The XC2S200-6FGG865C represents a powerful member of the Spartan-II FPGA family, manufactured by Xilinx (now AMD). This advanced field-programmable gate array delivers exceptional performance for cost-sensitive digital designs while maintaining the flexibility and programmability that modern engineers demand. With 200,000 system gates and robust logic resources, the XC2S200-6FGG865C serves as an ideal programmable logic solution for telecommunications, industrial automation, consumer electronics, and embedded systems applications.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
Description |
| Logic Cells |
5,292 |
High-density configurable logic blocks |
| System Gates |
200,000 |
Total equivalent gate count |
| CLB Array |
28 x 42 |
Configurable Logic Block matrix |
| Total CLBs |
1,176 |
Maximum configurable blocks |
| Maximum User I/O |
284 |
Available input/output pins |
| Distributed RAM |
75,264 bits |
Internal memory resources |
| Block RAM |
56K bits |
Dedicated memory blocks |
Performance Characteristics
The XC2S200-6FGG865C operates with a -6 speed grade, indicating optimized performance for commercial temperature applications. This Xilinx FPGA delivers system performance up to 200 MHz, making it suitable for high-speed digital signal processing and real-time control applications.
Package Configuration and Physical Specifications
Fine-Pitch Ball Grid Array (FGG865C) Package
| Package Parameter |
Specification |
| Package Type |
FGG (Fine-Pitch BGA) |
| Total Pin Count |
865 pins |
| Temperature Grade |
Commercial (0°C to +85°C) |
| Core Voltage |
2.5V |
| I/O Voltage |
Multiple standards supported |
| Technology Node |
0.18μm CMOS process |
| Package Designation |
Lead-free (Pb-free) |
The “G” designation in FGG865C indicates RoHS-compliant lead-free packaging, meeting modern environmental standards for commercial electronics manufacturing.
Advanced Features and Capabilities
Programmable Logic Resources
The XC2S200-6FGG865C provides comprehensive programmable resources:
- Configurable Logic Blocks (CLBs): Each CLB contains four logic slices with lookup tables (LUTs), flip-flops, and dedicated arithmetic logic
- Distributed RAM: Flexible memory implementation using CLB resources for small memory buffers
- Block SelectRAM: Dedicated 4K-bit RAM blocks for efficient memory-intensive applications
- Delay-Locked Loops (DLLs): Four DLLs for precise clock management and signal timing
Input/Output Architecture
The device features programmable I/O blocks supporting multiple industry-standard interfaces:
- LVTTL, LVCMOS (3.3V, 2.5V, 1.8V)
- SSTL2, SSTL3
- GTL, GTL+
- PCI compliance at 33 MHz and 66 MHz
- Programmable slew rates and drive strengths
Application Areas for XC2S200-6FGG865C
Industrial and Embedded Systems
This FPGA excels in industrial control applications requiring:
- Motor control and power management
- Sensor interface and data acquisition
- Industrial communication protocols (Modbus, PROFIBUS, CANbus)
- PLC replacement and automation control
Communications and Networking
The XC2S200-6FGG865C supports various communication applications:
- Protocol conversion and bridging
- Network packet processing
- Digital communication baseband processing
- Wireless infrastructure equipment
Consumer Electronics
Ideal for consumer products demanding:
- Video/audio processing and encoding
- Display controllers and graphics acceleration
- Gaming and entertainment systems
- Set-top box implementations
Automotive and Aerospace
Suitable for transportation applications:
- Advanced driver assistance systems (ADAS) development
- In-vehicle infotainment systems
- Avionics testing and prototyping
- Automotive sensor fusion
Design Tools and Development Support
ISE Design Suite Compatibility
The XC2S200-6FGG865C integrates seamlessly with Xilinx ISE (Integrated Software Environment):
- Schematic and HDL design entry
- Synthesis and place-and-route optimization
- Timing analysis and constraint management
- ChipScope Pro for in-circuit debugging
Programming and Configuration Options
Multiple configuration methods support diverse applications:
| Configuration Mode |
Description |
Use Case |
| Master Serial |
FPGA controls PROM |
Stand-alone systems |
| Slave Serial |
External controller |
Multi-device chains |
| JTAG Boundary Scan |
IEEE 1149.1 compliant |
Development and testing |
| SelectMAP |
Parallel configuration |
Fast reconfiguration |
Performance Optimization and Power Management
Clock Distribution Network
The XC2S200-6FGG865C features advanced clocking:
- Four global clock buffers (BUFG)
- Delay-Locked Loops for clock deskew
- Digital Clock Manager functionality
- Low-skew clock distribution trees
Power Consumption Characteristics
Efficient power management enables battery-powered applications:
- Static power: Low standby current
- Dynamic power: Proportional to switching activity
- Core voltage: 2.5V nominal
- I/O voltage: Configurable per bank
Quality and Reliability Standards
Environmental and Manufacturing Compliance
The XC2S200-6FGG865C meets stringent quality standards:
- RoHS compliant (lead-free)
- Moisture Sensitivity Level (MSL) rated
- Commercial temperature range testing
- ESD protection on all pins
- Latch-up immunity
Testing and Quality Assurance
Each device undergoes comprehensive testing:
- 100% functional testing
- Speed binning verification
- Package integrity inspection
- Traceability through lot codes
Comparison with Alternative FPGA Solutions
XC2S200 Package Variants
| Part Number |
Package |
I/O Count |
Primary Application |
| XC2S200-6FG456C |
456-pin BGA |
284 |
High I/O density designs |
| XC2S200-6FG256C |
256-pin BGA |
176 |
Compact board layouts |
| XC2S200-6PQ208C |
208-pin PQFP |
140 |
Through-hole prototyping |
| XC2S200-6FGG865C |
865-pin BGA |
284+ |
Maximum I/O flexibility |
Competitive Advantages
The XC2S200-6FGG865C offers distinct benefits:
- Cost-effective: Lower NRE costs versus ASIC development
- Fast time-to-market: Immediate availability for prototyping
- Field-upgradable: In-system reconfiguration capability
- Risk mitigation: Design changes without silicon respins
- Proven architecture: Battle-tested Spartan-II platform
Technical Documentation and Resources
Essential Design References
Designers working with the XC2S200-6FGG865C should reference:
- Spartan-II Family Complete Datasheet (DS001)
- Spartan-II User Guide (UG002)
- PCB Design Guidelines
- Thermal Management Application Notes
- Power Distribution Network Design Guide
Support and Training Materials
Xilinx provides comprehensive support resources:
- Online technical forums and communities
- Video tutorial series
- Reference designs and IP cores
- Application notes for common implementations
- University program educational materials
Procurement and Supply Chain Information
Ordering and Availability
When procuring the XC2S200-6FGG865C:
- Contact authorized Xilinx/AMD distributors
- Request lead time and minimum order quantities
- Verify package marking and lot traceability
- Confirm authenticity through authorized channels
- Consider long-term availability programs
Pricing Considerations
Pricing varies based on:
- Order volume and quantity breaks
- Distribution channel selection
- Speed grade and temperature range
- Package type and lead-free requirements
- Geographic region and local taxes
Migration Path and Future-Proofing
Upgrade Options Within Spartan Family
For enhanced performance, consider migration to:
- Spartan-3 Series: Increased logic density and performance
- Spartan-6 Family: Advanced DSP blocks and connectivity
- Spartan-7 Series: Modern architecture with reduced power
Design Portability
Code developed for XC2S200-6FGG865C can be ported to:
- Higher-density Spartan-II devices (XC2S300, XC2S400)
- Virtex series for high-performance applications
- Newer Spartan families with minimal modifications
Frequently Asked Questions
What is the difference between -5 and -6 speed grades?
The -6 speed grade offers faster timing performance compared to -5, enabling higher system clock frequencies. However, -6 is exclusively available in commercial temperature range.
Can the XC2S200-6FGG865C replace ASIC designs?
Yes, the Spartan-II family serves as an excellent ASIC alternative, eliminating NRE costs, reducing development time, and providing field-upgrade flexibility that ASICs cannot offer.
What development tools are required?
The XC2S200-6FGG865C requires Xilinx ISE Design Suite (version compatible with Spartan-II), along with optional tools like ChipScope Pro for debugging and ModelSim for simulation.
Is the device still in production?
While Spartan-II is a mature product family, availability should be verified through authorized distributors. For new designs, newer Spartan families may be recommended.
What are common design challenges?
Key considerations include proper power supply decoupling, clock distribution planning, thermal management, and I/O standard selection. Reference design guidelines address these topics comprehensively.
Conclusion: Why Choose XC2S200-6FGG865C
The XC2S200-6FGG865C FPGA delivers an optimal balance of performance, flexibility, and cost-effectiveness for modern digital designs. With substantial logic resources, comprehensive I/O support, and proven reliability, this Spartan-II device enables engineers to implement sophisticated applications while maintaining budget constraints. Whether you’re developing industrial control systems, communication interfaces, or consumer electronics, the XC2S200-6FGG865C provides the programmable logic foundation for successful product deployment.
For designers seeking a reliable, well-documented FPGA solution with strong vendor support and extensive community resources, the XC2S200-6FGG865C remains a compelling choice that balances capability with economy.
