The XC2S200 represents a powerful field-programmable gate array solution from the renowned Spartan-II family, delivering exceptional performance for digital design applications. This cost-effective FPGA combines versatility with robust features, making it ideal for telecommunications, industrial automation, automotive systems, and embedded computing projects.
Important Note: The part number XC2S200-6FGG864C appears to contain a package designation (FGG864) that is not standard for the XC2S200 device. The XC2S200 is typically available in FG256, FG456, and PQ208 packages. Please verify the correct part number with your supplier. This description focuses on the XC2S200 core specifications with -6 speed grade characteristics.
Key Specifications and Technical Features
Core Architecture Specifications
| Specification |
Value |
| Logic Cells |
5,292 Cells |
| System Gates |
200,000 Gates |
| CLB Array Configuration |
28 x 42 (1,176 Total CLBs) |
| Maximum User I/O |
284 Pins |
| Distributed RAM |
75,264 Bits |
| Block RAM |
56K Bits |
| Process Technology |
0.18µm |
| Core Voltage |
2.5V |
Performance Characteristics
| Parameter |
Specification |
| Speed Grade |
-6 (High Performance) |
| Maximum Frequency |
263 MHz |
| Temperature Range |
Commercial (0°C to 85°C) |
| Delay-Locked Loops (DLLs) |
4 DLLs |
Understanding Xilinx FPGA Part Number Nomenclature
The XC2S200 part number breaks down as follows:
- XC = Xilinx Commercial FPGA
- 2S = Spartan-II Family
- 200 = 200K System Gates
- -6 = Speed Grade (Fastest commercial grade)
- Package Code = Determines pin count and form factor
Available Package Options for XC2S200
| Package Type |
Pin Count |
User I/O |
Package Size |
Application |
| FG256/FGG256 |
256-pin BGA |
176 I/O |
17mm x 17mm |
Compact designs |
| FG456/FGG456 |
456-pin BGA |
284 I/O |
23mm x 23mm |
Maximum I/O density |
| PQ208/PQG208 |
208-pin QFP |
140 I/O |
28mm x 28mm |
Easy prototyping |
Note: The “G” suffix (e.g., FGG) indicates lead-free/RoHS-compliant packaging.
Advanced FPGA Architecture Details
Configurable Logic Block (CLB) Architecture
The XC2S200 features a sophisticated CLB design that provides:
- Four logic slices per CLB for maximum resource utilization
- Dedicated carry logic for high-speed arithmetic operations
- Distributed RAM capability within each slice
- Fast interconnect between CLBs for efficient routing
Input/Output Block Capabilities
Modern digital systems require flexible I/O standards, and this Xilinx FPGA delivers comprehensive support:
| I/O Standard |
Voltage Level |
Application |
| LVTTL |
3.3V |
General purpose logic |
| LVCMOS2 |
2.5V |
Low-voltage designs |
| PCI 33/66 |
3.3V |
PCI bus interfaces |
| GTL/GTL+ |
Variable |
High-speed backplanes |
| SSTL2/SSTL3 |
2.5V/3.3V |
Memory interfaces |
Memory Resources and Configuration
The XC2S200 provides dual memory architectures for design flexibility:
Distributed RAM:
- 75,264 bits of synchronous distributed RAM
- Integrated within CLB slices
- Ideal for small buffers, FIFOs, and lookup tables
- Single or dual-port configurations
Block RAM:
- 56K bits organized in dedicated memory blocks
- True dual-port capability
- Configurable width and depth
- Perfect for large data buffers and frame buffers
Performance Optimization and Speed Grades
Speed Grade Comparison
| Speed Grade |
Maximum Frequency |
Propagation Delay |
Target Application |
| -6 |
263 MHz |
Fastest |
High-performance systems |
| -5 |
~220 MHz |
Moderate |
Balanced cost/performance |
The -6 speed grade offers the highest performance for demanding applications requiring maximum clock frequencies and minimal signal propagation delays.
Application Areas and Use Cases
Telecommunications Equipment
The XC2S200 FPGA excels in telecommunications applications:
- Protocol converters and bridges
- Digital signal processing for voice/data
- Network packet processing
- Base station controllers
- Software-defined radio implementations
Industrial Control Systems
Industrial automation benefits from FPGA programmability:
- Motor control and drive systems
- Programmable logic controllers (PLCs)
- Machine vision processing
- Real-time sensor data acquisition
- Custom protocol implementations
Automotive Electronics
Automotive applications leverage FPGA flexibility:
- Advanced driver assistance systems (ADAS)
- Infotainment system controllers
- Electronic control units (ECUs)
- Camera and sensor fusion
- CAN/LIN bus interfaces
Consumer Electronics
Consumer products utilize cost-effective FPGA solutions:
- Digital video processing
- Audio DSP applications
- Gaming console controllers
- Display interfaces (HDMI, DVI, VGA)
- Custom peripheral controllers
Design Development and Tools
Xilinx ISE Design Suite
The XC2S200 is supported by Xilinx ISE (Integrated Software Environment):
- Comprehensive synthesis and implementation
- Timing analysis and constraint management
- Simulation and verification tools
- BitGen configuration file generation
- ChipScope Pro for in-system debugging
Configuration Methods
| Configuration Mode |
Description |
Use Case |
| Master Serial |
FPGA loads from PROM |
Standalone systems |
| Slave Serial |
External controller loads bitstream |
Processor-based systems |
| JTAG |
Boundary scan configuration |
Development and debug |
| Master SelectMAP |
Parallel configuration |
Fast boot requirements |
Power Management and Thermal Considerations
Power Consumption Profile
Typical power consumption varies based on design utilization:
- Static power (quiescent): ~100-200 mW
- Dynamic power: Depends on switching activity
- I/O power: Based on I/O standards and drive strength
Thermal Management Guidelines
| Package |
Theta-JA (°C/W) |
Power Dissipation Capability |
| FG256 |
~32°C/W |
Moderate (convection cooling) |
| FG456 |
~25°C/W |
Higher (better thermal performance) |
| PQ208 |
~35°C/W |
Lower (requires careful thermal design) |
Quality and Reliability Standards
Industry Certifications
The Spartan-II family meets stringent quality standards:
- RoHS compliant (lead-free options available)
- Automotive-grade versions (extended temperature)
- ISO 9001 manufacturing quality systems
- JEDEC standards compliance
- Military and aerospace qualified variants available
Reliability Metrics
| Parameter |
Specification |
| MTBF |
>1,000,000 hours at 55°C |
| ESD Protection |
Human Body Model Class 1C |
| Latch-up Immunity |
>200mA per JESD78 |
FPGA Development Best Practices
Design Entry Recommendations
For optimal XC2S200 implementation:
- Use VHDL or Verilog HDL for design entry
- Implement hierarchical design methodology
- Apply proper timing constraints
- Utilize IP cores for common functions
- Follow Xilinx coding guidelines
Timing Closure Strategies
Achieving timing closure requires:
- Proper clock domain crossing techniques
- Pipeline critical paths
- Utilize register packing and replication
- Apply appropriate placement constraints
- Iterative floorplanning for complex designs
Competitive Advantages of Spartan-II Architecture
Cost-Performance Optimization
The XC2S200 delivers exceptional value:
- Low-cost alternative to ASICs
- No NRE (Non-Recurring Engineering) costs
- Field-upgradeable functionality
- Rapid prototyping capability
- Reduced time-to-market
Design Flexibility Benefits
FPGA programmability enables:
- In-field updates and bug fixes
- Feature additions post-deployment
- Algorithm optimization and tuning
- Hardware/software co-design
- Future-proof product development
Supply Chain and Procurement
Authorized Distribution Channels
Obtain genuine XC2S200 devices through:
- Xilinx authorized distributors
- Major electronics component suppliers
- Regional distribution partners
- Direct from manufacturer for volume orders
Package and Handling
Standard packaging includes:
- Anti-static tray packaging
- Moisture sensitivity level (MSL) rated
- Proper labeling and traceability
- RoHS compliance documentation
- Certificate of conformance available
Migration Path and Family Compatibility
Spartan Family Evolution
| FPGA Family |
Technology Node |
Key Improvements |
| Spartan-II |
0.18µm |
Base architecture |
| Spartan-3 |
90nm |
Lower cost, more resources |
| Spartan-6 |
45nm |
Higher performance, lower power |
| Spartan-7 |
28nm |
Modern I/O standards |
Design Migration Considerations
When upgrading designs:
- Pin compatibility may vary between packages
- I/O standard support differences
- Timing characteristics require re-validation
- Software tool versions must match device family
- IP core compatibility verification needed
Technical Support and Resources
Documentation Available
Comprehensive technical documentation includes:
- Complete datasheet with electrical specifications
- User guides and application notes
- PCB layout guidelines
- Power distribution recommendations
- Configuration memory sizing calculators
Community and Support
Access extensive support resources:
- Xilinx community forums
- Technical support hotline
- FAE (Field Application Engineer) assistance
- Training webinars and tutorials
- Reference designs and example projects
Environmental and Compliance Information
RoHS and Environmental Standards
Lead-free packaging options ensure environmental compliance:
- RoHS Directive 2011/65/EU compliant
- REACH regulation compliance
- Conflict minerals reporting
- Green packaging initiatives
- Recycling and end-of-life programs
Frequently Asked Questions
Q: What is the difference between FG and FGG package codes? A: The FGG designation indicates lead-free (RoHS-compliant) packaging, while FG represents standard packaging with lead-based solder balls.
Q: Can I use ISE or Vivado for XC2S200 design? A: The XC2S200 Spartan-II family is supported by ISE Design Suite. Vivado supports newer device families starting with 7-Series and UltraScale.
Q: What configuration memory size is required? A: The XC2S200 requires approximately 2.8 Mbit of configuration data, typically using a XCF02S or similar configuration PROM.
Q: Is the XC2S200 suitable for high-speed serial interfaces? A: The Spartan-II family does not include dedicated high-speed serial transceivers. For high-speed serial (>1Gbps), consider Spartan-6 or newer families.
Conclusion
The XC2S200 Spartan-II FPGA delivers a compelling combination of performance, flexibility, and value for digital system designers. With 200,000 system gates, robust I/O capabilities, and comprehensive development tool support, this device serves diverse applications from industrial control to telecommunications.
Verification Notice: Please confirm the exact part number and package configuration (FGG864C designation) with your authorized distributor, as standard XC2S200 packages include FG256, FG456, and PQ208 options.
For authentic Xilinx components and technical support, consult authorized distributors and leverage the comprehensive development ecosystem supporting the Spartan-II FPGA family.
