The XC2S200-6FGG852C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s proven Spartan-II family, designed to deliver exceptional performance and reliability for complex digital design applications. This industrial-grade programmable logic device combines 200,000 system gates with advanced packaging technology, making it an ideal solution for telecommunications, industrial automation, embedded systems, and high-performance computing applications.
Key Technical Specifications of XC2S200-6FGG852C
Core Architecture and Logic Resources
| Specification |
Value |
| System Gates |
200,000 gates |
| Logic Cells |
5,292 logic cells |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Technology Node |
0.18μm CMOS process |
| Core Voltage |
2.5V |
Package Specifications: FGG852 Fine-Pitch Ball Grid Array
| Package Feature |
Specification |
| Package Type |
852-ball Fine-Pitch BGA (FBGA) |
| Total Pin Count |
852 pins |
| Package Designation |
FGG852 |
| Mounting Type |
Surface Mount Technology (SMT) |
| Ball Pitch |
Fine-pitch grid configuration |
| Thermal Performance |
Enhanced heat dissipation capabilities |
Performance Characteristics
| Performance Metric |
Value |
| Speed Grade |
-6 (highest performance grade) |
| Maximum Operating Frequency |
Up to 263 MHz |
| Temperature Range |
Commercial (0°C to +85°C) |
| Configuration Time |
Fast programming capability |
Advanced Features of XC2S200-6FGG852C FPGA
High-Density Interconnect Technology
The XC2S200-6FGG852C features Xilinx’s advanced Spartan-II architecture with hierarchical routing resources that enable efficient signal distribution across the chip. The device incorporates configurable logic blocks (CLBs) surrounded by programmable input/output blocks (IOBs), providing maximum design flexibility and performance optimization.
Integrated Memory Resources
The FPGA includes dual-column block RAM architecture positioned strategically across the die, offering 56 Kbits of dedicated memory storage. Additionally, the device provides 75,264 bits of distributed RAM within the CLB structure, enabling flexible memory implementation for buffering, FIFO operations, and lookup table applications.
Clock Management System
Four Delay-Locked Loops (DLLs) positioned at each corner of the die provide precise clock distribution and phase alignment. This advanced clock management system ensures reliable timing across high-speed digital designs and supports multiple clock domains with minimal skew.
Versatile I/O Capabilities
With 284 maximum user I/O pins, the XC2S200-6FGG852C offers extensive connectivity options for interfacing with external components. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, and various differential signaling standards, ensuring compatibility with diverse system architectures.
Applications and Use Cases for XC2S200-6FGG852C
Telecommunications and Networking
The XC2S200-6FGG852C excels in telecommunications applications requiring high-speed data processing and protocol implementation. Its substantial gate count and I/O resources make it suitable for:
- Network packet processing and routing
- Protocol conversion and bridging
- Digital signal processing for communication systems
- Base station control and management
- Data encryption and security processing
Industrial Automation and Control
Industrial applications benefit from the FPGA’s reliability and reconfigurability:
- Motor control and drive systems
- Process automation controllers
- Machine vision and inspection systems
- Programmable logic controllers (PLCs)
- Sensor interface and data acquisition
Embedded Systems Development
The device serves as an excellent platform for embedded system designers:
- Custom processor implementations
- System-on-chip (SoC) development
- Hardware acceleration modules
- Interface bridging and conversion
- Real-time control applications
Medical and Scientific Instrumentation
High-reliability applications in medical and scientific fields utilize the XC2S200-6FGG852C for:
- Medical imaging equipment
- Diagnostic instrumentation
- Laboratory automation systems
- Data acquisition and analysis
- Patient monitoring devices
Design and Development Resources
Software Tools and Development Environment
Xilinx ISE Design Suite provides comprehensive development tools for the XC2S200-6FGG852C, including:
- Synthesis and implementation tools
- Timing analysis and optimization
- Pin planning and I/O configuration
- Bitstream generation and programming
- Simulation and verification capabilities
IP Core Library Support
The FPGA supports extensive IP core libraries including:
- Soft processor cores (MicroBlaze)
- Communication protocol controllers
- DSP functions and filters
- Memory controllers and interfaces
- Standard peripheral interfaces
Programming and Configuration Options
Multiple configuration modes ensure flexible deployment:
- Master Serial mode
- Slave Serial mode
- Slave Parallel mode
- JTAG boundary scan programming
- Non-volatile configuration memory support
Advantages of Choosing XC2S200-6FGG852C
Cost-Effective Alternative to ASICs
The XC2S200-6FGG852C eliminates the high non-recurring engineering (NRE) costs associated with custom ASICs while providing comparable performance. Field programmability allows design updates and bug fixes without hardware replacement, significantly reducing development risk and time-to-market.
Scalability and Design Migration
Pin compatibility within the Spartan-II family enables easy design migration as project requirements evolve. Designers can start with smaller devices and scale up to the XC2S200-6FGG852C without PCB redesign when additional resources are needed.
Proven Reliability and Quality
Built on mature 0.18μm CMOS technology, the device offers excellent reliability characteristics with low defect rates and predictable performance across operating conditions. The robust design ensures long-term availability for production applications.
Technical Comparison Table
XC2S200 Package Options Comparison
| Package Type |
Pin Count |
Typical Applications |
Board Space |
| PQ208 |
208 |
Cost-sensitive designs |
Medium |
| FG256 |
256 |
Compact embedded systems |
Small |
| FG456 |
456 |
General-purpose applications |
Medium |
| FGG852 |
852 |
High I/O density requirements |
Large |
Spartan-II Family Performance Comparison
| Device |
System Gates |
Logic Cells |
CLBs |
Max User I/O |
Block RAM |
| XC2S50 |
50,000 |
1,728 |
384 |
176 |
32 Kbits |
| XC2S100 |
100,000 |
2,700 |
600 |
176 |
40 Kbits |
| XC2S150 |
150,000 |
3,888 |
864 |
260 |
48 Kbits |
| XC2S200 |
200,000 |
5,292 |
1,176 |
284 |
56 Kbits |
PCB Design Considerations for XC2S200-6FGG852C
Layout Guidelines
The 852-pin FBGA package requires careful PCB design attention:
- Multi-layer board construction (minimum 6-8 layers recommended)
- Dedicated power and ground planes for noise reduction
- Controlled impedance routing for high-speed signals
- Adequate via structures for thermal management
- Proper decoupling capacitor placement near power pins
Power Supply Requirements
| Supply Rail |
Voltage |
Current Requirement |
Application |
| VCCINT |
2.5V ± 5% |
Device dependent |
Core logic power |
| VCCO |
1.5V – 3.3V |
Bank dependent |
I/O buffer power |
| VCCAUX |
2.5V |
Low current |
DLL and auxiliary circuits |
Thermal Management
The FGG852 package provides excellent thermal characteristics with multiple ground balls for heat dissipation. Recommended thermal management includes:
- Thermal vias under the package for heat transfer
- Heat sink attachment for high-power applications
- Adequate airflow in enclosed systems
- Junction temperature monitoring during operation
Quality Standards and Compliance
Environmental and Regulatory Compliance
The XC2S200-6FGG852C meets stringent industry standards:
- RoHS compliant (lead-free option with “G” designation)
- REACH regulation compliant
- Halogen-free packaging options available
- Conflict minerals reporting program compliance
Quality and Reliability Testing
Comprehensive testing ensures product reliability:
- 100% functional testing at manufacturing
- Temperature cycling and burn-in screening
- Electrical parameter characterization
- Long-term reliability qualification
Procurement and Availability
Authorized Distribution Channels
The XC2S200-6FGG852C is available through authorized Xilinx distributors worldwide. For genuine components and technical support, always purchase through:
- Authorized electronic component distributors
- Xilinx direct sales channels
- Verified online suppliers with proper certifications
- Regional sales representatives
Packaging and Handling Requirements
Standard packaging protections include:
- Anti-static tray packaging for moisture protection
- Moisture Sensitivity Level (MSL) classification
- Proper storage conditions to maintain reliability
- ESD protection during handling and assembly
Why Choose XC2S200-6FGG852C for Your Next Project?
Optimal Performance-to-Cost Ratio
The XC2S200-6FGG852C delivers outstanding value by combining high gate density, extensive I/O resources, and proven reliability at a competitive price point. The device strikes an ideal balance for medium to large-scale FPGA applications without the premium cost of higher-end families.
Extensive Design Support and Documentation
Comprehensive technical documentation supports successful implementation:
- Detailed datasheets with electrical specifications
- Application notes for common design scenarios
- Reference designs and evaluation boards
- Active user community and technical forums
Long-Term Product Availability
As part of the established Spartan-II family, the XC2S200-6FGG852C benefits from AMD Xilinx’s commitment to long product lifecycles, ensuring component availability for multi-year production programs.
Getting Started with XC2S200-6FGG852C Development
Initial Design Steps
- Requirements Analysis: Define system specifications, I/O requirements, and performance targets
- Tool Setup: Install Xilinx ISE Design Suite and obtain necessary licenses
- Design Entry: Create HDL code (VHDL/Verilog) or schematic entry
- Synthesis and Implementation: Compile design and map to FPGA resources
- Timing Analysis: Verify timing constraints and optimize critical paths
- Programming: Generate configuration bitstream and program device
Design Resources and Support
Access comprehensive development resources:
- Xilinx technical support portal
- Design examples and reference projects
- Training webinars and tutorials
- Third-party IP core providers
- Developer community forums
For detailed technical specifications and to explore the complete Xilinx FPGA product portfolio, consult authorized distributors and AMD Xilinx documentation resources.
Conclusion
The XC2S200-6FGG852C represents a compelling FPGA solution for engineers and designers seeking high-performance programmable logic with extensive I/O capabilities. Its 852-pin FBGA package, combined with 200,000 system gates and comprehensive development tool support, makes it an excellent choice for demanding applications across telecommunications, industrial, medical, and embedded systems markets. With proven reliability, cost-effectiveness, and field programmability, the XC2S200-6FGG852C continues to serve as a versatile platform for innovation in digital design.
