The XC2S200-6FGG858C is a powerful field programmable gate array (FPGA) from the renowned Spartan-II family, manufactured by Xilinx (now AMD). This advanced programmable logic device delivers exceptional performance with 200,000 system gates, 5,292 logic cells, and an 858-ball Fine-Pitch Ball Grid Array (FBGA) package, making it an ideal solution for high-density applications requiring maximum I/O capability.

Built on advanced 0.18µm CMOS technology, the XC2S200-6FGG858C FPGA operates at a core voltage of 2.5V and features a -6 speed grade for commercial temperature applications. This versatile programmable device offers designers the flexibility of FPGA technology combined with the performance characteristics needed for demanding digital signal processing, communications infrastructure, and industrial control applications.

Key Technical Specifications

Core Features and Architecture

Memory and I/O Resources

Advanced Performance Characteristics

High-Speed Operation

The XC2S200-6FGG858C FPGA supports system performance up to 200 MHz, enabling high-speed data processing for time-critical applications. The -6 speed grade ensures optimized timing performance with minimal propagation delays, making this device suitable for:

• High-bandwidth communication systems
• Real-time signal processing applications
• Fast data acquisition and control systems
• Protocol conversion and bridge implementations

Flexible I/O Architecture

The 858-ball FBGA package provides the highest I/O count available in the XC2S200 family, offering designers maximum flexibility for complex interface requirements. This large pin count supports:

• Multiple simultaneous communication protocols
• Extensive peripheral connectivity
• High-density board-to-board interconnections
• Memory controller implementations with wide data buses

Package Information: 858-Ball FBGA

Package Advantages

The FGG858 package designation indicates a Fine-pitch ball Grid array with 858 balls, offering the most extensive pinout in the Spartan-II XC2S200 series. This package is particularly valuable for applications requiring numerous I/O connections while maintaining a manageable board footprint.

Application Areas for XC2S200-6FGG858C

Communications and Networking

The XC2S200-6FGG858C excels in communication infrastructure applications where multiple high-speed interfaces must operate simultaneously:

• Network switches and routers
• Telecommunication base stations
• Protocol converters and bridges
• Data encryption and security processors
• SDH/SONET equipment
• Wireless infrastructure components

Industrial Automation and Control

Industrial environments benefit from the FPGA’s robust architecture and reprogrammability:

• Programmable Logic Controllers (PLCs)
• Motor control systems
• Process control and monitoring
• Factory automation equipment
• Robotics control interfaces
• Machine vision systems

Test and Measurement Equipment

The high I/O count and flexible architecture make the XC2S200-6FGG858C ideal for instrumentation:

• Multi-channel data acquisition systems
• Logic analyzers and protocol analyzers
• Signal generators and arbitrary waveform generators
• Oscilloscope digital signal processing
• Automated test equipment (ATE)

Medical and Scientific Instruments

Medical device manufacturers leverage FPGA flexibility for:

• Diagnostic imaging equipment
• Patient monitoring systems
• Laboratory analysis instruments
• Medical ultrasound processing
• DNA sequencing equipment

Technical Advantages Over Competing Solutions

FPGA Benefits vs. ASIC Technology

Spartan-II Family Advantages

The Spartan-II architecture offers compelling benefits for cost-sensitive applications:

• Cost-Effective Design: Maximum features per dollar in its class
• Proven Architecture: Based on reliable Virtex™ series technology
• Comprehensive Tool Support: Full Xilinx ISE design suite compatibility
• Multiple Package Options: Flexibility to match I/O requirements
• Backward Compatible: Easy migration within Spartan family

Design Resources and Development Support

Programming and Configuration

The XC2S200-6FGG858C supports multiple configuration modes:

• JTAG boundary-scan programming
• Master Serial mode
• Slave Serial mode
• SelectMAP parallel configuration
• Master and Slave SelectMAP modes

Design Tools Compatibility

Power Consumption Considerations

The XC2S200-6FGG858C operates efficiently at 2.5V core voltage, with power consumption varying based on:

• Clock frequency and usage
• I/O toggle rates and standards
• Logic utilization percentage
• Block RAM usage patterns
• DLL activation status

Typical power consumption ranges from 500mW to 2W depending on application complexity and operating conditions. Designers should utilize Xilinx XPower tools for accurate power estimation during the design phase.

Comparison with Related Spartan-II Devices

XC2S200 Package Options Comparison

The FGG858 package offers the highest I/O capability in the XC2S200 lineup, making it the optimal choice when your design requires extensive external connectivity or multiple simultaneous interfaces.

Ordering Information and Nomenclature

Part Number Breakdown: XC2S200-6FGG858C

• XC = Xilinx product identifier
• 2S = Spartan-II family
• 200 = 200,000 system gates
• -6 = Speed grade (commercial temperature)
• FGG = Fine-pitch BGA with lead-free option
• 858 = 858-ball package
• C = Commercial temperature range (0°C to +85°C)

Quality and Reliability Standards

The XC2S200-6FGG858C meets stringent quality standards:

• RoHS compliant (lead-free FGG package)
• Manufactured under ISO 9001 certified processes
• Automotive-grade screening available
• Extended temperature variants for industrial use
• Comprehensive reliability testing and qualification

Integration and PCB Design Guidelines

Layout Considerations for 858-Ball FBGA

When designing PCBs for the XC2S200-6FGG858C, consider:

1. Ball Pitch: Fine-pitch BGA requires controlled impedance routing
2. Layer Stack-Up: Minimum 6-layer PCB recommended
3. Thermal Management: Adequate copper pour for heat dissipation
4. Decoupling: Multiple decoupling capacitors near power pins
5. Signal Integrity: Differential pair routing for high-speed signals
6. Power Distribution: Dedicated power planes for core and I/O

Recommended Support Components

• Configuration PROM or Flash memory
• Multiple 100nF ceramic decoupling capacitors
• Bulk electrolytic capacitors for power supply
• Crystal oscillator or clock source
• JTAG programming header
• Power supply regulators (2.5V, 3.3V, others as needed)

Performance Optimization Strategies

Maximizing FPGA Utilization

To achieve optimal performance from your XC2S200-6FGG858C design:

• Register All Outputs: Improve timing closure
• Use Block RAM Efficiently: Free up distributed RAM for logic
• Clock Domain Crossing: Implement proper synchronization
• Resource Sharing: Multiplex functions to reduce area
• Pipeline Critical Paths: Break long combinatorial chains
• Utilize DLLs: Generate multiple clock frequencies from single source

Migration Path and Scalability

The XC2S200-6FGG858C provides excellent scalability options within the Spartan family:

Upgrade Path

• XC2S300: For designs requiring more logic resources
• XC3S200: Next-generation Spartan-3 with enhanced features
• Spartan-6 Series: Modern architecture with lower power

Downgrade Path

• XC2S150: Reduced logic for simpler applications
• XC2S100: Entry-level option for cost optimization

Why Choose Xilinx FPGA Solutions?

Xilinx has established itself as the industry leader in programmable logic solutions for over three decades. The Spartan-II family represents a perfect balance of performance, features, and cost-effectiveness for a wide range of applications. The XC2S200-6FGG858C specifically addresses the needs of designers requiring maximum I/O connectivity combined with substantial logic resources.

Whether you’re developing communication systems, industrial controllers, medical devices, or test equipment, the XC2S200-6FGG858C delivers the flexibility and performance your application demands. With comprehensive development tool support, extensive documentation, and a proven track record in thousands of deployed systems worldwide, this FPGA provides a reliable foundation for your next project.

Frequently Asked Questions

What is the maximum operating frequency of the XC2S200-6FGG858C?

The XC2S200-6FGG858C supports system performance up to 200 MHz, with actual achievable frequency depending on design complexity and routing constraints. The -6 speed grade ensures optimized timing performance for commercial temperature applications.

How many I/O pins are available in the 858-ball package?

The FGG858 package provides access to the maximum number of user I/O pins in the XC2S200 family, with up to 512 I/O pins available depending on configuration requirements and dedicated pin usage.

What development tools are compatible with this FPGA?

The XC2S200-6FGG858C is fully supported by Xilinx ISE Design Suite, including synthesis, implementation, and programming tools. Third-party tools like Synplify, Precision RTL, and various simulators are also compatible.

Can the XC2S200-6FGG858C be reprogrammed in the field?

Yes, this FPGA supports in-system programming through JTAG and other configuration modes, allowing field updates and design modifications without hardware replacement.

What is the difference between FG and FGG packages?

The “FGG” designation indicates a lead-free (RoHS compliant) Fine-pitch Ball Grid Array package, while “FG” denotes the standard leaded version. Both offer identical functionality, with FGG meeting modern environmental requirements.

Summary and Conclusion

The XC2S200-6FGG858C represents an excellent choice for designers requiring a high-performance FPGA with maximum I/O capability. Its 858-ball FBGA package provides the most extensive connectivity options in the Spartan-II XC2S200 family, while maintaining the cost-effectiveness and reliability that made the Spartan series successful.

With 200,000 system gates, 5,292 logic cells, and comprehensive design tool support, this FPGA delivers the flexibility needed for complex digital designs across communications, industrial, medical, and instrumentation applications. The proven Spartan-II architecture, combined with Xilinx’s extensive ecosystem of IP cores, development boards, and technical support, ensures project success from prototype to production.

For designers seeking a cost-effective, high-performance FPGA solution with maximum I/O density, the XC2S200-6FGG858C stands as a compelling choice that balances features, performance, and value.