The XC2S200-6FGG875C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance for cost-sensitive, high-volume applications. This 200,000 system gates FPGA combines advanced programmable logic capabilities with a comprehensive Fine Pitch Ball Grid Array (FBGA) package configuration, making it an ideal choice for engineers seeking a flexible alternative to traditional ASICs.
As part of the industry-leading Xilinx FPGA product line, the XC2S200-6FGG875C provides designers with the programmability and performance needed to accelerate time-to-market while reducing development costs and risks associated with fixed-function silicon.
Key Technical Specifications
Core Architecture Features
The XC2S200-6FGG875C delivers robust functionality through its sophisticated architecture:
| Specification |
Value |
| Logic Cells |
5,292 |
| System Gates |
200,000 (logic and RAM combined) |
| CLB Array Configuration |
28 × 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Distributed RAM Bits |
75,264 |
| Block RAM Capacity |
56 Kbits |
| Speed Grade |
-6 (High Performance) |
| Package Type |
FGG875 (875-ball Fine Pitch BGA) |
| Operating Voltage |
2.5V |
| Process Technology |
0.18μm |
Memory and Storage Capabilities
| Memory Type |
Capacity |
Application |
| Distributed RAM |
75,264 bits |
Fast, flexible memory distributed throughout CLBs |
| Block RAM |
56 Kbits |
Dedicated memory blocks for data buffering |
| Total Memory Resources |
131,328 bits |
Combined distributed and block RAM |
XC2S200-6FGG875C Package Information
FGG875 Package Characteristics
The 875-ball Fine Pitch Ball Grid Array (FBGA) package provides superior thermal performance and signal integrity:
- Total Ball Count: 875 balls
- Package Type: Fine Pitch BGA (FBGA)
- Mounting Technology: Surface mount
- Thermal Performance: Enhanced heat dissipation for reliable operation
- Signal Integrity: Minimized inductance and improved electrical characteristics
Pin Configuration and I/O Capabilities
| I/O Feature |
Specification |
| Maximum Available User I/O |
284 pins (excluding global clock inputs) |
| I/O Standards Supported |
Multiple LVCMOS, LVTTL, SSTL, HSTL standards |
| Global Clock/User Input Pins |
4 dedicated pins |
| Delay-Locked Loops (DLLs) |
4 (one at each corner) |
Performance Characteristics
Speed Grade -6 Performance Benefits
The -6 speed grade designation indicates this is a high-performance variant offering:
- Faster Clock Frequencies: Optimized timing for demanding applications
- Reduced Propagation Delays: Minimized signal delays through logic elements
- Enhanced System Performance: Higher throughput for time-critical operations
- Commercial Temperature Range: 0°C to +85°C operation
Operating Specifications
| Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V (standard dependent) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Maximum Operating Frequency |
263 MHz (application dependent) |
Applications and Use Cases
Industrial and Commercial Applications
The XC2S200-6FGG875C excels in diverse application scenarios:
Digital Signal Processing (DSP)
- Audio and video processing systems
- Real-time signal filtering and transformation
- Software-defined radio implementations
- Image processing algorithms
Communication Systems
- Protocol implementation and conversion
- Data encoding and decoding
- Network packet processing
- High-speed serial interfaces
Control and Automation
- Industrial control systems
- Motor control applications
- Robotics and automation
- Process monitoring and control
Embedded Systems
- System-on-Chip (SoC) prototyping
- Custom peripheral implementation
- Interface bridging solutions
- Embedded processor co-processing
Advantages Over Traditional ASICs
Why Choose XC2S200-6FGG875C FPGA
| Advantage |
Benefit |
| Zero NRE Costs |
No initial fabrication expenses |
| Rapid Development |
Immediate design iteration and testing |
| Field Upgradability |
In-system programming for updates |
| Risk Mitigation |
Eliminate ASIC mask revision costs |
| Shorter Time-to-Market |
Deploy products faster than ASIC alternatives |
| Design Flexibility |
Modify functionality post-production |
Design Resources and Tools
Development Ecosystem
Xilinx provides comprehensive tools for XC2S200-6FGG875C development:
- ISE Design Suite: Complete FPGA design environment
- IMPACT Configuration Tool: Device programming and debugging
- ChipScope Pro: Real-time signal analysis
- CORE Generator: Pre-optimized IP cores
- Timing Analyzer: Comprehensive timing closure tools
Technical Documentation
Engineers can access extensive documentation including:
- Detailed datasheet specifications
- Application notes and design guidelines
- Reference designs and examples
- PCB layout recommendations
- Pin assignment and constraint files
Comparison with Similar Spartan-II Devices
XC2S200 Family Positioning
| Device |
Logic Cells |
System Gates |
CLB Array |
Max I/O |
Block RAM |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
40 Kbits |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
48 Kbits |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
56 Kbits |
The XC2S200-6FGG875C represents the highest capacity device in the standard Spartan-II family, offering maximum logic resources and I/O flexibility.
Reliability and Quality
Manufacturing Standards
- RoHS Compliance: Lead-free package options available
- Quality Certifications: ISO manufacturing standards
- Reliability Testing: Comprehensive qualification procedures
- ESD Protection: Built-in electrostatic discharge protection
- Long-Term Availability: Stable product lifecycle management
Getting Started with XC2S200-6FGG875C
Design Considerations
When implementing designs with the XC2S200-6FGG875C, consider:
- Power Supply Design: Ensure adequate decoupling and regulation for 2.5V core and various I/O voltages
- Clock Distribution: Utilize the four DLL resources for optimal clock management
- I/O Planning: Strategically assign pins based on electrical requirements and PCB routing
- Thermal Management: Implement appropriate cooling for high-utilization designs
- Configuration Strategy: Choose appropriate programming method (JTAG, SPI, parallel)
Configuration Options
| Configuration Mode |
Description |
Use Case |
| JTAG |
Boundary-scan configuration |
Development and debugging |
| Master Serial |
SPI Flash boot |
Production systems |
| Slave Serial |
External controller programming |
System integration |
| SelectMAP |
Parallel configuration |
High-speed programming |
Frequently Asked Questions
What is the main difference between -6 speed grade and other grades?
The -6 speed grade offers the highest performance with faster maximum clock frequencies and reduced propagation delays compared to slower speed grades like -5 or -4.
Can the XC2S200-6FGG875C be reprogrammed multiple times?
Yes, Spartan-II FPGAs support unlimited reprogramming cycles, making them ideal for iterative development and field updates.
What development tools are required?
Xilinx ISE Design Suite is the primary development environment, available as a free WebPACK edition with support for Spartan-II devices.
Is the device 5V tolerant?
The XC2S200-6FGG875C I/O pins can be made 5V tolerant with appropriate series resistors, as detailed in the device datasheet.
Conclusion: Why Choose XC2S200-6FGG875C
The XC2S200-6FGG875C stands as a versatile, high-performance FPGA solution that bridges the gap between programmable logic flexibility and ASIC-level integration. With its substantial 200,000 system gates, 284 I/O pins, and high-performance -6 speed grade, this device delivers the resources and performance needed for demanding digital design applications.
Whether you’re developing communication systems, implementing complex DSP algorithms, or creating custom control solutions, the XC2S200-6FGG875C provides the perfect balance of capacity, performance, and cost-effectiveness. Its proven Spartan-II architecture, combined with comprehensive development tools and extensive documentation, ensures rapid development and reliable deployment.
For engineers seeking a robust FPGA platform that eliminates ASIC development risks while maintaining design flexibility, the XC2S200-6FGG875C represents an optimal choice backed by Xilinx’s industry-leading technology and support.
