption

The XC2S200-6FGG884C operates efficiently within these power parameters:

• Core Voltage (VCCINT): 2.5V ±5%
• I/O Voltage (VCCIO): 1.8V to 3.3V (bank-dependent)
• Typical Power: Application-dependent (50-500mW range)
• Standby Power: < 10mW

Why Choose XC2S200-6FGG884C?

Superior Alternative to ASICs

The XC2S200-6FGG884C provides significant advantages over mask-programmed ASICs:

1. No NRE Costs – Eliminate expensive mask sets and fabrication charges
2. Rapid Development – Iterate designs without silicon re-spins
3. Field Upgrades – Update functionality without hardware replacement
4. Risk Mitigation – Avoid costly design errors in hardened silicon
5. Market Flexibility – Respond quickly to changing requirements

Cost-Effective High-Performance

Despite its advanced capabilities, the Spartan-II family delivers exceptional value:

• Competitive pricing for 200K gate density
• Reduced time-to-market costs
• Lower total system development expenses
• Extended product lifecycle support

Proven Reliability

The XC2S200-6FGG884C benefits from mature manufacturing processes:

• Extensive qualification testing
• High MTBF (Mean Time Between Failures)
• Industrial-grade temperature options available
• Comprehensive quality assurance programs

Getting Started with XC2S200-6FGG884C

Development Board Options

Several evaluation platforms support the XC2S200-6FGG884C:

• Xilinx Spartan-II development kits
• Third-party FPGA prototyping boards
• Custom carrier boards for specific applications

Design Resources

Engineers can access comprehensive documentation:

• Complete datasheets with electrical specifications
• Reference designs and application notes
• Design constraint files and package diagrams
• Technical support through AMD Xilinx forums

Technical Support and Documentation

Available Resources

Ordering Information and Availability

Part Number Breakdown

XC2S200-6FGG884C

• XC2S200 – Device type and logic capacity
• 6 – Speed grade (-6 = fastest)
• FGG884 – Package type (884-ball FBGA)
• C – Commercial temperature range (0°C to +85°C)

Package Options

While this description focuses on the FGG884 variant, the XC2S200 is available in multiple packages:

• FG256 (256-ball FBGA)
• FG456 (456-ball FBGA)
• FGG884 (884-ball FBGA) – Described here
• PQ208 (208-pin PQFP)

Frequently Asked Questions

Q: What is the difference between -5 and -6 speed grades?

The -6 speed grade offers approximately 20% better performance than -5 grade devices, supporting higher system frequencies and lower propagation delays. The -6 grade is exclusively available in commercial temperature range.

Q: Is the XC2S200-6FGG884C RoHS compliant?

Standard packages may contain lead. For Pb-free (RoHS compliant) versions, look for the “FGG” designation which indicates green packaging options.

Q: Can I use Vivado with Spartan-II devices?

Spartan-II FPGAs are primarily supported by ISE Design Suite. Vivado targets newer 7-series and beyond architectures. ISE remains the recommended toolchain for Spartan-II development.

Q: What configuration PROMs are compatible?

The XC2S200-6FGG884C works with Xilinx Platform Flash PROMs including XCF02S and XCF04S for master serial configuration mode.

Alternative and Compatible Devices

Engineers considering the XC2S200-6FGG884C might also evaluate:

• XC2S200-5FGG884C – Same package, lower speed grade
• XC2S150-6FG456C – Smaller logic capacity, fewer I/O
• XC3S200-4FG320C – Newer Spartan-3 alternative
• XC3S400-4FG456C – Higher capacity Spartan-3 option

Conclusion

The XC2S200-6FGG884C represents the pinnacle of Spartan-II FPGA technology, combining 200,000 system gates, 284 I/O pins, and -6 speed grade performance in a robust 884-ball FBGA package. Whether you’re developing telecommunications infrastructure, industrial control systems, medical devices, or automotive electronics, this Xilinx FPGA delivers the logic density, performance, and flexibility required for demanding applications.

With its proven architecture, comprehensive development tool support, and cost-effective pricing, the XC2S200-6FGG884C continues to serve as a reliable solution for engineers worldwide. Its programmable nature eliminates the risks and costs associated with ASICs while providing the performance needed for modern digital systems.

For designers seeking maximum I/O capability and logic resources in the Spartan-II family, the XC2S200-6FGG884C stands as the definitive choice, backed by AMD Xilinx’s commitment to quality and extensive ecosystem support.