The XC2S200-6FGG861C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance and reliability for demanding industrial, commercial, and embedded system applications. This versatile programmable logic device combines 200,000 system gates with advanced features, making it an ideal solution for engineers seeking cost-effective digital signal processing capabilities.
Overview of XC2S200-6FGG861C FPGA
The XC2S200-6FGG861C represents a proven solution in the Spartan-II FPGA lineup, offering robust functionality for complex digital designs. Built on 0.18μm technology, this device operates at 2.5V core voltage, providing an optimal balance between performance and power efficiency. The -6 speed grade designation ensures fast signal propagation delays suitable for time-critical applications.
Key Features of XC2S200-6FGG861C
- 200,000 System Gates: Substantial logic capacity for complex digital implementations
- 5,292 Logic Cells: Flexible programmable resources for diverse design requirements
- 284 Maximum User I/O: Extensive connectivity options for system integration
- 75,264 Distributed RAM Bits: Efficient on-chip memory for data buffering
- 56K Block RAM: Dedicated memory blocks for high-speed data storage
- FGG861 Package: Fine-pitch ball grid array for optimal space utilization
- Speed Grade -6: High-performance operation for demanding applications
- 2.5V Core Voltage: Industry-standard power supply requirement
Technical Specifications Table
| Specification |
Value |
| Part Number |
XC2S200-6FGG861C |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Speed Grade |
-6 |
| Core Voltage |
2.5V |
| Package Type |
FGG861 (Fine-pitch BGA) |
| Technology Node |
0.18μm |
| Operating Temp (Commercial) |
0°C to +85°C |
Architecture and Design Capabilities
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG861C features a robust 28×42 CLB array, totaling 1,176 configurable logic blocks. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers, enabling flexible implementation of complex combinational and sequential logic circuits. This architecture allows engineers to create custom digital designs tailored to specific application requirements.
Memory Architecture
The device incorporates two types of on-chip memory resources:
| Memory Type |
Capacity |
Features |
| Distributed RAM |
75,264 bits |
Fast, embedded within CLBs for small memory needs |
| Block RAM |
56 Kbits |
Dedicated synchronous memory for buffering and data storage |
| Dual-Port RAM |
Available |
Simultaneous read/write operations |
Input/Output Capabilities
With 284 maximum user I/O pins (excluding four global clock inputs), the XC2S200-6FGG861C supports multiple I/O standards including:
- LVTTL (Low-Voltage TTL)
- LVCMOS (Low-Voltage CMOS) at various voltage levels
- PCI33_3 and PCI66_3 for PCI bus applications
- Differential I/O standards with VREF support
- Multivolt I/O interface for mixed-voltage system integration
Performance Characteristics
Speed and Timing
The -6 speed grade of the XC2S200-6FGG861C delivers:
- Maximum operating frequency up to 263 MHz for internal logic
- Low propagation delays for time-critical signal paths
- Optimized routing resources for high-speed data transfer
- Four Delay-Locked Loops (DLLs) for precise clock management and distribution
Power Efficiency
Operating on a 2.5V core supply, the device offers:
- Low static power consumption compared to earlier FPGA generations
- Efficient dynamic power scaling based on design utilization
- Multivolt I/O support for interfacing with 3.3V, 2.5V, and lower voltage systems
Application Areas
Communications and Networking
The XC2S200-6FGG861C excels in communication systems:
- Protocol implementation for Ethernet, USB, and serial interfaces
- Data packet processing and routing
- Signal modulation and demodulation
- Network interface controllers
- Telecommunication equipment
Industrial Automation and Control
Ideal for industrial applications including:
- Motor control systems
- Process automation and monitoring
- Programmable logic controllers (PLCs)
- Industrial robotics
- Factory automation equipment
Digital Signal Processing (DSP)
The FPGA’s architecture supports:
- Audio and video signal processing
- Digital filtering and frequency analysis
- Image processing and computer vision
- Software-defined radio (SDR)
- Real-time data acquisition systems
Embedded Systems
Perfect for embedded applications such as:
- Automotive electronics and driver assistance systems
- Medical diagnostic equipment and patient monitoring
- Consumer electronics and smart devices
- Aerospace and defense systems
- Security and surveillance equipment
Package Information
FGG861 Ball Grid Array Package
| Package Feature |
Specification |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Total Balls |
861 |
| Ball Pitch |
1.0mm typical |
| Package Advantages |
High I/O density, excellent thermal performance, reliable connections |
The FGG861 package provides:
- Compact footprint for space-constrained designs
- Excellent signal integrity with short interconnect paths
- Superior thermal dissipation capabilities
- Industry-standard BGA mounting for automated assembly
- Moisture Sensitivity Level (MSL) rating for proper handling
Development Tools and Software Support
Design Software
The XC2S200-6FGG861C is fully supported by Xilinx development tools:
- ISE Design Suite: Complete design entry, synthesis, and implementation
- VHDL and Verilog HDL: Industry-standard hardware description languages
- Schematic Entry: Visual design capture for simple circuits
- Timing Analysis: Comprehensive static timing verification
- ChipScope Pro: In-circuit debugging and signal monitoring
Configuration Options
Multiple configuration methods available:
- JTAG boundary-scan interface for programming and testing
- Master Serial configuration from external PROM
- Slave Serial configuration from external controller
- SelectMAP parallel configuration for fast programming
Comparison Table: XC2S200 Package Options
| Package |
User I/O |
Pin Count |
Package Size |
Application Focus |
| PQ208 |
140 |
208 |
Plastic Quad Flat Pack |
Cost-sensitive designs |
| FG256 |
176 |
256 |
Fine-pitch BGA |
Balanced I/O and size |
| FG456 |
284 |
456 |
Fine-pitch BGA |
High I/O requirements |
| FGG861 |
284 |
861 |
Fine-pitch BGA |
Maximum connectivity |
Advantages of XC2S200-6FGG861C
Design Flexibility
- Reprogrammable Architecture: Field upgrades without hardware replacement
- In-System Programmability: Update designs without removing the device
- Rapid Prototyping: Quick design iterations and testing
- ASIC Alternative: Avoid costly NRE charges and long development cycles
Performance Benefits
- High logic density for complex designs
- Fast clock speeds for time-critical applications
- Abundant I/O resources for system connectivity
- Integrated memory reduces external component count
Cost Effectiveness
- Competitive pricing in the mid-range FPGA segment
- Volume discounts available for production quantities
- Lower total cost of ownership compared to ASIC development
- Proven reliability reduces field failure rates
Quality and Compliance
Environmental Standards
The XC2S200-6FGG861C meets stringent regulatory requirements:
- RoHS compliant (lead-free option available with “G” suffix)
- REACH compliance for restricted substances
- Automotive-grade versions available for demanding environments
- Industrial temperature range options (-40°C to +100°C)
Reliability Features
- Comprehensive built-in self-test capabilities
- ESD protection on all I/O pins
- Latch-up resistant design
- Extended product lifecycle support
Getting Started with XC2S200-6FGG861C
Design Resources
- Datasheets: Complete electrical and timing specifications
- Application Notes: Design guidelines and best practices
- Reference Designs: Proven design templates for common applications
- User Forums: Community support and knowledge sharing
- Technical Support: Direct assistance from Xilinx experts
Evaluation and Development
Development boards and evaluation kits facilitate rapid prototyping:
- Reference boards with XC2S200 FPGA
- Essential peripherals and interfaces
- Configuration and debugging connectors
- Comprehensive documentation and example designs
The XC2S200-6FGG861C integrates seamlessly into the broader Xilinx ecosystem, providing access to extensive IP cores, development tools, and technical resources. Whether you’re developing communication protocols, control systems, or signal processing applications, this FPGA offers the flexibility and performance required for successful product development.
Ordering Information and Availability
Part Number Nomenclature
XC2S200-6FGG861C breakdown:
- XC2S200: Device family and gate count
- -6: Speed grade (commercial temperature range)
- FGG861: Package type and pin count
- C: Commercial temperature range (0°C to +85°C)
Alternative Grades
| Suffix |
Temperature Range |
Application |
| C |
0°C to +85°C |
Commercial |
| I |
-40°C to +100°C |
Industrial |
Lead-Free Options
Pb-free packages include special “G” designation (e.g., XC2S200-6FGG861CG) for RoHS compliance.
Frequently Asked Questions
What makes the XC2S200-6FGG861C suitable for my project?
The XC2S200-6FGG861C offers 200,000 system gates, making it ideal for medium-complexity designs requiring substantial logic resources and high I/O count. Its proven Spartan-II architecture ensures reliability while maintaining cost effectiveness.
How does the speed grade affect performance?
The -6 speed grade provides fast propagation delays and high maximum operating frequencies, suitable for most time-critical applications. It represents the fastest commercial-grade option in the Spartan-II family.
What development tools are required?
Xilinx ISE Design Suite provides comprehensive design entry, synthesis, implementation, and verification capabilities. The software supports both VHDL and Verilog hardware description languages.
Can the FPGA be reprogrammed after deployment?
Yes, the XC2S200-6FGG861C supports in-system programming through JTAG and other configuration interfaces, allowing field upgrades without hardware replacement.
What is the typical lead time for ordering?
Lead times vary based on market conditions and order quantity. Contact authorized distributors for current availability and delivery schedules.
Conclusion
The XC2S200-6FGG861C Spartan-II FPGA delivers exceptional value for engineers requiring high-performance programmable logic solutions. With 200,000 system gates, 284 user I/O pins, comprehensive memory resources, and robust development tool support, this device addresses a wide range of digital design challenges across industrial, commercial, and embedded applications.
Its proven architecture, competitive pricing, and extensive ecosystem support make the XC2S200-6FGG861C an excellent choice for both prototyping and production deployments. Whether you’re developing communication equipment, control systems, or signal processing applications, this FPGA provides the flexibility, performance, and reliability required for successful product development.
For detailed technical specifications, pricing information, and design support resources, consult authorized Xilinx distributors or visit the official Xilinx documentation portal.
