Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG880C: High-Performance Spartan-II FPGA for Advanced Digital Design

Product Details

The XC2S200-6FGG880C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance for complex digital applications. This commercial-grade FPGA combines 200,000 system gates with advanced programmable architecture, making it the ideal choice for engineers requiring flexible, cost-effective solutions in telecommunications, industrial automation, and embedded systems.

What is the XC2S200-6FGG880C FPGA?

The XC2S200-6FGG880C represents the pinnacle of the Spartan-II FPGA series, featuring a robust FGG880 package with 880 fine-pitch ball grid array pins. This Xilinx FPGA offers superior connectivity and signal integrity, making it perfect for high-density applications requiring extensive I/O capabilities. With its -6 speed grade and commercial temperature range (0°C to +85°C), this device delivers reliable performance across diverse operating environments.

Key Specifications Overview

Parameter Specification
Part Number XC2S200-6FGG880C
Family Spartan-II
Manufacturer AMD Xilinx
System Gates 200,000
Logic Cells 5,292
Package Type FGG880 (880-ball FBGA)
Speed Grade -6
Temperature Range Commercial (0°C to +85°C)
Core Voltage 2.5V
Technology Node 0.18μm

Technical Architecture and Performance

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG880C features an impressive array of 1,176 configurable logic blocks organized in a 28 x 42 grid structure. Each CLB contains multiple logic cells equipped with look-up tables (LUTs), flip-flops, and multiplexers, enabling engineers to implement sophisticated digital circuits with maximum flexibility.

CLB Architecture Details

Feature Specification
Total CLBs 1,176
CLB Array 28 rows × 42 columns
Logic Cells 5,292
Distributed RAM 75,264 bits
Block RAM 56 Kbits

Memory Resources

The XC2S200-6FGG880C FPGA incorporates dual memory architectures to optimize data storage and processing:

Distributed RAM: With 75,264 bits of distributed RAM embedded within the CLB structure, designers can implement small, fast memory elements throughout their designs for efficient data buffering and state machines.

Block RAM: The device includes 56 Kbits of dedicated block RAM organized in efficient columns, perfect for implementing FIFOs, lookup tables, and data buffers in high-throughput applications.

Input/Output Capabilities

The FGG880 package provides 284 maximum user I/O pins, offering exceptional connectivity for complex multi-interface systems. These I/O blocks support various standards and voltage levels, ensuring compatibility with diverse system requirements.

I/O Feature Specification
Maximum User I/Os 284
Package Pins 880 balls
I/O Standards Multiple LVTTL/LVCMOS
Global Clock Inputs 4 dedicated

Advanced Features of XC2S200-6FGG880C

Delay-Locked Loops (DLLs)

Four integrated DLLs, strategically positioned at each corner of the die, provide precise clock management and distribution. These DLLs enable clock de-skewing, frequency multiplication, and phase shifting, crucial for high-speed synchronous designs operating at frequencies up to 263 MHz.

Programmable Interconnect

The XC2S200-6FGG880C employs a hierarchical routing architecture with versatile switching matrices, ensuring efficient signal routing between CLBs, I/Os, and memory blocks. This flexible interconnect minimizes routing delays while maximizing design utilization.

Speed Grade Performance

The -6 speed grade designation indicates this FPGA’s fastest performance tier within the Spartan-II family, delivering:

  • Minimum propagation delays
  • Maximum operating frequencies up to 263 MHz
  • Optimized timing for critical path applications
  • Enhanced setup and hold time margins

Application Areas for XC2S200-6FGG880C

Telecommunications Systems

The XC2S200-6FGG880C excels in telecommunications infrastructure, implementing:

  • Protocol converters and bridges
  • Digital signal processing algorithms
  • Network packet processors
  • Error correction coding
  • Data serialization/deserialization

Industrial Automation and Control

Manufacturing and process control systems leverage this FPGA for:

  • Motor control algorithms
  • PLC (Programmable Logic Controller) interfaces
  • Sensor data acquisition and processing
  • Real-time control loops
  • Human-machine interfaces (HMI)

Embedded Systems Development

Embedded designers utilize the XC2S200-6FGG880C for:

  • Custom peripheral controllers
  • Hardware acceleration modules
  • System-on-chip (SoC) prototyping
  • Legacy system interfacing
  • Cryptographic co-processors

Medical Electronics

Healthcare applications benefit from:

  • Medical imaging processing
  • Patient monitoring systems
  • Diagnostic equipment controllers
  • Biosignal processing
  • Regulatory-compliant data handling

Technical Comparison Table

Spartan-II Device System Gates Logic Cells CLBs Block RAM Max I/O
XC2S50 50,000 1,728 384 32K 176
XC2S100 100,000 2,700 600 40K 176
XC2S150 150,000 3,888 864 48K 260
XC2S200 200,000 5,292 1,176 56K 284

Why Choose XC2S200-6FGG880C?

Cost-Effective ASIC Alternative

The XC2S200-6FGG880C eliminates the high non-recurring engineering (NRE) costs associated with custom ASICs. With instant design modifications and field upgrades, this FPGA reduces time-to-market while maintaining design flexibility throughout the product lifecycle.

Proven Reliability

Built on mature 0.18μm process technology, the Spartan-II family has demonstrated exceptional reliability across millions of deployed units worldwide. The commercial temperature grade ensures consistent performance in standard operating environments.

Design Tools and Support

Engineers benefit from comprehensive development support:

  • Vivado Design Suite compatibility
  • ISE Design Suite legacy support
  • Extensive IP core libraries
  • Simulation and verification tools
  • Active developer community resources

Package Information: FGG880

Physical Characteristics

Package Parameter Specification
Package Type Fine-Pitch Ball Grid Array (FBGA)
Total Balls 880
Ball Pitch Fine-pitch (typically 1.0mm)
Package Marking Includes device code, speed grade, temperature
RoHS Compliance G-suffix indicates Pb-free option

Thermal Considerations

The FGG880 package provides excellent thermal dissipation characteristics, supporting reliable operation in thermally challenging environments. The ball grid array configuration ensures uniform heat distribution across the PCB mounting surface.

Programming and Configuration

Configuration Methods

The XC2S200-6FGG880C supports multiple configuration modes:

  • Master Serial Mode: FPGA controls external serial PROM
  • Slave Serial Mode: External processor loads bitstream
  • Master SelectMAP: Parallel configuration for faster loading
  • Slave SelectMAP: Processor-controlled parallel mode
  • JTAG Boundary Scan: IEEE 1149.1 compliant for testing and programming

Bitstream Security

Configuration bitstreams can be encrypted to protect intellectual property, ensuring design security in production environments.

Development Resources

Getting Started with XC2S200-6FGG880C

Engineers beginning projects with this FPGA should:

  1. Download development tools: Obtain Xilinx ISE or Vivado Design Suite
  2. Review datasheets: Study DS001 specification document thoroughly
  3. Select evaluation board: Consider compatible development platforms
  4. Access IP cores: Leverage pre-verified intellectual property blocks
  5. Join community forums: Connect with experienced Spartan-II developers

Reference Designs

Xilinx provides numerous reference designs demonstrating:

  • Communication protocol implementations
  • DSP algorithm examples
  • Memory controller templates
  • I/O interface examples
  • Clock management best practices

Power Consumption Characteristics

Voltage Requirements

Power Rail Voltage Tolerance Purpose
VCCINT 2.5V ±5% Core logic power
VCCO 1.5V – 3.3V Per I/O bank I/O power supply
VCCAUX 2.5V ±5% Auxiliary circuits

Power Optimization

The XC2S200-6FGG880C implements several power-saving features:

  • Clock gating for unused logic
  • Dynamic power scaling
  • Selective block RAM activation
  • I/O standard optimization

Quality and Compliance

Manufacturing Standards

All XC2S200-6FGG880C devices undergo rigorous:

  • Electrical parameter testing
  • Thermal cycling qualification
  • Moisture sensitivity level (MSL) rating
  • Electrostatic discharge (ESD) protection verification

Environmental Compliance

The device meets international environmental standards:

  • RoHS directive compliance (Pb-free variants)
  • REACH regulation conformity
  • Conflict minerals disclosure
  • ISO quality certifications

Ordering Information Guide

Part Number Decoding

XC2S200-6FGG880C breaks down as:

  • XC2S200: Device family and gate count
  • 6: Speed grade (-6 is fastest)
  • FGG: Package family (Fine-pitch Ball Grid)
  • 880: Pin/ball count
  • C: Commercial temperature range (0°C to +85°C)

Lead-Free Options

Add “G” suffix for RoHS-compliant Pb-free packages: XC2S200-6FGG880CG

Competitive Advantages

Versus Other FPGA Families

The XC2S200-6FGG880C offers distinct benefits:

Compared to Spartan-3: Lower power consumption at 2.5V core voltage, proven reliability in legacy designs, broader temperature operating range options.

Compared to Virtex Series: More cost-effective for moderate complexity applications, faster time-to-market with simpler design requirements, lower overall system cost.

Compared to Altera/Intel: Compatible with extensive Xilinx IP ecosystem, superior development tool maturity, larger installed base for support.

Long-Term Availability

Product Lifecycle

While the Spartan-II family represents mature technology, the XC2S200 series maintains availability through:

  • Authorized distributors maintaining stock
  • Last-time-buy programs for legacy support
  • Migration paths to newer FPGA families
  • Pin-compatible upgrade options

Obsolescence Management

For designs requiring extended lifecycle support:

  • Consult with Xilinx/AMD on product discontinuation notices (PDNs)
  • Consider stocking strategies for long-term production
  • Evaluate migration to Spartan-6 or Spartan-7 families
  • Implement design portability best practices

Frequently Asked Questions

What is the difference between XC2S200-5 and XC2S200-6?

The -6 speed grade offers faster performance with lower propagation delays and higher maximum operating frequencies compared to the -5 speed grade. Choose -6 for timing-critical applications.

Can I use 3.3V I/O with this FPGA?

Yes, the XC2S200-6FGG880C supports multiple I/O standards including 3.3V LVTTL/LVCMOS on VCCO-powered banks.

What development board supports FGG880 package?

Contact Xilinx/AMD or third-party board manufacturers for FGG880-specific development platforms, or design custom PCBs for production applications.

How does block RAM differ from distributed RAM?

Block RAM provides larger, dedicated memory blocks ideal for data buffering, while distributed RAM uses CLB resources for smaller, faster memory elements distributed throughout the design.

Is this FPGA suitable for new designs?

While technically capable, consider newer Spartan families (Spartan-6, Spartan-7) for new projects to ensure long-term availability and access to modern features.

Conclusion

The XC2S200-6FGG880C FPGA delivers exceptional value for engineers requiring a proven, high-performance programmable logic solution. With its comprehensive feature set including 200,000 system gates, 284 I/O pins, flexible memory architecture, and robust FGG880 package, this device addresses demanding applications across telecommunications, industrial automation, medical electronics, and embedded systems.

Whether upgrading legacy designs or developing cost-sensitive applications where proven technology is paramount, the XC2S200-6FGG880C offers the performance, reliability, and flexibility that design engineers demand. Its compatibility with mature development tools, extensive IP libraries, and strong community support ensures successful project implementation from concept through production.

For comprehensive specifications, pinout diagrams, and application notes, consult the official Xilinx Spartan-II datasheet DS001. To explore the complete range of Xilinx FPGA solutions and find the perfect device for your next project, visit specialized Xilinx FPGA resources and distributors.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.