The XC2S200-6FGG883C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional programmable logic performance for demanding digital applications. This versatile FPGA combines advanced processing capabilities with reliable operation, making it an ideal choice for engineers developing telecommunications systems, industrial automation, embedded systems, and digital signal processing applications.
As part of the industry-leading Xilinx FPGA product portfolio, the XC2S200-6FGG883C offers a cost-effective solution that bridges the gap between simple programmable logic devices and high-end FPGAs, delivering robust performance without the expense and rigidity of traditional ASICs.
Key Technical Specifications
Core Performance Features
| Specification |
Value |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| CLB Array Configuration |
28 × 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Speed Grade |
-6 (Commercial temperature range) |
| Core Voltage |
2.5V |
| Technology Node |
0.18μm CMOS |
| Maximum Frequency |
263 MHz |
Package Information
| Package Parameter |
Specification |
| Package Type |
FGG883 Fine-Pitch Ball Grid Array |
| Ball Count |
883 balls |
| Form Factor |
FBGA (Fine Ball Grid Array) |
| Terminal Type |
Solder balls |
| RoHS Compliance |
Available in Pb-free option |
| Temperature Range |
Commercial (0°C to 85°C) |
Advanced Architecture and Design
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG883C features 1,176 configurable logic blocks arranged in a 28 × 42 array, providing substantial resources for implementing complex digital designs. Each CLB contains:
- Look-up tables (LUTs) for flexible logic implementation
- Flip-flops for sequential logic operations
- Multiplexers for routing and data selection
- Carry logic for efficient arithmetic operations
Memory Architecture
| Memory Type |
Capacity |
Application |
| Distributed RAM |
75,264 bits |
Small FIFO buffers, lookup tables, register files |
| Block RAM |
56 Kbits |
Large data buffers, packet processing, image storage |
The dual-memory architecture enables efficient data management, with distributed RAM scattered throughout the CLB array for low-latency access, while block RAM modules provide high-density storage for larger datasets.
Input/Output Capabilities
With 284 maximum user I/O pins, the XC2S200-6FGG883C provides extensive connectivity options for interfacing with external components:
- Programmable I/O standards support
- Individual I/O voltage configuration
- High-speed differential signaling support
- Input/output buffer customization
- Slew rate control for signal integrity
Key Features and Benefits
Superior ASIC Alternative
| FPGA Advantage |
Traditional ASIC Limitation |
| Zero NRE costs |
High initial mask costs ($100K+) |
| Instant prototyping |
6-12 month development cycles |
| Field upgradeable |
Fixed functionality |
| Design flexibility |
Costly design changes |
| Reduced time-to-market |
Extended development timeline |
Delay-Locked Loops (DLLs)
The XC2S200-6FGG883C incorporates four Delay-Locked Loops positioned at each corner of the die, providing:
- Clock de-skewing capabilities
- Clock frequency multiplication and division
- Phase shift adjustment
- Clock distribution network optimization
- Reduced clock-to-output delays
High-Performance Design Tools
Developers can leverage comprehensive development ecosystems:
- Vivado Design Suite – Modern synthesis and implementation
- ISE Design Tools – Legacy support for Spartan-II family
- IP Core libraries – Pre-verified functional blocks
- ChipScope Pro – On-chip debugging capabilities
- ModelSim – HDL simulation environment
Target Applications
Telecommunications Systems
| Application Area |
XC2S200-6FGG883C Benefits |
| Protocol Processing |
High I/O count enables multi-protocol support |
| Channel Coding |
Sufficient logic resources for complex algorithms |
| Data Routing |
Fast switching fabric implementation |
| Signal Conditioning |
Flexible DSP capabilities |
Industrial Automation
The XC2S200-6FGG883C excels in industrial control applications:
- Motor Control Systems – PWM generation, encoder interfaces, feedback loops
- Process Monitoring – Multi-sensor integration, data acquisition
- Machine Vision – Image preprocessing, pattern recognition
- Factory Automation – PLC functionality, fieldbus protocols
Embedded Systems
- Real-time data processing
- Sensor fusion applications
- Custom peripheral implementation
- System-on-chip prototyping
- Hardware acceleration modules
Digital Signal Processing
- FIR/IIR filter implementation
- FFT/IFFT operations
- Digital up/down converters
- Audio/video codec development
- Software-defined radio (SDR) systems
Design Considerations
Power Management
| Power Characteristic |
Typical Value |
Notes |
| Core Voltage (VCCINT) |
2.5V ± 5% |
Internal logic power |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
Configurable per bank |
| Static Power |
Low |
0.18μm process advantage |
| Dynamic Power |
Application-dependent |
Use Xilinx Power Estimator |
Thermal Considerations
The FGG883 package provides excellent thermal performance through:
- Large ball grid for efficient heat spreading
- Direct thermal path to PCB
- Optional heat sink attachment points
- Thermal vias for enhanced cooling
PCB Layout Guidelines
For optimal performance with the XC2S200-6FGG883C:
- Power Planes – Dedicated power and ground planes for VCCINT and VCCO
- Decoupling – Multiple 0.1μF capacitors near each power pin
- Ball Pitch – Verify fine-pitch BGA routing capabilities
- Signal Integrity – Length matching for high-speed differential pairs
- Thermal Management – Adequate copper pour for heat dissipation
Programming and Configuration
Configuration Methods
| Method |
Description |
Use Case |
| JTAG |
Boundary-scan programming |
Development and debugging |
| Master Serial |
External PROM-based |
Production systems |
| Slave Serial |
External controller-based |
System integration |
| SelectMAP |
Parallel configuration |
Fast reconfiguration |
Development Workflow
- Design Entry – HDL coding (VHDL/Verilog) or schematic capture
- Synthesis – Logic optimization and technology mapping
- Implementation – Place and route operations
- Timing Analysis – Static timing verification
- Bitstream Generation – Programming file creation
- Programming – Device configuration via chosen method
Quality and Reliability
Manufacturing Standards
The XC2S200-6FGG883C adheres to stringent quality controls:
- ISO 9001:2015 certified manufacturing
- MIL-PRF-38535 quality conformance inspection (QCI) available
- Comprehensive automated testing
- Moisture sensitivity level (MSL) rating
- RoHS and REACH compliance options
Testing and Validation
| Test Type |
Coverage |
| Boundary Scan |
JTAG IEEE 1149.1 standard |
| Functional Testing |
100% production test |
| Parametric Testing |
Speed grade verification |
| Environmental Stress |
Temperature cycling, HTOL |
Competitive Advantages
Comparison with Alternative Solutions
| Feature |
XC2S200-6FGG883C |
Competing FPGAs |
| Cost-Performance Ratio |
Excellent for 200K gate range |
Higher cost at equivalent density |
| Tool Support |
Mature, well-documented toolchain |
Varying support quality |
| IP Availability |
Extensive IP core library |
Limited third-party IP |
| Community Support |
Large developer ecosystem |
Smaller communities |
| Legacy Compatibility |
Spartan-II proven architecture |
Newer, less proven designs |
Ordering Information
Part Number Breakdown
XC2S200-6FGG883C
- XC2S200 – Spartan-II family, 200K system gates
- 6 – Speed grade (-6 for commercial temperature)
- FGG883 – Fine-pitch ball grid array, 883-ball package
- C – Commercial temperature range (0°C to 85°C)
Available Variants
For different application requirements, consider these related parts:
- XC2S200-5FGG883C – Speed grade -5 (slightly lower performance)
- XC2S200-6FGG883I – Industrial temperature range (-40°C to 100°C)
- XC2S150-6FGG883C – Lower density option (150K gates)
- XC2S300-6FGG883C – Higher density option (300K gates) if available
Technical Support Resources
Documentation
Access comprehensive technical resources:
- Product Datasheet – Detailed electrical specifications
- User Guide – Architecture and feature descriptions
- Packaging Specifications – Mechanical dimensions and tolerances
- Application Notes – Design best practices
- PCB Design Guidelines – Layout recommendations
Development Tools
- Xilinx ISE Design Suite (legacy support)
- Vivado Design Suite (modern alternative for newer designs)
- IP Core Generator
- CORE Generator System
- Timing Analyzer
- FloorPlanner
Conclusion
The XC2S200-6FGG883C represents a proven, reliable FPGA solution for engineers requiring 200,000 system gates of programmable logic in a high-pin-count package. Its combination of substantial logic resources, flexible I/O capabilities, and mature development tools makes it an excellent choice for telecommunications, industrial, and embedded applications where cost-effectiveness and design flexibility are paramount.
Whether you’re developing next-generation communication equipment, industrial control systems, or custom digital signal processing solutions, the XC2S200-6FGG883C delivers the performance, reliability, and design freedom necessary to bring innovative products to market quickly and cost-effectively.
Frequently Asked Questions
Q: What is the main difference between the -5 and -6 speed grades?
A: The -6 speed grade offers faster maximum operating frequencies and lower propagation delays compared to -5, making it suitable for more demanding high-speed applications. However, -6 is exclusively available in commercial temperature range.
Q: Can the XC2S200-6FGG883C replace an ASIC in my design?
A: Yes, the XC2S200-6FGG883C is specifically designed as an ASIC alternative, offering field programmability, zero NRE costs, and faster time-to-market while avoiding the risks and expenses of traditional ASIC development.
Q: What programming languages are supported?
A: The XC2S200-6FGG883C supports standard HDL languages including VHDL and Verilog, as well as schematic entry through Xilinx design tools.
Q: Is the device 5V tolerant?
A: With appropriate configuration and series resistors, the Spartan-II family can interface with 5V systems. Consult the datasheet for specific implementation guidelines.
Q: What is the typical power consumption?
A: Power consumption varies significantly based on design utilization, operating frequency, and I/O activity. Use Xilinx XPower Analyzer tool for accurate power estimation for your specific application.
