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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG870C: High-Performance Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG870C is a versatile Field-Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) acclaimed Spartan-II family, designed to deliver exceptional performance for embedded systems, digital signal processing, and industrial automation applications. This FPGA combines 200,000 system gates with advanced programmable logic architecture, making it an ideal solution for cost-sensitive, high-performance digital designs.

Note: The package designation FGG870C in this part number appears to be a custom or specialized variant. Standard XC2S200 devices are typically available in FGG456 (456-ball), FGG256 (256-ball), or PQG208 (208-pin) packages. Please verify exact package specifications with your supplier.

Key Features and Specifications

Core Technical Specifications

Specification Value
Device Family Spartan-II FPGA
System Gates 200,000 gates
Logic Cells 5,292 cells
CLB Array 28 x 42 (1,176 total CLBs)
Speed Grade -6 (Commercial temperature range exclusive)
Operating Voltage 2.5V core voltage
Process Technology 0.18μm
Maximum Frequency 263 MHz

Memory Resources

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Total RAM Resources 131,328 bits combined

I/O and Connectivity

Feature Specification
Maximum User I/O 284 pins (package dependent)
Global Clock Inputs 4 dedicated pins
Delay-Locked Loops 4 DLLs (one per corner)
I/O Standards Multiple voltage standards supported
I/O Banks Multiple banks for flexible voltage configuration

What is the XC2S200-6FGG870C FPGA?

The XC2S200-6FGG870C represents a powerful programmable logic solution that bridges the gap between simple CPLDs and expensive ASICs. As part of the Xilinx FPGA Spartan-II series, this device offers field-programmable flexibility, allowing designers to implement custom logic functions, update designs without hardware changes, and reduce time-to-market significantly.

Architecture Highlights

The XC2S200 FPGA features a regular, flexible architecture built around Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs). This hierarchical design includes:

  • Configurable Logic Blocks: 1,176 CLBs arranged in a 28×42 array
  • Look-Up Tables (LUTs): Four LUTs per CLB for implementing combinational logic
  • Flip-Flops: Integrated storage elements for sequential logic
  • Multiplexers: Dedicated routing resources for efficient signal distribution
  • Block RAM Columns: Two columns positioned on opposite sides for fast data access

Applications and Use Cases

Industrial Automation and Control

The XC2S200-6FGG870C excels in industrial automation applications where precise control and real-time processing are critical:

  • Motor Control Systems: Implementing PWM generation, encoder interfaces, and feedback control loops
  • PLC Replacement: Custom programmable logic controllers with tailored I/O configurations
  • Process Monitoring: Real-time data acquisition and sensor interfacing
  • Machine Vision: Pre-processing and feature extraction for vision systems

Communication Systems

Application Area Implementation Benefits
Protocol Converters Flexible protocol bridging between different standards
Data Encoding/Decoding Hardware acceleration for communication protocols
Serial Interfaces UART, SPI, I2C, and custom serial communication
Network Routers Packet processing and routing logic

Digital Signal Processing

The XC2S200’s architecture supports various DSP applications:

  • Audio Processing: Real-time audio filtering, mixing, and effects
  • Image Processing: Edge detection, convolution, and transformation algorithms
  • Signal Filtering: FIR/IIR filter implementation with dedicated multipliers
  • Data Compression: Hardware-accelerated compression algorithms

Embedded Systems Development

  • Soft Processor Cores: MicroBlaze or custom processor implementation
  • Co-Processor Applications: Hardware acceleration for specific tasks
  • Peripheral Controllers: Custom interface controllers for specialized hardware
  • System-on-Chip Prototyping: Rapid prototyping for ASIC development

Speed Grade and Temperature Range

Understanding the -6 Speed Grade

The “-6” designation in XC2S200-6FGG870C indicates the fastest speed grade available for commercial temperature range applications:

Speed Grade Maximum Frequency Typical Application
-6 263 MHz High-performance, time-critical designs
-5 Lower frequency Standard performance applications

Important Note: The -6 speed grade is exclusively available for Commercial temperature range (C suffix: 0°C to +85°C).

Temperature Range Options

Range Temperature Suffix Typical Applications
Commercial 0°C to +85°C C Consumer electronics, standard industrial
Industrial -40°C to +100°C I Harsh environments, automotive

Package Information and Pin Configuration

Standard XC2S200 Package Options

While the FGG870C designation requires verification, standard XC2S200 packages include:

Package Type Pin Count Package Size User I/Os Available
PQG208 208-pin PQFP 28mm x 28mm 140 I/Os
FGG256 256-ball FBGA 17mm x 17mm 176 I/Os
FGG456 456-ball FBGA 23mm x 23mm 284 I/Os

Pb-Free and RoHS Compliance

The “G” character in FGG packages indicates Pb-free (lead-free) packaging options, complying with RoHS environmental standards. This makes the XC2S200-6FGG870C suitable for applications requiring environmental compliance.

Programming and Configuration

Configuration Methods

The XC2S200 supports multiple configuration modes:

Configuration Mode Description Use Case
Master Serial FPGA controls configuration timing Standalone applications
Slave Serial External device provides clock Multi-FPGA systems
JTAG Boundary scan configuration Development and debugging
Master/Slave Parallel 8-bit parallel data transfer High-speed configuration

Design Tools and Software Support

Xilinx ISE Design Suite provides comprehensive support for XC2S200 development:

  • Synthesis: XST (Xilinx Synthesis Technology)
  • Implementation: Place and Route optimization
  • Simulation: ModelSim integration
  • Constraints: UCF (User Constraint File) for timing and pin placement
  • Programming: iMPACT for device configuration

Power Consumption and Efficiency

Voltage Requirements

Power Rail Voltage Purpose
VCCINT 2.5V Internal logic core supply
VCCO 1.8V – 3.3V I/O bank supply (configurable)
VCCAUX 2.5V DLL and auxiliary circuits

Power Optimization Features

The XC2S200-6FGG870C implements several power-saving features:

  • Programmable I/O Standards: Select appropriate voltage levels for each bank
  • Selective Clock Gating: Reduce dynamic power in inactive logic
  • Low-Power Configuration: Optimize design for minimal power consumption
  • Sleep Modes: Reduce standby current when logic is inactive

Advantages Over ASICs and Other Solutions

Why Choose XC2S200-6FGG870C?

Feature FPGA Advantage ASIC Comparison
Development Cost Low initial investment High NRE costs ($100K+)
Time to Market Days to weeks Months to years
Design Flexibility Field-upgradeable Fixed functionality
Risk Mitigation Iterative development High commitment risk
Volume Economics Cost-effective for low-medium volumes Economical only at high volumes

Spartan-II vs. Competing FPGAs

The Spartan-II family offers an optimal balance of cost, performance, and features:

  • Cost Optimization: Lower per-unit cost compared to higher-end families
  • Proven Architecture: Mature, well-documented design flow
  • Wide Availability: Established supply chain and multiple distributors
  • Design Reusability: Compatible with migration paths to newer devices

Design Considerations and Best Practices

Clock Management

The XC2S200 includes four Delay-Locked Loops (DLLs) for advanced clock management:

  • Clock De-skewing: Eliminate clock distribution delays
  • Clock Multiplication/Division: Generate multiple frequencies from single source
  • Phase Shifting: Precise phase control for timing-critical applications
  • Clock Mirroring: Synchronize multiple FPGAs on a board

I/O Planning and PCB Layout

Critical Design Guidelines:

  1. Power Decoupling: Place 0.1μF capacitors near each power pin
  2. Ground Planes: Solid ground plane for signal integrity
  3. I/O Banking: Group similar voltage standards in the same bank
  4. Signal Integrity: Terminate high-speed signals appropriately
  5. Thermal Management: Adequate airflow or heatsinking for high-utilization designs

Resource Utilization Tips

Resource Best Practice
LUTs Optimize logic equations for minimal LUT usage
Flip-Flops Register all outputs for improved timing
Block RAM Use for large memory structures instead of distributed RAM
Routing Minimize long-distance nets for better performance

Comparison with Other XC2S200 Variants

XC2S200 Package Comparison

Part Number Package Speed Temp Range Best For
XC2S200-6FGG456C 456-FBGA -6 Commercial Maximum I/O density
XC2S200-5FGG256C 256-FBGA -5 Commercial Balanced size/performance
XC2S200-5PQG208I 208-PQFP -5 Industrial Harsh environments
XC2S200-6FGG870C Custom(?) -6 Commercial Verify with supplier

Development Resources and Support

Getting Started with XC2S200-6FGG870C

Essential Documentation:

  • Spartan-II Family Data Sheet (DS001)
  • Spartan-II User Guide
  • Packaging and Pinout Specifications
  • Application Notes for specific use cases
  • Reference Designs and IP Cores

Evaluation Boards

For prototyping and development, consider:

  • Spartan-II Starter Kits
  • Custom evaluation boards from distributors
  • Development platforms with XC2S200 sockets
  • Compatible JTAG programming cables

Frequently Asked Questions

What is the difference between XC2S200 speed grades?

The speed grade (-5, -6) indicates the maximum operating frequency. The -6 grade offers the highest performance (263 MHz) and is available only for commercial temperature range.

Can I upgrade from XC2S100 to XC2S200?

Yes, within the same package type, Spartan-II devices are designed with pin compatibility for easy migration to higher-density devices.

What programming cable do I need?

The XC2S200 requires a JTAG programming cable compatible with Xilinx Platform Cable USB or similar third-party JTAG programmers.

Is the XC2S200 still in production?

The Spartan-II family is a mature product line. Check with authorized distributors for current availability and recommended alternatives for new designs.

What tools are required for development?

Xilinx ISE Design Suite (older versions support Spartan-II) or compatible third-party tools for synthesis, implementation, and programming.

Where to Buy XC2S200-6FGG870C

Authorized Distributors

Purchase from reputable sources to ensure genuine parts:

  • Authorized Xilinx/AMD distributors
  • Electronic component distributors (Digi-Key, Mouser, Arrow)
  • Regional electronics suppliers
  • Specialty FPGA vendors

Procurement Considerations

  • Verify package marking and part number authenticity
  • Request certificates of conformance
  • Check lead times for specific packages
  • Consider lifecycle status for long-term projects
  • Evaluate alternative newer FPGA families for new designs

Migration Path and Future-Proofing

Moving to Newer FPGA Families

While the XC2S200 remains a capable device, consider these migration options:

Current Device Upgrade Path Advantages
XC2S200 Spartan-3/3E More logic, lower power
XC2S200 Spartan-6 Advanced I/O, better tools
XC2S200 Artix-7 Modern architecture, 7-series benefits

Conclusion

The XC2S200-6FGG870C FPGA represents a powerful, cost-effective solution for a wide range of digital design applications. With 200,000 system gates, 5,292 logic cells, and flexible I/O options, this Spartan-II family member continues to serve industries requiring reliable, programmable logic solutions.

Key Takeaways:

  • Versatile Architecture: Suitable for diverse applications from industrial control to signal processing
  • Cost-Effective: Lower NRE and faster time-to-market compared to ASICs
  • Proven Technology: Mature, well-supported platform with extensive documentation
  • Flexible Configuration: Multiple programming modes and field-upgradeable capability
  • Package Verification: Confirm FGG870C package specifications with your supplier

For more information about Xilinx FPGA products and to explore the full range of Spartan-II devices, consult with authorized distributors or visit AMD’s technical documentation portal.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.