The XC2S200-6FGG868C is a versatile Field-Programmable Gate Array from Xilinx’s proven Spartan-II family, designed to deliver exceptional performance for demanding digital design applications. This commercial-grade programmable logic device combines robust functionality with cost-effectiveness, making it an ideal choice for embedded systems, telecommunications, industrial automation, and consumer electronics projects.
Overview of XC2S200-6FGG868C FPGA
The XC2S200-6FGG868C represents a powerful solution in the mid-range FPGA market segment. Built on advanced 0.18-micron CMOS technology, this device offers designers a superior alternative to traditional mask-programmed ASICs. The XC2S200-6FGG868C eliminates the high initial costs, lengthy development cycles, and inherent risks associated with conventional ASIC design, while providing the flexibility to upgrade designs in the field without hardware replacement.
Key Features and Specifications
The XC2S200-6FGG868C features comprehensive specifications that make it suitable for diverse electronic design requirements across multiple industries.
| Specification |
Value |
| Part Number |
XC2S200-6FGG868C |
| Product Family |
Spartan-II |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Speed Grade |
-6 (fastest commercial grade) |
| Package Type |
FGG868 (Fine-Pitch BGA) |
| Pin Count |
868 pins |
| Operating Voltage |
2.5V |
| Technology |
0.18µm CMOS |
| Temperature Range |
Commercial (0°C to 85°C) |
Technical Architecture of the XC2S200-6FGG868C
The XC2S200-6FGG868C is built on Xilinx’s robust Spartan-II architecture, incorporating advanced features that enable complex digital designs with reliable performance.
Core Logic Resources
The XC2S200-6FGG868C provides 5,292 logic cells organized in a 28 x 42 Configurable Logic Block array. This architecture delivers 200,000 system gates, offering ample resources for implementing sophisticated digital circuits, signal processing algorithms, and custom logic functions. The device’s CLB structure enables efficient implementation of both combinatorial and sequential logic designs.
Memory Architecture
Memory resources in the XC2S200-6FGG868C include both distributed RAM and dedicated block RAM. The 75,264 bits of distributed RAM can be configured flexibly within the CLB structure, while the 56K bits of block RAM provide efficient storage for lookup tables, buffers, and data caching. This dual memory architecture enables designers to optimize their implementations for both performance and resource utilization.
I/O Capabilities
With 284 maximum available user I/O pins, the XC2S200-6FGG868C provides extensive connectivity options for interfacing with external components. The device supports multiple I/O standards, enabling seamless integration with various system architectures. Four dedicated global clock inputs (not included in the 284 user I/O count) provide robust clock distribution throughout the device.
FGG868 Package Specifications
The XC2S200-6FGG868C utilizes the FGG868 Fine-Pitch Ball Grid Array package, offering excellent thermal performance and signal integrity characteristics.
| Package Parameter |
Specification |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Total Pin Count |
868 balls |
| Ball Pitch |
Fine pitch for high-density routing |
| Package Material |
Lead-free (RoHS compliant) |
| Thermal Performance |
Optimized for commercial applications |
| Mounting |
Surface mount technology (SMT) |
The FGG868 package provides robust electrical characteristics and mechanical stability, making the XC2S200-6FGG868C suitable for both prototyping and high-volume production environments.
Performance Characteristics
The XC2S200-6FGG868C features the -6 speed grade, which represents the fastest performance tier available for commercial-temperature Spartan-II devices. This speed grade enables system designs operating at frequencies up to 200 MHz, depending on the specific implementation and routing complexity.
Speed Grade Comparison
| Speed Grade |
Performance Level |
Target Applications |
| -6 |
Fastest |
High-performance systems, telecommunications |
| -5 |
Standard |
General-purpose applications |
| -4 |
Economy |
Cost-sensitive designs |
The XC2S200-6FGG868C’s -6 speed grade makes it particularly well-suited for applications requiring maximum performance within the Spartan-II family.
Application Areas for XC2S200-6FGG868C
The versatility of the XC2S200-6FGG868C makes it suitable for numerous application domains across various industries.
Industrial Automation
In industrial settings, the XC2S200-6FGG868C excels at implementing custom control logic, motor controllers, sensor interfaces, and communication protocols. Its robust commercial-temperature rating ensures reliable operation in factory environments.
Telecommunications Equipment
The device’s high-speed performance and abundant I/O resources make the XC2S200-6FGG868C ideal for telecommunications applications, including protocol converters, interface bridges, and signal processing functions.
Consumer Electronics
Cost-effective and flexible, the XC2S200-6FGG868C serves consumer electronics applications requiring custom logic implementation, including video processing, audio equipment, and gaming peripherals.
Embedded Systems
The XC2S200-6FGG868C provides an excellent platform for embedded system designs, offering the logic resources and I/O capabilities needed for implementing custom peripherals, memory controllers, and system interfaces.
Design Tools and Development Support
Designing with the XC2S200-6FGG868C is supported by comprehensive development tools and resources from Xilinx.
Software Support
| Tool |
Purpose |
Features |
| ISE Design Suite |
FPGA design and implementation |
Synthesis, place and route, timing analysis |
| ChipScope Pro |
On-chip debugging |
Real-time signal observation |
| CORE Generator |
IP core integration |
Pre-verified functional blocks |
Configuration Options
The XC2S200-6FGG868C supports multiple configuration modes, including JTAG boundary scan, serial PROM, and parallel byte-wide configuration. This flexibility enables designers to select the most appropriate configuration method for their application requirements.
Comparison with Related Xilinx FPGA Devices
Understanding how the XC2S200-6FGG868C compares to other Spartan-II family members helps designers select the optimal device for their requirements.
| Device |
Logic Cells |
System Gates |
User I/O |
Block RAM |
| XC2S50 |
1,728 |
50,000 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
284 |
56K |
The XC2S200-6FGG868C represents the highest-capacity member of the Spartan-II family, offering maximum resources for complex designs.
Power Consumption and Thermal Management
The XC2S200-6FGG868C operates efficiently at 2.5V core voltage, providing a balance between performance and power consumption. Actual power consumption varies based on design complexity, clock frequency, and I/O activity.
Power Supply Requirements
| Supply Type |
Voltage |
Purpose |
| VCCINT |
2.5V |
Core logic power |
| VCCO |
1.8V to 3.3V |
I/O bank power (varies by bank) |
| VCCAUX |
2.5V or 3.3V |
Auxiliary circuits |
Proper power supply design and decoupling are essential for reliable XC2S200-6FGG868C operation.
Quality and Reliability
The XC2S200-6FGG868C is manufactured to Xilinx’s stringent quality standards, ensuring reliable operation in commercial applications. The device features built-in boundary scan capability for production testing and in-system debugging.
Environmental Compliance
The XC2S200-6FGG868C with the “G” designation in FGG packages is RoHS-compliant, meeting environmental regulations for lead-free manufacturing. This compliance makes the device suitable for products sold in markets with strict environmental requirements.
Getting Started with XC2S200-6FGG868C
Implementing designs with the XC2S200-6FGG868C follows standard FPGA development workflows. Designers can leverage existing Spartan-II reference designs, evaluation boards, and application notes to accelerate development.
Development Resources
| Resource Type |
Description |
| Datasheets |
Complete electrical and timing specifications |
| Application Notes |
Design guidelines and best practices |
| Reference Designs |
Proven implementation examples |
| Evaluation Boards |
Hardware platforms for prototyping |
| Technical Support |
Access to Xilinx support resources |
Procurement and Availability
The XC2S200-6FGG868C is available through authorized Xilinx distributors worldwide. When ordering, verify the complete part number to ensure you receive the correct speed grade, package, and temperature range for your application.
Part Number Breakdown
XC2S200-6FGG868C breaks down as follows:
- XC2S200: Device type (Spartan-II, 200K gates)
- -6: Speed grade (fastest commercial)
- FGG868: Package type (Fine-Pitch BGA, 868 pins)
- C: Commercial temperature range (0°C to 85°C)
Conclusion
The XC2S200-6FGG868C delivers robust FPGA capabilities for designers requiring substantial logic resources, extensive I/O, and high-performance operation. As the flagship device in the Spartan-II family, the XC2S200-6FGG868C provides proven technology, comprehensive tool support, and cost-effective implementation for a wide range of applications. Whether you’re developing telecommunications equipment, industrial controllers, or embedded systems, the XC2S200-6FGG868C offers the resources and performance needed to bring your designs to reality.
