The XC2S200-6FGG878C is a cutting-edge Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, manufactured by AMD Xilinx. This powerful programmable logic device delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it an ideal solution for complex digital design implementations across various industries.
As part of the Spartan-II architecture, the XC2S200-6FGG878C represents a cost-effective alternative to traditional ASICs while offering superior flexibility and reconfigurability. This Xilinx FPGA combines advanced processing capabilities with an extensive I/O configuration in a compact 878-ball Fine-pitch Ball Grid Array package.
Key Specifications and Technical Features
Core Technical Specifications Table
| Specification |
Details |
| Part Number |
XC2S200-6FGG878C |
| Manufacturer |
AMD Xilinx |
| Product Family |
Spartan-II FPGA |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 cells |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18 µm |
| Core Voltage |
2.5V |
| Package Type |
FGG878 (Fine-pitch BGA) |
| Total Pins |
878-ball array |
| Speed Grade |
-6 (Commercial) |
| Temperature Range |
0°C to +85°C (Commercial) |
Memory and Storage Capabilities
| Memory Type |
Capacity |
| Distributed RAM |
33,792 bits |
| Block RAM |
56 Kbits (7 blocks × 8K) |
| Total RAM Bits |
57,344 bits |
| CLB Array |
20 × 30 (600 CLBs) |
Advanced Architecture and Design Features
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG878C features a robust architecture with 600 Configurable Logic Blocks arranged in a 20×30 array. Each CLB contains:
- Four logic slices with Look-Up Tables (LUTs)
- Fast carry logic for arithmetic operations
- Dedicated multiplexers for efficient routing
- Distributed RAM capability for local memory storage
- Multiple flip-flops for sequential logic implementation
Input/Output Block (IOB) Configuration
| I/O Feature |
Specification |
| User I/O Pins |
Up to 284 pins (FGG878 package) |
| I/O Standards Supported |
LVTTL, LVCMOS, PCI, GTL+ |
| Input Voltage Range |
2.5V to 3.3V compatible |
| Output Drive Strength |
Programmable (2mA to 24mA) |
| Input/Output Registers |
3 registers per IOB |
Performance Characteristics and Speed Grades
XC2S200-6FGG878C Speed Grade Analysis
The -6 speed grade designation indicates this device is optimized for commercial temperature operation with enhanced performance characteristics:
- Maximum toggle frequency: 263 MHz
- Optimized for high-speed digital signal processing
- Ideal for time-critical applications
- Commercial temperature range: 0°C to +85°C
- Lower propagation delays compared to -5 grade variants
Clock Management and Distribution
| Clock Feature |
Capability |
| Global Clock Buffers |
4 dedicated BUFG |
| Clock Distribution |
Low-skew global network |
| DLL (Delay Locked Loop) |
4 DLLs for clock management |
| Clock Multiplication/Division |
Supported via DLL |
Package Information: FGG878 Ball Grid Array
FGG878 Package Specifications
| Package Attribute |
Specification |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Total Balls |
878 |
| Pitch |
1.0 mm |
| Package Dimensions |
35mm × 35mm (approximate) |
| Body Thickness |
Standard FBGA profile |
| Ball Material |
Solder balls (Pb-free option available) |
The FGG878 package offers the highest I/O density among Spartan-II variants, making the XC2S200-6FGG878C particularly suitable for applications requiring extensive external connectivity.
Applications and Use Cases
Industrial Automation and Control
The XC2S200-6FGG878C excels in industrial environments:
- Programmable Logic Controllers (PLCs)
- Motor control systems with PWM generation
- Process monitoring and control interfaces
- Factory automation equipment
- Real-time data acquisition systems
Communications and Networking
Ideal for communication infrastructure:
- Protocol converters and bridges
- Network packet processors
- High-speed data routing applications
- Telecommunication interface cards
- Signal processing for wireless systems
Medical and Instrumentation
Critical applications in medical technology:
- Medical imaging equipment
- Patient monitoring devices
- Diagnostic instrument controllers
- Laboratory automation systems
- Ultrasound processing units
Consumer Electronics and Multimedia
Versatile deployment in consumer products:
- Digital video processing
- Audio DSP applications
- High-definition display controllers
- Gaming hardware acceleration
- Set-top box implementations
Development Tools and Software Support
Design Software Compatibility
| Development Tool |
Support Level |
| Xilinx ISE Design Suite |
Full support (Legacy) |
| Vivado Design Suite |
Limited (use ISE recommended) |
| WebPACK (Free) |
Fully supported |
| ChipScope Pro |
Debug support available |
Programming and Configuration
The XC2S200-6FGG878C supports multiple configuration modes:
- Master Serial mode
- Slave Serial mode
- Boundary Scan (JTAG)
- SelectMAP parallel configuration
- Configuration PROM options
Power Consumption and Thermal Management
Power Specifications
| Power Parameter |
Typical Value |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Voltage (VCCIO) |
2.5V to 3.3V |
| Quiescent Power |
~200 mW |
| Dynamic Power |
Design-dependent |
| Recommended Decoupling |
Multiple 0.1µF + 10µF caps |
Thermal Considerations
- Junction temperature: 125°C maximum
- Recommended heat sink for high-utilization designs
- Thermal resistance depends on PCB layout
- Power estimation tools available in ISE
Comparison with Alternative Spartan-II Variants
XC2S200 Package Options Comparison
| Part Number |
Package |
Pins/Balls |
User I/O |
Best For |
| XC2S200-6FGG878C |
FG878 BGA |
878 |
284 |
Maximum I/O applications |
| XC2S200-6FG456C |
FG456 BGA |
456 |
176 |
Balanced I/O and size |
| XC2S200-6FG256C |
FG256 BGA |
256 |
140 |
Compact designs |
| XC2S200-6PQ208C |
PQ208 PQFP |
208 |
140 |
Easy manual assembly |
Advantages of XC2S200-6FGG878C Over ASIC Solutions
Cost-Effectiveness
- Zero NRE (Non-Recurring Engineering) costs
- No mask charges or tooling fees
- Lower minimum order quantities
- Reduced time-to-market
Flexibility and Reconfigurability
- Field upgradeable designs
- Design iteration without hardware changes
- Multiple configurations possible
- In-system programmability
Risk Mitigation
- Eliminates silicon respins
- Immediate design verification
- Prototype-to-production continuity
- Bug fixes through reprogramming
Design Guidelines and Best Practices
PCB Layout Recommendations
- Power Plane Design: Dedicated 2.5V power plane for VCCINT
- Decoupling Strategy: Place 0.1µF capacitors near each power pin
- Signal Integrity: Controlled impedance for high-speed signals
- Thermal Management: Adequate copper pour for heat dissipation
- BGA Routing: Follow AMD Xilinx PCB design guidelines
Configuration Best Practices
- Use configuration PROMs for standalone operation
- Implement JTAG boundary scan for debugging
- Include configuration pullup/pulldown resistors
- Protect configuration pins from noise
- Consider MultiBoot for failsafe designs
Reliability and Quality Standards
Manufacturing and Compliance
| Standard |
Compliance |
| RoHS Compliance |
Available in Pb-free (G suffix) |
| Quality Grade |
Industrial grade available |
| MTBF |
High reliability for industrial use |
| ESD Protection |
Human Body Model tested |
Ordering Information and Part Number Breakdown
XC2S200-6FGG878C Part Number Decoded
- XC = Xilinx Commercial FPGA
- 2S = Spartan-II family
- 200 = 200K system gates
- -6 = Speed grade (commercial temperature)
- F = Fine-pitch BGA package
- GG = Green (Pb-free) package option
- 878 = 878-ball count
- C = Commercial temperature (0°C to +85°C)
Technical Support and Resources
Available Documentation
- Complete datasheet with electrical specifications
- Application notes for common implementations
- Reference designs and IP cores
- PCB layout guidelines
- Power estimation spreadsheets
Development Resources
- Xilinx Answer Database for troubleshooting
- Community forums and user groups
- Training materials and webinars
- IP core libraries and examples
- Third-party development board options
Competitive Advantages in Modern Applications
Despite being a mature product family, the XC2S200-6FGG878C remains relevant for:
- Legacy system upgrades and replacements
- Cost-sensitive high-volume production
- Educational and training applications
- Prototype development platforms
- Proven designs requiring long-term availability
Frequently Asked Questions
What is the difference between XC2S200-6FGG878C and XC2S200-5FGG878C?
The primary difference is the speed grade: -6 offers faster performance than -5, with lower propagation delays and higher maximum frequencies. The -6 grade is exclusively available in commercial temperature range.
Can the XC2S200-6FGG878C be used for automotive applications?
The commercial temperature range (0°C to +85°C) makes this variant suitable for many automotive applications, though industrial (-40°C to +100°C) variants may be preferred for extreme environments.
What programming cables are compatible?
Standard Xilinx programming cables including Platform Cable USB, Platform Cable USB II, and JTAG-compatible third-party programmers work with this device.
Is this device still in production?
As a mature product, availability may vary. Check with authorized distributors for current stock levels and lead times. Alternative Spartan families (Spartan-3, Spartan-6, Spartan-7) offer migration paths.
Conclusion: Why Choose XC2S200-6FGG878C
The XC2S200-6FGG878C represents an excellent balance of performance, cost, and flexibility for digital design applications. With its extensive 284 I/O pins in the FGG878 package, 200,000 system gates, and proven Spartan-II architecture, this FPGA continues to serve diverse industries from industrial automation to medical instrumentation.
Whether you’re developing new products or maintaining existing designs, the XC2S200-6FGG878C offers the reliability and capability needed for successful implementation. Its programmability advantage over ASICs, combined with comprehensive development tool support, makes it an intelligent choice for both prototyping and production deployment.
For sourcing authentic XC2S200-6FGG878C components and accessing complete technical documentation, connect with authorized AMD Xilinx distributors who can provide quality assurance, competitive pricing, and expert technical support for your FPGA project requirements.
