The XC2S200-6FGG860C is a powerful field programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This advanced programmable logic device delivers exceptional performance with 200,000 system gates and 5,292 configurable logic cells, making it an ideal solution for complex digital designs across telecommunications, industrial automation, and embedded systems applications.
As part of the Spartan-II series, the XC2S200-6FGG860C combines cost-effectiveness with robust functionality, offering engineers a reliable alternative to traditional ASICs with the added benefit of reconfigurability and faster time-to-market.
Key Technical Specifications
Core Performance Features
| Specification |
Value |
Description |
| System Gates |
200,000 |
Maximum logic capacity for complex designs |
| Logic Cells |
5,292 |
Configurable logic blocks for digital circuit implementation |
| Block RAM |
57,344 bits |
Embedded memory for high-speed data buffering |
| Operating Voltage |
2.5V |
Low-power core voltage for efficient operation |
| Speed Grade |
-6 |
Enhanced performance rating for high-speed applications |
| Package Type |
FGG860 |
860-pin Fine-pitch Ball Grid Array |
| Technology Node |
0.18µm |
Advanced CMOS fabrication process |
| Maximum Frequency |
263 MHz |
High-speed clock operation capability |
Package and Pin Configuration
| Package Parameter |
Specification |
| Total Pins |
860 pins |
| Package Type |
FBGA (Fine-pitch Ball Grid Array) |
| Form Factor |
FGG860 |
| User I/O Pins |
Up to 556 (package dependent) |
| Terminal Type |
Ball Grid Array contacts |
| Mounting Type |
Surface Mount Technology (SMT) |
XC2S200-6FGG860C Architecture and Design
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG860C features 1,176 configurable logic blocks organized in a grid-like architecture. Each CLB contains:
- Look-Up Tables (LUTs) for flexible Boolean function implementation
- Flip-flops for sequential logic and state machine designs
- Multiplexers for data routing and selection
- Carry logic for efficient arithmetic operations
This architecture enables designers to implement complex digital circuits with optimal resource utilization and high performance.
Embedded Block RAM Resources
The FPGA incorporates 57,344 bits of distributed block RAM modules, providing:
- High-speed data storage capabilities
- Efficient buffering for data-intensive applications
- Temporary storage for computational operations
- Support for FIFO and dual-port memory configurations
I/O Banking and Interface Capabilities
The XC2S200-6FGG860C offers extensive I/O capabilities through its 860-pin FGG package:
- Multi-voltage I/O support (1.5V to 3.3V)
- Multiple I/O standards including LVTTL, LVCMOS, PCI, and differential signaling
- Programmable drive strength for impedance matching
- Advanced I/O banking for flexible interface design
Applications and Use Cases
Industrial Automation and Control
The XC2S200-6FGG860C excels in industrial environments:
- Motor control systems with precise PWM generation
- Process automation for manufacturing lines
- PLC replacement with reconfigurable logic
- Sensor interface and data acquisition systems
- Industrial communication protocols (PROFIBUS, MODBUS, EtherCAT)
Telecommunications Infrastructure
Ideal for communication systems requiring:
- High-speed data processing up to 263 MHz
- Protocol implementation (Ethernet, Serial, CAN, USB)
- Network routing and packet processing
- Signal processing for baseband operations
- Wireless infrastructure components
Medical Device Applications
The FPGA supports critical medical electronics:
- Imaging systems for diagnostic equipment
- Patient monitoring devices with real-time processing
- Diagnostic instrumentation requiring high reliability
- Biometric identification systems
- Laboratory analysis equipment
Automotive Electronics
Automotive-grade applications include:
- Engine control units (ECU) prototyping
- Advanced driver assistance systems (ADAS)
- Infotainment system development
- In-vehicle networking (CAN, LIN, FlexRay)
- Sensor fusion for autonomous features
Security and Surveillance Systems
Security applications benefit from:
- Video processing for surveillance cameras
- Access control systems with biometric authentication
- Encryption engines for data security
- Network security appliances with hardware acceleration
- High-integrity data processing for critical systems
XC2S200-6FGG860C vs Alternative FPGA Solutions
Competitive Comparison Table
| Feature |
XC2S200-6FGG860C |
XC2S150-6FG256C |
XC2S300-6FG456C |
| System Gates |
200,000 |
150,000 |
300,000 |
| Logic Cells |
5,292 |
3,888 |
7,168 |
| Block RAM (bits) |
57,344 |
43,008 |
73,728 |
| Package Pins |
860 |
256 |
456 |
| User I/Os |
Up to 556 |
176 |
333 |
| Best For |
High I/O density applications |
Space-constrained designs |
Maximum logic capacity |
Advantages Over Traditional ASICs
- No NRE costs – eliminate expensive mask sets
- Rapid prototyping – test designs in hours, not months
- Field upgradability – update functionality without hardware changes
- Lower risk – iterate designs before production
- Flexible IP integration – incorporate soft-core processors and peripherals
Design and Development Tools
Xilinx ISE Design Suite Support
The XC2S200-6FGG860C is fully supported by:
- ISE WebPACK – free development environment
- ISE Foundation – comprehensive design tools
- ChipScope Pro – integrated logic analyzer
- XST synthesis – optimized logic synthesis
- Timing Analyzer – detailed timing verification
Programming and Configuration
Multiple configuration methods available:
- JTAG boundary scan for development and debugging
- Master Serial mode using SPI flash
- Slave Serial mode for system-controlled configuration
- SelectMAP mode for high-speed parallel loading
- Bitstream encryption for IP protection
Power Management and Thermal Characteristics
Electrical Specifications
| Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Supply Voltage (VCCO) |
1.5V to 3.3V |
| Auxiliary Voltage (VCCAUX) |
2.5V or 3.3V |
| Typical Power Consumption |
Application dependent |
| Junction Temperature Range |
0°C to +85°C (Commercial) |
Thermal Management Considerations
- Advanced package design for efficient heat dissipation
- Ball grid array contact improves thermal conductivity
- Power analysis tools available in ISE for estimation
- Heat sink compatibility with standard BGA packages
Quality and Reliability Standards
Manufacturing and Testing
- ISO 9001 certified manufacturing facilities
- Advanced 0.18µm CMOS fabrication process
- 100% functional testing at production
- Burn-in testing available for high-reliability applications
- ESD protection on all pins
Industry Certifications
The Spartan-II family meets stringent industry standards:
- RoHS compliant versions available
- Suitable for industrial temperature ranges
- Quality management systems compliance
- Traceability for critical applications
Ordering Information and Part Number Decoding
XC2S200-6FGG860C Part Number Breakdown
XC2S200-6FGG860C nomenclature:
- XC = Xilinx Commercial temperature range
- 2S = Spartan-II family designation
- 200 = 200,000 system gates
- -6 = Speed grade (performance level)
- FGG = Fine-pitch Ball Grid Array package type
- 860 = 860 pins total
- C = Commercial temperature grade (0°C to +85°C)
PCB Design Guidelines for XC2S200-6FGG860C
Layout Recommendations
Critical design considerations for the 860-pin FBGA:
- Multi-layer PCB required – minimum 6 layers recommended
- Dedicated power planes for VCCINT, VCCO, and VCCAUX
- Ground plane integrity – uninterrupted reference plane
- Via-in-pad technology – may be required for dense BGA routing
- Impedance control – match I/O transmission lines appropriately
- Decoupling capacitors – place close to BGA power pins
Signal Integrity Considerations
- High-speed signal routing – maintain controlled impedance
- Differential pair spacing – follow datasheet guidelines
- Clock distribution – use dedicated routing with minimal skew
- EMI mitigation – proper grounding and shielding techniques
Migration Path and Pin Compatibility
Family Compatibility
The XC2S200-6FGG860C offers migration flexibility:
- Footprint compatible with other Spartan-II devices in FGG860 package
- Software compatible with Spartan-II development tools
- Upgrade path to larger devices (XC2S300, XC2S400) in same package
- Pin-compatible alternatives for cost or performance optimization
Support and Resources
Documentation and Technical Support
Comprehensive resources available:
- Complete datasheets and user guides
- Application notes for common implementations
- Reference designs and IP cores
- Online technical forums and communities
- Direct support from Xilinx FPGA specialists
Development Ecosystem
- Pre-verified IP cores for common functions
- Third-party tool support for specialized applications
- Training materials and webinars
- Design services partners for custom implementations
Why Choose XC2S200-6FGG860C for Your Next Project
Cost-Effective Solution
- Competitive pricing for 200K gate density
- Low development costs compared to ASIC
- Reduced time-to-market accelerates revenue
- Multiple sourcing through authorized distributors
Proven Reliability
- Mature technology with extensive field deployment
- Long product lifecycle ensures availability
- Stable supply chain through AMD Xilinx
- Extensive qualification testing for critical applications
Design Flexibility
- Reconfigurable architecture supports design iterations
- Partial reconfiguration capability in some configurations
- Mixed-signal interfaces through flexible I/O
- Integration with soft processors (MicroBlaze, PicoBlaze)
Conclusion: Maximizing Your FPGA Design Success
The XC2S200-6FGG860C represents an excellent balance of logic capacity, I/O density, and cost-effectiveness for mid-range FPGA applications. With 200,000 system gates, 5,292 logic cells, and 860 pins in a fine-pitch BGA package, this Spartan-II device delivers the performance and flexibility required for demanding industrial, telecommunications, and embedded applications.
Whether you’re replacing legacy ASICs, prototyping new designs, or implementing complex digital systems, the XC2S200-6FGG860C provides the resources and reliability needed for successful product development. Its extensive I/O capabilities, combined with robust development tool support and a proven track record in field deployments, make it an ideal choice for engineers seeking a dependable FPGA solution.
For more information about implementing the XC2S200-6FGG860C in your next design, consult the complete datasheet, reference AMD Xilinx documentation, or connect with authorized Xilinx FPGA distributors for pricing and availability.
