The XC2S200-6FGG851C is a premium field-programmable gate array (FPGA) from the renowned Spartan-II family, manufactured by Xilinx (now AMD). This powerful FPGA combines exceptional processing capabilities with a high-density 851-ball Fine-pitch Ball Grid Array (FGG) package, making it an ideal solution for demanding industrial, commercial, and embedded applications. With 200,000 system gates and 5,292 logic cells, the XC2S200-6FGG851C delivers outstanding performance for complex digital designs.
Key Features and Specifications
Core Technical Specifications
| Specification |
Value |
| Part Number |
XC2S200-6FGG851C |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Maximum User I/O |
284 pins |
| Speed Grade |
-6 (High performance) |
| Core Voltage |
2.5V |
| Technology Node |
0.18μm CMOS |
| Package Type |
851-Ball Fine-pitch BGA (FGG851) |
| Operating Temperature |
Commercial (0°C to +85°C) |
Advanced Architecture Features
The XC2S200-6FGG851C integrates cutting-edge architectural elements that distinguish it from other FPGA solutions:
- Configurable Logic Blocks (CLBs): 1,176 CLBs arranged in a 28×42 array provide extensive logic implementation flexibility
- Delay-Locked Loops (DLLs): Four DLLs positioned at die corners enable precise clock management and signal synchronization
- Dual-Port Block RAM: Distributed memory blocks support high-speed data buffering and storage operations
- Versatile I/O Blocks: Supports multiple I/O standards including LVTTL, LVCMOS, PCI, and GTL+
- IEEE 1149.1 JTAG Boundary Scan: Built-in testing and programming capabilities
Package Information: 851-Ball Fine-Pitch BGA
FGG851 Package Advantages
| Package Feature |
Specification |
Benefit |
| Ball Count |
851 balls |
Maximum I/O density and routing flexibility |
| Ball Pitch |
Fine-pitch configuration |
Compact footprint for space-constrained designs |
| Package Type |
BGA (Ball Grid Array) |
Superior thermal performance and electrical characteristics |
| I/O Availability |
284 user I/O pins |
Extensive connectivity for complex interfacing requirements |
| Thermal Performance |
Enhanced heat dissipation |
Reliable operation in demanding environments |
| PCB Compatibility |
Standard BGA mounting |
Industry-standard assembly processes |
The 851-ball configuration offers the highest I/O count available for the XC2S200 device family, making the XC2S200-6FGG851C particularly suitable for applications requiring extensive external connectivity and high-speed data interfaces.
Performance Characteristics
Speed Grade -6 Performance
The -6 speed grade designation indicates this FPGA is optimized for maximum performance within the Spartan-II family:
| Performance Metric |
Value |
| Operating Frequency |
Up to 263 MHz |
| Logic Delay |
Optimized for high-speed operation |
| Clock-to-Out Time |
Minimized for fast response |
| Setup and Hold Times |
Tightly specified for reliable operation |
| Temperature Range |
Commercial (0°C to +85°C) |
Memory Architecture
| Memory Type |
Capacity |
Configuration |
| Distributed RAM |
75,264 bits |
Flexible, embedded within CLBs |
| Block RAM |
56K bits (57,344 bits) |
Dual-port, synchronous operation |
| Total Memory |
132,608 bits |
Combined distributed and block RAM |
| RAM Organization |
Configurable |
Supports various width and depth configurations |
Application Areas
Industrial Automation and Control
The XC2S200-6FGG851C excels in industrial environments where reliability and performance are critical:
- Motor control systems with precise PWM generation
- Process control and monitoring equipment
- Factory automation controllers
- Programmable logic controllers (PLC) replacements
- Real-time data acquisition systems
Communication Systems
High-speed data processing capabilities make this FPGA ideal for communication infrastructure:
- Network protocol implementation (Ethernet, CAN, USB)
- Data encoding and decoding systems
- Signal processing for telecommunications
- Base station controllers
- Wireless communication modules
Digital Signal Processing (DSP)
The XC2S200-6FGG851C provides robust DSP capabilities:
- Audio processing and synthesis
- Video signal processing and filtering
- Image processing algorithms
- Software-defined radio (SDR) implementations
- Sensor data processing
Medical and Instrumentation
Precision and reliability make this FPGA suitable for medical devices:
- Medical imaging systems
- Patient monitoring equipment
- Diagnostic instrumentation
- Laboratory test equipment
- Precision measurement devices
Consumer Electronics
Cost-effective programmability enables rapid product development:
- High-definition video processing
- Gaming console controllers
- Set-top box implementations
- Display controllers
- Interface bridging circuits
Technical Advantages
Programmability and Flexibility
Unlike traditional ASICs, the XC2S200-6FGG851C offers significant advantages:
- In-System Reconfiguration: Update logic functionality without hardware changes
- Rapid Prototyping: Accelerate development cycles with instant design iterations
- Cost-Effective Development: Eliminate expensive mask charges and NRE costs
- Design Reusability: Leverage IP cores across multiple projects
- Future-Proof Design: Adapt to changing requirements through reprogramming
Design Resources and Memory
| Resource Type |
Quantity |
Typical Applications |
| 4-Input LUTs |
10,584 |
Boolean logic implementation |
| Flip-Flops |
10,584 |
Sequential logic and registers |
| Multiplexers |
Abundant |
Signal routing and selection |
| Carry Logic |
Fast carry chains |
High-speed arithmetic operations |
| Clock Resources |
4 DLLs + global buffers |
Clock distribution and management |
Development and Design Tools
ISE Design Suite Support
The XC2S200-6FGG851C is fully supported by Xilinx ISE (Integrated Software Environment):
- Schematic and HDL entry (VHDL, Verilog)
- Synthesis and optimization tools
- Place and route algorithms optimized for Spartan-II
- Timing analysis and constraint validation
- BitGen configuration file generation
Programming and Configuration
Multiple configuration methods provide flexibility:
- JTAG boundary scan programming
- Master Serial mode configuration
- Slave Serial mode configuration
- SelectMAP parallel configuration
- Configuration PROM support
Comparison with Related Devices
Spartan-II Family Positioning
| Device |
System Gates |
Logic Cells |
User I/O (FGG Package) |
Block RAM |
| XC2S100 |
100,000 |
2,700 |
N/A |
40K |
| XC2S150 |
150,000 |
3,888 |
260 |
48K |
| XC2S200 |
200,000 |
5,292 |
284 |
56K |
| XC2S300E |
300,000 |
6,912 |
329 |
72K |
Package Options for XC2S200
| Package |
Ball/Pin Count |
User I/O |
Dimensions |
Best For |
| PQ208 |
208 pins |
140 |
PQFP |
Lower I/O requirements |
| FG256 |
256 balls |
176 |
17x17mm BGA |
Moderate density |
| FGG851 |
851 balls |
284 |
Large BGA |
Maximum I/O density |
Design Considerations
Thermal Management
For reliable operation of the XC2S200-6FGG851C:
- Ensure adequate PCB thermal vias beneath BGA package
- Consider heat sink attachment for high-utilization designs
- Monitor junction temperature during operation
- Implement proper air flow in enclosure design
- Calculate power dissipation based on resource utilization
PCB Layout Guidelines
Critical considerations for FGG851 package layout:
- Use controlled impedance traces for high-speed signals
- Implement proper power plane decoupling
- Follow Xilinx recommended via patterns for BGA escape routing
- Maintain minimum trace spacing per package specifications
- Include test points for critical signals
- Plan for JTAG programming access
Power Supply Design
| Supply Rail |
Voltage |
Function |
Decoupling Requirements |
| VCCINT |
2.5V ±5% |
Core logic power |
Multiple 0.1μF and 10μF capacitors |
| VCCO |
1.8V to 3.3V |
I/O bank power |
Per-bank decoupling |
| GND |
0V |
Ground reference |
Low-impedance ground plane |
Quality and Reliability
Manufacturing Standards
The XC2S200-6FGG851C meets stringent quality requirements:
- Commercial temperature grade operation (0°C to +85°C)
- Industry-standard BGA package assembly
- RoHS compliance options available (check specific ordering codes)
- Comprehensive electrical testing and screening
- Long-term product availability from authorized distributors
Reliability Features
- Built-in CRC configuration verification
- Enhanced ESD protection on all I/O pins
- Robust power-on reset circuitry
- Glitch-free clock switching with DLLs
- Proven 0.18μm CMOS process technology
Getting Started with XC2S200-6FGG851C
Development Resources
Engineers can access comprehensive resources for the Xilinx FPGA platform:
- Complete datasheets and technical reference manuals
- Application notes and design examples
- HDL reference designs and IP cores
- Power estimation tools and calculators
- PCB layout guidelines and footprint libraries
Ordering Information
When ordering the XC2S200-6FGG851C, verify the complete part number:
- XC2S200: Device family and density
- -6: Speed grade (highest performance)
- FGG851: Package type (851-ball fine-pitch BGA)
- C: Commercial temperature range (0°C to +85°C)
Lead-Free Options
For RoHS-compliant designs, look for the “G” designation:
- XC2S200-6FGG851I: Industrial temperature range (-40°C to +100°C)
- Lead-free (Pb-free) versions available with special marking
Competitive Advantages
Why Choose XC2S200-6FGG851C?
- Highest I/O Count: 284 user I/O pins provide maximum connectivity in the XC2S200 family
- Proven Architecture: Spartan-II reliability with thousands of successful designs
- Cost-Effective Solution: Avoid ASIC NRE costs while maintaining performance
- Extensive Tool Support: Industry-standard Xilinx ISE design tools
- Broad Availability: Well-established supply chain and distributor network
- Field Upgradability: Update designs remotely without hardware replacement
- Comprehensive Documentation: Extensive technical resources and application support
Summary
The XC2S200-6FGG851C represents an optimal choice for engineers requiring high-performance FPGA capabilities with maximum I/O flexibility. Its 851-ball BGA package, combined with 200,000 system gates and speed grade -6 performance, makes it suitable for the most demanding digital design applications across industrial, communication, medical, and consumer electronics markets.
With comprehensive development tool support, proven reliability, and the flexibility inherent in FPGA technology, the XC2S200-6FGG851C enables rapid product development while maintaining the performance and features typically associated with custom ASIC designs. Whether you’re developing next-generation communication systems, industrial controllers, or complex signal processing applications, the XC2S200-6FGG851C provides the resources, performance, and scalability required for success.
For detailed technical specifications, application notes, and design resources for the XC2S200-6FGG851C and other Xilinx FPGA solutions, consult the official datasheets and reference documentation available through authorized distributors and Xilinx technical support channels.
