Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG862C: High-Performance Spartan-II FPGA for Advanced Digital Design Applications

Product Details

The XC2S200-6FGG862C is a professional-grade Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family, offering exceptional programmable logic capabilities for complex digital circuit implementation. This powerful FPGA delivers 200,000 system gates and 5,292 logic cells, making it an ideal solution for engineers and designers seeking cost-effective, high-performance programmable logic devices.

As part of the Spartan-II architecture, the XC2S200-6FGG862C combines advanced features with proven reliability, enabling rapid prototyping, production-ready designs, and field-upgradeable systems across telecommunications, industrial automation, medical devices, and consumer electronics sectors.

Technical Specifications and Features

Core Architecture Specifications

Parameter Specification
Device Family Xilinx Spartan-II
System Gates 200,000 gates
Logic Cells 5,292 cells
CLB Array Configuration 28 x 42 (1,176 total CLBs)
Maximum User I/O 284 pins
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
Speed Grade -6 (high performance)
Operating Voltage 2.5V core voltage
Process Technology 0.18μm CMOS
Operating Frequency Up to 263 MHz

Package and Physical Characteristics

Feature Details
Package Type Fine-pitch Ball Grid Array (FBGA)
Total Pin Count 862 pins (FGG862 package)
Temperature Range Commercial (0°C to +85°C)
RoHS Compliance Available in lead-free options
Package Designation FGG862C

Key Features of XC2S200-6FGG862C FPGA

Advanced Logic Capabilities

The XC2S200-6FGG862C FPGA incorporates sophisticated configurable logic blocks (CLBs) that serve as the foundation for digital circuit implementation. Each CLB contains:

  • Look-Up Tables (LUTs) for combinatorial logic implementation
  • Flip-flops for sequential logic and state machine design
  • Multiplexers for signal routing flexibility
  • Carry chains for efficient arithmetic operations

Memory Resources

This Spartan-II FPGA provides dual memory architecture:

  1. Distributed RAM: 75,264 bits spread throughout the CLB array for low-latency data storage
  2. Block RAM: 56K bits organized in dedicated memory blocks for efficient buffer and FIFO implementations

High-Speed I/O Capabilities

With 284 available user I/O pins, the XC2S200-6FGG862C supports:

  • Multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+)
  • Programmable slew rate control
  • Tri-state buffers for bus applications
  • Individual pin configuration flexibility

Clock Management System

The device features four Delay-Locked Loops (DLLs) strategically positioned at die corners, providing:

  • Clock deskewing and phase shifting
  • Frequency synthesis and division
  • Low-jitter clock distribution
  • Multiple global clock networks

Applications and Use Cases

Telecommunications and Networking

The XC2S200-6FGG862C excels in communication infrastructure:

  • Protocol implementation (Ethernet, USB, serial interfaces)
  • Data packet processing and routing
  • Signal conditioning and filtering
  • Baseband processing for wireless systems

Industrial Automation and Control

Manufacturers rely on this Xilinx FPGA for:

  • Motor control systems with precise PWM generation
  • PLC (Programmable Logic Controller) implementations
  • Sensor interface and data acquisition
  • Real-time process monitoring and control

Medical Equipment Design

Medical device engineers utilize the XC2S200 for:

  • Diagnostic imaging systems
  • Patient monitoring devices
  • Laboratory instrumentation
  • Portable medical electronics

Consumer Electronics

The FPGA supports various consumer applications:

  • Digital video processing and display controllers
  • Audio DSP implementations
  • Gaming peripheral controllers
  • Smart home automation systems

Performance Characteristics

Speed Grade Analysis

Speed Grade Maximum Frequency Application Suitability
-6 Up to 263 MHz High-speed data processing, communications
-5 Up to 200 MHz General-purpose applications

The -6 speed grade variant offers the highest performance within the XC2S200 family, making it suitable for demanding, time-critical applications requiring maximum throughput.

Power Consumption Profile

Operating Mode Typical Current Conditions
Active (Full Utilization) Varies by design Depends on toggle rate and resource usage
Standby Low μA range Configuration retained, minimal activity

Comparison with Alternative FPGAs

XC2S200 Series Variants

Part Number Package Pin Count Speed Grade Key Difference
XC2S200-6FGG862C FBGA 862 -6 Highest I/O count, maximum speed
XC2S200-6FG456C FBGA 456 -6 Mid-range I/O configuration
XC2S200-6FG256C FBGA 256 -6 Compact package option
XC2S200-5PQ208C PQFP 208 -5 Lower cost, moderate performance

Upgrade Path Considerations

Device Logic Cells System Gates When to Choose
XC2S100 2,700 100,000 Less complex designs
XC2S200 5,292 200,000 Balanced performance/cost
XC2S300 7,168 300,000 Resource-intensive applications

Design and Development Tools

Software Requirements

To work with the XC2S200-6FGG862C, developers need:

  • Xilinx ISE Design Suite (legacy tool for Spartan-II support)
  • Vivado Design Suite (newer projects may require migration)
  • FPGA programming cables (Platform Cable USB, JTAG programmers)

Programming and Configuration

The FPGA supports multiple configuration methods:

  1. JTAG configuration for development and debugging
  2. Master Serial mode using external PROM
  3. Slave Serial mode from microcontroller
  4. Boundary Scan for testing and verification

Advantages Over ASIC Solutions

Cost-Effective Development

Unlike Application-Specific Integrated Circuits (ASICs), the XC2S200-6FGG862C offers:

  • Zero NRE costs (No mask charges or fabrication fees)
  • Rapid prototyping capabilities
  • Shorter time-to-market cycles
  • Lower financial risk for low to medium volume production

Design Flexibility

The programmable nature provides:

  • Field upgradability without hardware replacement
  • Bug fixes through firmware updates
  • Feature additions post-deployment
  • Design iterations without new silicon

Risk Mitigation

FPGA implementation reduces project risks:

  • No commitment to fixed silicon design
  • Ability to adapt to changing specifications
  • Protection against component obsolescence through design portability

Ordering Information and Package Details

Part Number Breakdown

XC2S200-6FGG862C decoding:

  • XC2S200: Device type (Spartan-II, 200K gates)
  • 6: Speed grade (highest performance)
  • FGG: Package type (Fine-pitch BGA, lead-free option)
  • 862: Pin count
  • C: Commercial temperature range (0°C to +85°C)

Availability and Procurement

The XC2S200-6FGG862C is available through:

  • Authorized Xilinx/AMD distributors
  • Electronic component suppliers
  • Surplus and excess inventory specialists

Note: As a mature Spartan-II family member, availability may vary. Consider consulting distributors for current stock levels and lead times.

Technical Support and Resources

Documentation Available

Engineers can access comprehensive resources:

  • Complete datasheet with electrical specifications
  • Reference manual detailing architecture
  • Application notes for common design patterns
  • PCB layout guidelines for BGA packages

Design Considerations

When implementing the XC2S200-6FGG862C:

  • Ensure proper power supply decoupling (multiple bypass capacitors)
  • Follow controlled impedance routing for high-speed signals
  • Implement adequate thermal management for high-utilization designs
  • Use appropriate BGA footprint recommendations from Xilinx

Frequently Asked Questions

What is the difference between XC2S200-6 and XC2S200-5?

The number indicates the speed grade, with -6 being faster than -5. The -6 variant supports higher maximum frequencies (up to 263 MHz) and shorter propagation delays, making it suitable for high-performance applications.

Is the XC2S200 still in production?

The Spartan-II family is a mature product line. While some variants may have limited production, devices are often available through distribution channels. For new designs, consider evaluating newer Spartan-6, Spartan-7, or Artix-7 families.

Can I use modern Vivado tools with XC2S200?

The XC2S200 Spartan-II family is primarily supported by the legacy ISE Design Suite. Vivado focuses on newer architectures (7-series and beyond). ISE WebPack provides free licensing for Spartan-II development.

What development boards support XC2S200?

While dedicated XC2S200 development boards are less common today, custom PCB designs or older evaluation platforms may be available through specialty electronics suppliers or second-hand markets.

Conclusion: Why Choose XC2S200-6FGG862C

The XC2S200-6FGG862C represents a proven, reliable FPGA solution that balances performance, flexibility, and cost-effectiveness. With 200,000 system gates, 5,292 logic cells, and 284 I/O pins, this Spartan-II device delivers the resources needed for diverse digital design applications.

Whether you’re developing telecommunications equipment, industrial control systems, medical instrumentation, or consumer electronics, the XC2S200-6FGG862C provides the programmable logic foundation for success. Its field-upgradable nature, combined with mature development tools and extensive documentation, makes it an excellent choice for both prototyping and production deployments.

For engineers seeking dependable FPGA technology with established design methodologies and comprehensive ecosystem support, the XC2S200-6FGG862C continues to serve as a capable solution in the programmable logic landscape.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.