The XC2S200-6FGG867C is a powerful Field Programmable Gate Array (FPGA) from the legendary Xilinx Spartan-II family, delivering exceptional programmable logic capabilities for demanding digital applications. This cost-effective FPGA solution combines high-performance processing with flexible configuration options, making it the ideal choice for engineers developing complex electronic systems in telecommunications, industrial automation, consumer electronics, and embedded applications.

As part of the second-generation Spartan series, the XC2S200-6FGG867C represents proven ASIC replacement technology that eliminates the high initial costs and lengthy development cycles associated with traditional Application-Specific Integrated Circuits. With 200,000 system gates and 5,292 logic cells, this FPGA provides the processing power and versatility needed for today’s sophisticated digital designs.

Key Technical Specifications of XC2S200-6FGG867C

Core Architecture Features

Memory and Storage Resources

Package and I/O Specifications

Advanced Features and Capabilities

Digital Clock Management (DCM)

The XC2S200-6FGG867C incorporates four Delay-Locked Loop (DLL) circuits strategically positioned at each corner of the die, providing sophisticated clock management capabilities:

• Clock multiplication and division for flexible frequency generation
• Phase shifting for precise timing control
• Clock de-skew for eliminating distribution delays
• Clock mirroring for multi-device board-level synchronization
• Duty cycle correction for 50% duty cycle output

Versatile I/O Standards Support

This FPGA supports 16 high-performance interface standards, ensuring compatibility with a wide range of external devices and systems:

Single-Ended I/O Standards

• LVTTL (Low-Voltage TTL)
• LVCMOS (1.5V, 2.5V, 3.3V)
• PCI 33MHz and 66MHz compliant
• GTL and GTL+ for high-speed backplane
• HSTL (High-Speed Transceiver Logic)
• SSTL (Stub Series Terminated Logic)

Differential I/O Standards

• LVDS (Low-Voltage Differential Signaling)
• LVPECL (Low-Voltage Positive ECL)
• Differential HSTL and SSTL variants

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG867C contains:

• Four logic slices with two 4-input Look-Up Tables (LUTs) each
• Two storage elements per slice (configurable as flip-flops or latches)
• Fast carry logic for high-speed arithmetic operations
• Dedicated multiplexer resources for efficient data routing
• Cascade chain support for implementing wide-input logic functions

Performance Benchmarks and Speed Grades

Speed Grade Comparison

The -6 speed grade of the XC2S200-6FGG867C delivers maximum performance for time-critical applications including:

• High-speed data acquisition systems
• Real-time signal processing
• Fast communication protocols
• Network packet processing
• Video and image processing pipelines

Application Areas for XC2S200-6FGG867C

Telecommunications and Networking

The XC2S200-6FGG867C excels in communication infrastructure applications:

• Baseband processing for wireless communication systems
• Protocol implementation (Ethernet, USB, PCIe)
• Network routers and switches with packet inspection
• Digital modulation/demodulation circuits
• Software-defined radio (SDR) components

Industrial Automation and Control

Robust performance for industrial environments:

• Motor control systems with PWM generation
• PLC (Programmable Logic Controller) implementation
• Industrial protocol bridges (PROFIBUS, Modbus, CANbus)
• Sensor data acquisition and processing
• Real-time control loops for manufacturing equipment

Consumer Electronics

Cost-effective solutions for consumer products:

• Set-top boxes with video processing
• Digital television receivers and decoders
• Home networking equipment
• Gaming peripherals and controllers
• Audio/video processing systems

Medical and Scientific Instrumentation

Reliable operation for critical applications:

• Medical imaging systems (ultrasound, X-ray processing)
• Patient monitoring equipment with multi-channel data acquisition
• Laboratory instruments with precision timing
• Diagnostic equipment with signal analysis
• Biometric identification systems

Development Tools and Software Support

Xilinx ISE Design Suite

The XC2S200-6FGG867C is fully supported by Xilinx’s comprehensive development environment:

Design Entry Options

• HDL synthesis (VHDL, Verilog)
• Schematic capture for visual design entry
• IP core integration from CoreGen library
• State machine editors for control logic

Implementation Flow

• Automatic mapping of logic to CLB resources
• Place and route optimization for timing closure
• Static timing analysis with detailed timing reports
• Power analysis for thermal management
• Bitstream generation with security features

Configuration Methods

Power Consumption and Thermal Management

Power Characteristics

Thermal Design Considerations

The XC2S200-6FGG867C’s FBGA package provides excellent thermal dissipation:

• Junction-to-ambient thermal resistance: θJA = 28°C/W (with adequate airflow)
• Junction-to-case thermal resistance: θJC = 5°C/W
• Maximum junction temperature: 125°C (commercial grade)

Comparison with Alternative FPGA Solutions

XC2S200 vs. Other Spartan-II Family Members

Advantages Over Traditional ASICs

Design Best Practices for XC2S200-6FGG867C

Timing Closure Strategies

1. Clock domain management: Use dedicated global clock networks for primary clocks
2. Register placement: Place registers at I/O boundaries to meet setup/hold requirements
3. Critical path optimization: Identify and optimize timing-critical logic paths
4. Pipelining: Insert pipeline registers to achieve higher clock frequencies
5. Constraint-driven design: Apply comprehensive timing constraints from project start

Resource Utilization Guidelines

Optimal CLB usage:

• Target 70-85% CLB utilization for best results
• Reserve resources for future enhancements
• Balance logic distribution across the die
• Utilize block RAM for data storage (more efficient than distributed RAM)

I/O planning considerations:

• Group related signals by bank to minimize voltage level translators
• Plan differential pairs for high-speed interfaces
• Reserve global clock pins for primary clock inputs
• Consider signal integrity for high-frequency I/O

Power Optimization Techniques

1. Clock gating: Disable clocks to unused logic sections
2. Voltage scaling: Use lowest acceptable I/O voltage standards
3. Logic optimization: Minimize unnecessary toggle activity
4. Resource sharing: Multiplex functions to reduce gate count
5. Sleep modes: Implement low-power standby states when possible

Quality and Reliability

Manufacturing Standards

The XC2S200-6FGG867C is manufactured to stringent quality standards:

• ISO 9001:2015 certified manufacturing facilities
• Automotive-grade variants available for harsh environments
• RoHS compliant lead-free packaging options
• REACH compliant for European markets
• Conflict-free minerals sourcing policy

Reliability Metrics

Ordering Information and Part Number Decoding

Part Number Breakdown: XC2S200-6FGG867C

• XC: Xilinx Commercial product
• 2S: Spartan-II family
• 200: 200K system gates device
• -6: Speed grade (highest performance)
• FGG: Fine-pitch BGA package with lead-free (Green) option
• 867: Pin/ball count
• C: Commercial temperature range (0°C to +70°C)

Available Temperature Grades

Getting Started with XC2S200-6FGG867C Development

Essential Development Resources

To begin your FPGA design journey with the XC2S200-6FGG867C, you’ll need:

1. Development software: Xilinx ISE Design Suite (free WebPACK edition available)
2. Programming hardware: Platform Cable USB or JTAG programmer
3. Reference documentation: Spartan-II User Guide, datasheet, and application notes
4. Design examples: Starter projects and IP cores from Xilinx
5. Simulation tools: ModelSim or ISim for behavioral verification

Recommended Learning Path

Beginner level:

• Study Spartan-II architecture fundamentals
• Complete basic HDL tutorials (VHDL or Verilog)
• Implement simple combinational and sequential circuits
• Practice constraints file creation and timing analysis

Intermediate level:

• Design state machines and control logic
• Integrate block RAM and memory controllers
• Implement communication protocols
• Optimize designs for speed and resource usage

Advanced level:

• Multi-clock domain design techniques
• High-speed I/O implementation
• System-on-chip (SoC) integration
• Advanced timing closure and floor planning

Support and Community Resources

Technical Support Channels

• Official Xilinx documentation portal: Comprehensive datasheets, user guides, and application notes
• Xilinx community forums: Peer-to-peer support from experienced FPGA designers
• Local FAE support: Regional Field Application Engineers for technical assistance
• Training programs: Online courses, webinars, and in-person workshops

Third-Party Resources

• Open-source IP cores: GitHub repositories with reusable FPGA designs
• FPGA development boards: Evaluation platforms with XC2S200 devices
• Tutorial websites: Step-by-step project guides and video tutorials
• Design service providers: Companies offering FPGA consulting and development

Why Choose XC2S200-6FGG867C for Your Next Project?

Compelling Value Proposition

The XC2S200-6FGG867C stands out as an exceptional choice for digital design projects due to:

Proven reliability: Mature technology with extensive field deployment history spanning over two decades

Cost-effectiveness: Optimal price-to-performance ratio for 200K gate applications

Comprehensive toolchain: Industry-standard development tools with extensive documentation

Design flexibility: Unlimited reprogrammability enables iterative development and field upgrades

Risk mitigation: Avoid ASIC development costs and time-to-market delays

Legacy support: Long-term availability ensures multi-year production stability

Broad compatibility: Extensive I/O standard support simplifies system integration

Frequently Asked Questions About XC2S200-6FGG867C

Q: What is the difference between FG and FGG package designations? A: The “FGG” designation indicates a lead-free (Green) package variant that complies with RoHS environmental standards, while “FG” represents standard packaging.

Q: Can the XC2S200-6FGG867C be reconfigured in the field? A: Yes, the FPGA supports unlimited reprogramming cycles through various configuration methods including JTAG, serial, and parallel modes.

Q: What development tools are compatible with this FPGA? A: The primary tool is Xilinx ISE Design Suite. Third-party synthesis tools like Synplify Pro also support Spartan-II devices.

Q: How does the -6 speed grade compare to -5 or -4? A: The -6 speed grade offers the fastest performance with maximum operating frequencies up to 263 MHz, while -5 and -4 grades operate at lower speeds with reduced cost.

Q: What is the typical power consumption? A: Typical system power consumption ranges from 700 mW to 1.85 W depending on clock frequency, toggle rates, and I/O loading.

Q: Is the XC2S200 suitable for automotive applications? A: While commercial-grade devices are not AEC-Q100 qualified, Xilinx offers automotive-grade XA Spartan variants for qualified automotive use.

Conclusion: XC2S200-6FGG867C – Your Gateway to Advanced FPGA Design

The XC2S200-6FGG867C represents a pinnacle of Spartan-II FPGA technology, delivering robust performance, comprehensive features, and exceptional value for digital design applications. Whether you’re developing telecommunications infrastructure, industrial control systems, consumer electronics, or medical instrumentation, this versatile FPGA provides the processing power, flexibility, and reliability your project demands.

With 200,000 system gates, 5,292 logic cells, premium -6 speed grade performance, and extensive I/O capabilities, the XC2S200-6FGG867C eliminates the barriers traditionally associated with custom silicon development. Its proven architecture, backed by mature development tools and extensive documentation, ensures your design success from concept through production.

For comprehensive Xilinx FPGA solutions, technical resources, and expert support, explore the complete ecosystem of development tools, IP cores, and community knowledge that makes working with Spartan-II FPGAs accessible to engineers of all experience levels. Start your next innovative project with the confidence that comes from choosing a trusted, time-tested FPGA platform.

Ready to Begin Your FPGA Journey?

Take the next step in bringing your digital design vision to life with the XC2S200-6FGG867C. Access comprehensive datasheets, order development kits, and connect with technical support resources to transform your ideas into working hardware solutions. The future of programmable logic is here – and it’s more accessible than ever.