The XC2S200-6FGG877C is a premium field-programmable gate array (FPGA) from AMD Xilinx’s acclaimed Spartan-II family, engineered to deliver exceptional performance for complex digital designs. This powerful FPGA combines 200,000 system gates with 5,292 logic cells, making it an ideal solution for telecommunications, industrial automation, embedded systems, and high-speed data processing applications.

As part of the Spartan-II series, the XC2S200-6FGG877C represents a cost-effective alternative to traditional ASICs, offering the flexibility of field-programmable logic without the lengthy development cycles and high initial costs associated with custom chip manufacturing.

Key Features and Specifications

Technical Specifications Table

Memory Architecture Comparison

XC2S200-6FGG877C Architecture and Design Features

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG877C incorporates 1,176 configurable logic blocks arranged in a 28×42 matrix, providing extensive logic resources for implementing complex digital circuits. Each CLB contains:

• Look-up tables (LUTs) for combinational logic
• Flip-flops for sequential logic
• Multiplexers for signal routing
• Carry logic for arithmetic operations

This architecture enables efficient implementation of digital signal processing algorithms, state machines, controllers, and custom computing logic.

High-Speed I/O Capabilities

With up to 284 user I/O pins, the XC2S200-6FGG877C FPGA offers extensive connectivity options for interfacing with external devices, sensors, memory modules, and communication peripherals. The I/O blocks support:

• Multiple voltage standards
• Programmable drive strength
• Slew rate control
• Input/output registers for improved timing performance

Dual-Purpose Memory System

The device features a sophisticated dual-memory architecture:

Distributed RAM (75,264 bits): Provides flexible, high-speed memory distributed throughout the logic fabric, ideal for small buffers, lookup tables, and delay elements.

Block RAM (56K bits): Offers dedicated memory blocks optimized for larger data storage requirements, including packet buffers, image processing buffers, and data caching.

Delay-Locked Loops (DLLs)

Four integrated delay-locked loops positioned at each corner of the die provide precise clock management capabilities:

• Clock deskewing and distribution
• Frequency multiplication and division
• Phase shifting for timing optimization
• Reduced clock-to-output delays

Applications of XC2S200-6FGG877C

Telecommunications and Networking

The XC2S200-6FGG877C excels in communication systems where high-speed data processing and protocol implementation are critical. Common applications include:

• Network routers and switches
• Protocol converters (UART, SPI, I2C, Ethernet)
• Digital signal processing for wireless communications
• Baseband processing for 4G/5G systems
• Data encryption and security modules

Industrial Automation and Control

In industrial environments, this Xilinx FPGA provides reliable, real-time control capabilities:

• Programmable logic controllers (PLCs)
• Motor control systems with PWM generation
• Process monitoring and control systems
• Machine vision and quality inspection
• Robotic control interfaces
• Safety-critical system controllers

Embedded Systems Development

The XC2S200-6FGG877C serves as an excellent platform for embedded system prototyping and production:

• Custom peripheral interfaces
• Hardware accelerators for embedded processors
• Real-time data acquisition systems
• Sensor fusion and processing
• Video and image processing pipelines
• Audio DSP applications

Medical and Scientific Instrumentation

Medical device manufacturers leverage this FPGA for advanced diagnostic and monitoring equipment:

• Medical imaging systems (ultrasound, CT, MRI processing)
• Patient monitoring devices
• Laboratory automation equipment
• Diagnostic instrument control
• Biosensor signal processing

Performance Advantages

Speed Grade -6 Benefits

The -6 speed grade designation indicates this device offers optimized performance characteristics for demanding applications:

• Maximum operating frequency of 263 MHz
• Reduced propagation delays through logic elements
• Enhanced setup and hold time margins
• Optimized for high-throughput data processing

Power Efficiency

Operating at 2.5V core voltage with 0.18μm CMOS technology, the XC2S200-6FGG877C delivers:

• Low static power consumption
• Efficient dynamic power scaling
• Reduced thermal management requirements
• Extended operational lifetime in embedded applications

Development and Programming

Design Tools Compatibility

Configuration Options

The XC2S200-6FGG877C supports multiple configuration methods:

• JTAG boundary scan programming
• Master serial configuration
• Slave serial configuration
• SelectMAP parallel configuration
• Configuration from PROM devices

Programming Interface

Standard JTAG interface enables:

• In-system programming (ISP)
• Real-time debugging
• Boundary scan testing
• Partial reconfiguration capabilities

Package Information and PCB Design

Fine-Pitch BGA Package Characteristics

The FGG877C package offers:

• Compact footprint for space-constrained designs
• Superior electrical performance with minimal inductance
• Enhanced thermal dissipation capabilities
• Improved signal integrity for high-speed applications

PCB Design Considerations

Comparison with Other Spartan-II Devices

Spartan-II Family Comparison Table

The XC2S200-6FGG877C represents the flagship device in the Spartan-II family, offering maximum logic density and I/O capabilities for the most demanding applications.

Advantages Over ASIC Solutions

Cost-Effectiveness

• No NRE Costs: Eliminates non-recurring engineering expenses associated with ASIC development
• Volume Flexibility: Economical for both prototyping and medium-volume production
• Reduced Time-to-Market: Programmable logic allows rapid design iterations

Design Flexibility

• Field Upgradability: Update logic functions after deployment without hardware replacement
• Design Reuse: Modify and adapt designs for multiple product variants
• Risk Mitigation: Avoid costly ASIC respins due to design errors

Development Efficiency

• Rapid Prototyping: Test concepts in actual hardware quickly
• In-System Debugging: Real-time verification with ChipScope and JTAG tools
• Iterative Development: Refine designs based on real-world testing

Quality and Reliability

The XC2S200-6FGG877C meets stringent quality standards:

• Extended operational temperature range
• High MTBF (Mean Time Between Failures)
• ESD protection on all I/O pins
• Comprehensive built-in self-test capabilities
• Long-term availability and support

Ordering Information and Availability

Part Number Breakdown

XC2S200-6FGG877C

• XC2S200: Device family and gate count
• -6: Speed grade (commercial temperature)
• FGG877: Package type and pin count
• C: Commercial temperature range (0°C to 85°C)

Package Marking

Devices are clearly marked with:

• Part number
• Date code
• Lot code
• Xilinx/AMD branding
• RoHS compliance information (for lead-free variants)

Technical Support and Resources

Documentation Available

• Complete datasheet with electrical specifications
• User guides and application notes
• Reference designs and IP cores
• PCB layout guidelines
• Thermal management guidelines

Design Resources

• Free ISE WebPACK software for basic designs
• Extensive IP core library
• Online training and tutorials
• Community forums and technical support
• Application engineering assistance

Environmental and Compliance

The XC2S200-6FGG877C complies with:

• RoHS directives (lead-free options available)
• REACH regulations
• Industry-standard quality certifications
• Export control regulations

Conclusion: Why Choose XC2S200-6FGG877C

The XC2S200-6FGG877C Spartan-II FPGA stands as a proven solution for engineers developing sophisticated digital systems. With its combination of 200,000 system gates, 5,292 logic cells, extensive I/O capabilities, and dual-memory architecture, this device addresses the demanding requirements of modern electronic designs.

Whether you’re developing telecommunications equipment, industrial control systems, medical devices, or embedded computing platforms, the XC2S200-6FGG877C delivers the performance, flexibility, and reliability your application demands. Its cost-effective programmable architecture eliminates ASIC development risks while providing the field-upgradeability essential for evolving product requirements.

Key Takeaways

• Industry-Leading Logic Density: 200,000 gates and 1,176 CLBs for complex designs
• Versatile I/O: 284 user I/O pins for extensive connectivity
• Dual-Memory Architecture: Combined distributed and block RAM totaling 131,264 bits
• High Performance: -6 speed grade supporting up to 263 MHz operation
• Cost-Effective: Programmable alternative to expensive ASIC development
• Proven Reliability: Spartan-II family with extensive deployment history
• Comprehensive Support: Complete toolchain and technical resources available

For engineers seeking a robust, high-performance FPGA solution with excellent cost-to-performance ratio, the XC2S200-6FGG877C Spartan-II FPGA represents an outstanding choice backed by AMD Xilinx’s decades of programmable logic expertise.